笔记本NPI从开发到生产

NPI从开发到生产Preparedby:Date：2010-7-262新产品开发流程Goal:•detaildesignincludingeveryitemsinspecificationConceptFeasibilityDesignA-testB-testC-testMPEOLGoal:•functionsimplement•criticalfunctionverificationGoal:•reliabilitytest•solvedcriticalbugsGoal:•productionreadiness•solvedgatingissuesGoal:•secureenoughpartsforguaranteeyears•clearuniquepartsinstockGoal:•deliverproductsintimewithbestqualityprojectkick-offprojecttransferGoal:defineproducttomeet-•marketingtrend•customerrequirement•technologytrend3开发流程-设计阶段ConceptFeasibilityA-testB-testC-testMPEOLGoal:defineproducttomeet-•Marketingtrend•Customerrequirement•TechnologytrendGoal:•Functionsimplement•CriticalfunctionverificationGoal:•Reliabilitytest•SolvedcriticalbugsGoal:•Productionreadiness•SolvedgatingissuesGoal:•Secureenoughpartsforguaranteeyears•ClearuniquepartsinstockDesignGoal:•detaildesigntocheckeveryitemsinspecificationGoal:•Deliverproductsintimewithbestquality4开发流程-设计阶段EECircuitDesignReviewModifyPlacementRoutingGerberoutMEIDDetailDesignMock-upReviewModify•buildnewparts•samplerequest•3Ddesign•samplerequest•materialpreparing•samplerequest•applypartnumber•circuitdrawing•samplerequest•applypartnumber•modifycircuit•createBOM•releaseBOM•modify3Ddesign•review3Ddesign5开发流程-ATestStageConceptFeasibilityDesignB-testC-testMPEOLGoal:defineproducttomeet-•Marketingtrend•Customerrequirement•TechnologytrendA-testGoal:•functionsimplement•criticalfunctionverificationGoal:•Reliabilitytest•SolvedcriticalbugsGoal:•Productionreadiness•SolvedgatingissuesGoal:•Secureenoughpartsforguaranteeyears•ClearuniquepartsinstockGoal:•DetaildesigntocheckeveryitemsinspecificationGoal:•Deliverproductsintimewithbestquality6开发流程-ATestStageEEPCBFab.SMTBringupDebugA-TestModifyMEToolingT1ReviewModifyT2Gerberout•materialpreparing•materialpreparing•PCBA•circuitmodify•modifyBOM•releaseBOM•modify3Ddesign•review3Ddesign•checktoolingstatus•trialshot•trialshot•troubleshooting&verification7开发流程-BTestStageConceptFeasibilityDesignA-testC-testMPEOLGoal:defineproducttomeet-•Marketingtrend•Customerrequirement•TechnologytrendGoal:•Functionsimplement•CriticalfunctionverificationB-testGoal:•reliabilitytest•solvedcriticalbugsGoal:•Productionreadiness•SolvedgatingissuesGoal:•Secureenoughpartsforguaranteeyears•ClearuniquepartsinstockGoal:•DetaildesigntocheckeveryitemsinspecificationGoal:•Deliverproductsintimewithbestquality8开发流程-BTestStageEEPreparationSMTBoardTestFinalAss’yRun-InB-TestMEPreparationPre-Ass’yPre-buildModifyModifyGerberoutT3w/Texture•materialpreparing•materialpreparing•PCBA•troubleshooting•troubleshooting•circuitmodify•releaseECR/ECN•releaseBOM•Modifydrawing•applypartnumber•createBOM•releaseBOM•checkteststatus•verifysolution•pre-ass’y&review9开发流程-CTestStageConceptFeasibilityDesignA-testB-testMPEOLGoal:defineproducttomeet-•Marketingtrend•Customerrequirement•TechnologytrendGoal:•Functionsimplement•CriticalfunctionverificationGoal:•Reliabilitytest•SolvedcriticalbugsC-testGoal:•productionreadiness•solvedgatingissuesGoal:•Secureenoughpartsforguaranteeyears•ClearuniquepartsinstockGoal:•DetaildesigntocheckeveryitemsinspecificationGoal:•Deliverproductsintimewithbestquality10开发流程-CTestStageEEPreparationSMTBoardTestFinalAss’yRun-InC-TestMEPreparationPre-Ass’yPre-buildModifyModifyGerberoutT4•materialpreparing•materialpreparing•PCBA•Troubleshooting•troubleshooting•checkteststatus•verifysolution•releaseECR/ECN•releaseBOM•modifydrawings•circuitmodify•pre-build&review•lasttrialshot•releaseECR/ECN•releaseBOM11开发流程-MPStageConceptFeasibilityDesignA-testB-testC-testEOLGoal:defineproducttomeet-•Marketingtrend•Customerrequirement•TechnologytrendGoal:•Functionsimplement•CriticalfunctionverificationGoal:•Reliabilitytest•SolvedcriticalbugsGoal:•Productionreadiness•SolvedgatingissuesGoal:•Secureenoughpartsforguaranteeyears•ClearuniquepartsinstockGoal:•DetaildesigntocheckeveryitemsinspecificationMPGoal:•deliverproductsintimewithbestquality12开发流程-MPStagePreparationSMTBoardTestFinalAss’yRun-InFAIFCSPEEE/ME•newpartsapproval•releaselimitedquantityfornewpartsbeforeapproved•ReleaseISOdocuments13TheEndTheEnd