PMP Sample产品工艺流程图

Rev:Page:11OF3WorkOperationStationInstruction1Materialincoming(IQC)1.appearance2.Electricalcharacter3.SizePacking/weightlist21.PCBcontrol2.Components(BGA,IC)baking(ifneed)1.Bakingtime.2.BakingTemperatureBelowneedtobake:1.PCBover72hrsafterremovalvacuumpackage2.IC,BGAovre72hrsafterremovalvacuumpackage3.PCB&ICappearanceandopen-time&level3BIOSPrograming(ifneed)1.ICP/N,supplier2.Programnameandrevision3.ProgramedBIOSmark4.ConfirmmasterBTPI4Materialpreparation1.P/N2.Description3.LCRPASSmark4.Partsloading5.Marking6.SegregateleadedmaterialandLFmaterialMaterialpreparationbillSMTBOM1.Airpressure2.Vacuumnozzleposition3.Conveyerwidth4.PCBdirection7Solderpastestorage1.Storagetemp2.FIFO3.timeFollowtheSoldercreamMNPasteSolderOM3158Solderpastestiring1.Thawtime2.StirringtimeFollowtheSoldercreamMN1.Programname2.AirpressurePRODUCTPROCESSMANAGEMENTPLANDOCNo.:Updateddate:PRODUCT01ItemFlowManagementItemsPROCESSProductionManagement(Operation/Equipment)5Stickbarcode1.Barcodecontent2.Location&.orientationMPI6.PCBloadingMPISMTControlTable9SolderpasteprintingEquipmentcontrolTable3.Solderpaste613254784.Stencil4.1StencilP/N&Rev4.2StencilThickness4.3Manufacturingmethod5.Stencilcleaning5.1Frequency5.2Stencilautomatic-wiping5.3Stencilmanual-wiping6.FrontSqueegeesettings7.RearSqueegeesettings8.TheGapbetweenPCBandStencil10PrinterEnvironmentalControl1.Temp2.HumidityPrinterEnvironmentalControlMN11Solderthicness&VolumeMeasure1.Thickness&volume:2.Frequency:3.LocationSE300automaticalmanualinstruciton1.IPCStandard&QII2.1time/per10pcs13PCB/Stencilcleaning1.Machineairpressure2.Nosolderrudimental3.CleFollowthePCB/StencilMN1.Programname2.MachineAirpressure3.Partplacement4.ConveyerwidthRev:Page:22OF3WorkOperationStationInstruction1.Programname2.MachineAirpressure9SolderpasteprintingEquipmentcontrolTable12VisualInspectionafterprinting1.Solderpasteappearance:1.1:Insufficientsolder1.2:Shift1.3:Bridge2.Frequency:14ChipMouterEquipmentcontrolTable*.Remark:highlightitemsareCCBitems,shouldrefertoCCBteamifchangethemPRODUCTPROCESSMANAGEMENTPLANDOCNo.:PRODUCT01PROCESSProductionManagement(Operation/Equipment)ItemFlowManagementItems15ICmounterEquipmentcontrolTableNGOK15131491211103.Materialloading4.Trackwidth171.ProgramnamecontrolTable2.Machineparametersettings3.Temperatureprofile4.ProfileMeasureFrequency18TemplateCheck1.ComponentAccuracy2.Missingcomponent3.TemplateQII19VisualInspection1.SolderjointAppearance2.TheComponentsthatnotverifiedbyMDAQII/MPI1.Toolandmaterial2.Repairquality21Materialpreparation1.P/NandAVL2.Description3.Preforming4.PartsloadingMaterialpreparationbill1.PCBdeformation2.ConfirmMPI3.ConveyerspeedandPCBdirection4.Conveyerwidth23VisualInspection1.Appearance2.ComponentfloatingMPI24(1)Fluxtype15ICmounterEquipmentcontrolTable16SMDinspectionMountinginspectionMPI&QIIReflow20Repair(Ifneed)MPI,BOM,Circuitdiagram22ManualinsertingMPIWavesolderingWavesolderovensetingtableOKOKNG151617181920212123OK(2)Solderbar(3)Nozzelpressure(4)Heightofwavesolder(5)Beltspeed(6)Trackangle(7)Pre-heating-1(8)Pre-heating-2(9)Pre-heating-3(10)SolderingTemperature(11)Solderingwavewidth(12)SolderingtimeRev:Page:33OF3WorkOperationStationInstruction(13)Peaktemperatureonbrd(14)Profilemeasurefrequency(15)Trackwidth(16)Requireforstoprunning25SolderjointinspectionSolderjointappearanceQII26Touchup1.Irontypeandtemperature2.Soldertype3.FluxMPI27Floatingcheck&repair1.Componentfloating2.Irontypeandtemperature3.Solderwire4.FluxMPI28Batteryinstallation1.Location2.PolarityMPI29Minijumperfixed1.JumperlocationMPI&MN30*.Remark:highlightitemsareCCBitems,shouldrefertoCCBteamifchangethemWavesolderingWavesolderovensetingtablePRODUCTPROCESSMANAGEMENTPLANFORSMTDOCNo.:PRODUCT01PROCESSProductionManagement(Operation/Equipment)ItemFlowManagementItems25262728292430NGOK2431T/URepair(Ifneed)1.Toolandmaterial2.RepairqualityMPI,BOM,Circuitdiagram32Finalassemblyinspection1.Appearance2.TemplateMPI&QII33AOI1.Testprogram2.Machine3.PalletMPI&MI1.Testprogram2.Testfixture3.Goldensampleself-checking:4.Retestratio&AlphaRatio:5.Vacuumpressure35T/Sguide36CPUinstallation1.LGA775socketinspection2.Location3.Polarity&.orientationMPI&QII37BFT1.TestprogramTPI&MPI2.Testfixture3.Goldensampleself-checking4.RetestRatio&AlphaRatio38BFTRepair(Ifneed)1.Irontemp.2.Fluxpaste3.Solderwire4.CleaningsolT/Sguide34ICTMI&MPIICTRepair(Ifneed)1.Irontemp.2.FluxpasteNGOKNGgoto32OKgoto32323135373834OKNG31333737NGOKgoto3139EndofLineInspection1.Nodamaged,wrongcomponentandotherfailures2.CPUextraction3.LGA775socketinspectionMPI&QII40OQMNodamaged,wrongcomponentandotherfunctionfailuresQII&MPI42Packing1.Packingmaterial2.Box/Cartonlabel/Shippinglabel3.SecretLabelifneeded1.Packingdrawing&MPI2.Labelandpackagespec3.Usedfordoubletapesealed41Packingchecking1)Pallet,packingstandardchecking2)CartonandshippingLabellocationandspecconfirm3)P/NandQtyconfirm*.Remark:highlightitemsareCCBitems,shouldrefertoCCBteamifchangethemSFCScontrolstationFollowthePackingStandardofIntelRequet424041NGOK39goto31Equipment&tools1.LotQt'ylistedonpacking/weightlist2~3.BOMandQVL1062LCRHP426