芯片测试原理

EnablingaMicroelectronicWorld®ICTestFundamentalGongXiao-Long2013©2011AmkorTechnology,Inc.AmkorProprietaryBusinessInformation20.2.12,USERIDCourseContentsLesson1:OverviewofICTestLesson2:Open/ShortandDCtestLesson3:FunctionalTestLesson4:TestVectorbasicLesson5:ADC/DACLesson6:ACtestingLesson7:Scan/Bist/JtagtestingLesson8:RFtestingLesson9:TestprogramDevelopmentLesson10:TroubleShooting©2011AmkorTechnology,Inc.AmkorProprietaryBusinessInformation20.2.12,USERIDLesson1:OverviewofICTestTestcategoryTheTestSystemPMUPE-Card©2011AmkorTechnology,Inc.AmkorProprietaryBusinessInformation20.2.12,USERIDTestcategoryWaferTest—Thetestingofindividualdeviceswhentheyarestillinwaferform.Thisisthefirstattemptatseparatinggooddicefrombad.Thisactivityisalsocalledwafersortordiesort.PackageTest—Wafersarecutintoindividualdiceandeachdieisassembledintoapackage.Thepackageddeviceisthentestedtoinsurethattheassemblyprocesswascorrectlyperformedandtoverifythatthedevicestillmeetsitsdesignspecifications.Packagetestisalsocalledfinaltest.QualityAssuranceTest—Performedonasamplebasistoinsurethatthepackagetestwasperformedcorrectly.DeviceCharacterization—DeviceCharacterizationistheprocessofdeterminingtheoperatingextremesofindividualdeviceparameters.Pre/PostBurn-In—Thetestingofdevicesbeforeandaftertheyareburnedintoverifythattheprocessdidnotcausecertainparameterstodrift.Thisprocessweedsoutinfantmortalitydevices(thosewhichhaveadefectthatcausesthemtofailsoonaftertheyarefirstused)..©2011AmkorTechnology,Inc.AmkorProprietaryBusinessInformation20.2.12,USERIDMilitaryTesting—Involvesperformingrigoroustestingoveratemperaturerangeanddocumentingtheresults.IncomingInspection—Testingofdevicesbyacustomertoinsurethequalityofthedevicespurchasedbeforeusingtheminanapplication.AssemblyVerification—Verifiesthatthedevicessurvivedtheassemblyprocessandthattheywereassembledcorrectly.Thetestsperformedduringassemblyverificationaresimilartothatofpackagetestingandmaybeasubsetofpackagetesting.Thisactivityisusuallyperformedoffshore.FailureAnalysis—Theprocessofanalyzingdevicefailurestodeterminewhythedevicefailed.Determiningthecauseofafailureyieldsinformationthatcanimprovedevicereliability.Testcategory©2011AmkorTechnology,Inc.AmkorProprietaryBusinessInformation20.2.12,USERIDTheTestSystemThetestsystemiselectronicandmechanicalhardwareusedtosimulatetheoperatingconditionsthataDUTwillexperiencewhenusedinanapplication,sothatdefectivedevicescanbefound.ThetestsystemisoftenknownasATEorAutomatedTestEquipment.Thetestsystemhardwareiscontrolledbyacomputerwhichexecutesasetofinstructions(thetestprogram).Thetestermustpresentthecorrectvoltages,currents,timingsandfunctionalstatestotheDUTandmonitortheresponsefromthedeviceforeachtest.Thetestsystemthencomparestheresultofeachtesttopre-definedlimitsandapass/faildecisionismade.Atestsystemisactuallyacollectionofpowersupplies,meters,signalgenerators,patterngeneratorsandotherhardwareitemswhichallworkcollectivelyunderonemaincontroller.©2011AmkorTechnology,Inc.AmkorProprietaryBusinessInformation20.2.12,USERIDTheTestSystem©2011AmkorTechnology,Inc.AmkorProprietaryBusinessInformation20.2.12,USERIDTheCPUisthesystemcontroller.Itcontainsthecomputerwhichcontrolsthetestsystemandprovidesameansofmovingdataintoandoutofthetestsystem.Mostnewtestsystemsofferanetworkinterfaceaswellasmagneticmediafordatatransfers.TheharddiskandCPUmemoryareusedtostoreinformationlocally;thevideodisplayandkeyboardareusedbythetestoperatortointeractwiththetestsystem.TheDCsubsystemcontainstheDevicePowerSupplies(DPS),theReferenceVoltageSupplies(RVS)andthePrecisionMeasurementUnit(PMU).TheDPSsuppliesvoltageandcurrenttotheDUTpowerpins(VDD/VCC).TheRVSsuppliesvoltagereferencesforlogic0andlogic1levelstothedriverandcomparatorcircuitrylocatedonthepinelectroniccards.ThesevoltagessetVIL,VIH,VOLandVOH.LessexpensiveandoldertestsystemsmayhavealimitednumberofRVSsupplies,soonlyalimitednumberofinputandoutputlevelscanbeprogrammedatonetime.WhentesterpinssharearesourcesuchastheRVS,thatresourceisconsideredasharedresource.Sometestsystemsaresaidtohaveatesterperpinarchitecturewhichmeansthattheyhavetheabilitytosetinputandoutputlevelsandtimingindependentlyforeachpin.Atesterpin,alsocalledtesterchannel,iscircuitryonthepinelectronicscardwhichsuppliesand/ordetectsvoltage,currentandtimingforoneDUTpin.TheTestSystem©2011AmkorTechnology,Inc.AmkorProprietaryBusinessInformation20.2.12,USERIDEachtestsystemhashighspeedmemory,calledpatternmemoryorvectormemory,tostoretestvectorsortestpatterns.Testpatterns,alsoknownasthetruthtable,representthestatesofinputsandoutputsforthevariouslogicalfunctionsthatthedeviceisdesignedtoperform.Input,ordrive,patternsaresuppliedtotheDUTbythetestsystemfrompatternmemory.Output,orexpect,patternsarecomparedagainsttheresponsefromtheoutputpinsoftheDUT.Duringafunctionaltest,vectorpatternsareappliedtotheDUTandtheDUT'sresponsesaremonitored.IftheexpectedresponsedatadoesnotmatchtheoutputdatafromtheDUT,afunctionalfailureoccurs.Therearetwotypesoftestvectors--parallelvectorsandscanvectors.Manytestsystemssupportbothtype