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engineeredemi,antennaandthermalapplications|FINGERSTOCK,GASKETSANDMETALGROUNDINGPRODUCTSglobalsolutions:localsupport™18743SylvesterCover4/4/064:06PMPage2BERYLLIUMCOPPERSOLUTIONSANDBEYOND.Large-volumerequirementsarereadilymetbyourhigh-speedBrudererpunchpresses.LargebedpressesenableLairdTechnologiestoprocessawidevarietyofmaterialtypesandthicknessestobroadenourmetalscapabilityandoffercustomizedsolutionsfromshielding,groundingornon-EMIapplications.Heat-treating,criticaltoimpartingthespecificmechanicalqualitiestothespringmaterials,iscomputer-controlled.Allheattreatedbatchesarealsoqualitytestedforhardnessandspecifications.Photo-chemicalmachiningproducesextremelyintricateandcomplexpartstoprecisespecificationsandprovidesacost-effectivealternativetotooling.Multi-slidemachinesoffereconomicalproductionoptions.Fromdesigntototallyautomatedassembly,LairdTechnologiesofferscompletecontrolofyourassembledproduct.Ourprecisionplatingdepartmentssupportandstrictlycomplywithenvironmental,healthandsafetystandardswhileofferingawidevarietyofplatingfinishes.Thisenvironment-friendly,aqueousdegreasingunitforremovingstampingoilscleanswithamildalkalinesolution—eliminatingtheneedforchlorinatedsolvents.Berylliumcopperhasremarkablestability,superiortensilestrength,impressivethermalandelectricalconductivity,andhighshieldingattenuationvalues.WhichiswhyLairdTechnologies®offersover250differentconfigurationsofberylliumcoppershielding.Beyondberylliumcopper,wealsooffershieldingandcustom-engineeredstampingsinstainlesssteel,brass,phosphorbronzeandotherspecialalloys.LT-3034Metals_catalog10/8/0410:29AMPage2TABLEOFCONTENTS1.1(S3)SlottedShielding....................2-7SolidTop(S3)SymmetricalSlottedShielding............2-8Clip-OnSymmetricalShielding......................2-9All-PurposeSeries..............................2-10Clip-OnSeries.................................2-11LowProfileHook-OnGasket.......................2-13LowProfileGasket..............................2-13LargeEnclosureSeries...........................2-14Double-SidedContactStrips.......................2-14FoldoverSeries.................................2-15FlexibleLowCompressionSeries...................2-15TwistSeries...................................2-16Clip-OnTwistSeries.............................2-17DividerEdgeShielding...........................2-18CardGuideClip-On.............................2-18Clip-OnPerpendicularShielding....................2-19Clip-OnPerpendicularGroundingStrip...............2-19Clip-OnLongitudinalGroundingStrip................2-20Mini-LongitudinalGroundingGasket................2-20LongitudinalGroundingSeries.....................2-21UltraSoft®GasketSeries..........................2-21BatteryContacts...............................2-22CustomStamping...............................2-24DrawnCanBoardLevelShields....................2-27ContactStrips.................................2-28ContactRings.................................2-32Load/DeflectionData............................2-33ShieldingEffectivenessCharts.....................2-38METALCONNECTORSHIELDSStainlessSteelI/OShielding........................3-1“D”ConnectorShielding..........................3-2SlottedDConnectorShielding......................3-2DINConnectorSeries............................3-3USBConnector.................................3-3IEEE1394HorizontalConnectorGasket..............3-4FiberOpticShield...............................3-5GBICFiberOpticShield...........................3-5CONTACTSCustomDesignContacts..........................4-1StandardDesignContacts.........................4-2CORROSIONOFEMIGASKETS...................5-1Astheworld’sleadingfabricatoroffingerstock,LairdTechnologieshasdevelopedhighlysophisticated,andoftenproprietary,shieldingandgroundingtechnology.Ourinnovationsarenecessarytoachieveoutstandingcombinationsofperformanceparameters.Fromavastselectionofproductconfigurations,platingsandmountingtechniques,toafullrangeoflowcompressionforcerequirementsandhightransferimpedancecharacteristics,thereisaLairdTechnologiesgasketorgroundingproductjustrightforthejob.Dependinguponthemanufacturingprocess,somepartswillbesuppliedwithholesforcleaningandplatingpurposes.Theseholeswillnotaffecttheoverallperformanceoftheproduct.Considertheseimportantfactorsintheselectionofappropriateshieldingproductsforyourdesign:OperatingFrequencyMaterialsCompatibilityCorrosiveConsiderationsCommercialorMilitaryWorldwideComplianceOperatingEnvironme
本文标题:EMI_Fingerstock_Gaskets_and_Metal_Grounding_Produc
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