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WBCTrainingNotesTonyWinster,AblestikU.K.21June2008Project:TWIR-7FPB92WaferBacksideCoating(WBC)---IntroductionandCapabilitySet-upinChinaYoungXUESr.TechnicalServiceEngineerJuly15,2008XUEYoung---WBCGeneralIntroductionandCapabilitySet-upinChina2BackgroundAblestikintroducesanewlineofspeciallydesignedadhesivesthatcanbeappliedtothebackofawaferanddried.Conductiveandnonconductivewaferbacksidecoatingmaterialshavebeendevelopedfordiesizes3mmorlessandenablesuchpackagetypesasCOL,SO,TSOPandQFN.HighthermalmaterialshavebeendevelopedthataresuitableforuseindiscreteandsmallpowerICdevices.Theadvantagesofthewaferbacksidecoatingprocessare:*Bondlinethicknessandfilletformationcanbecontrolled*Resinbleediseliminated*Moistureresistanceandadhesivestrengthareimproved*WBCmaterialscanachievehigherreliabilitylevelsXUEYoung---WBCGeneralIntroductionandCapabilitySet-upinChina3WBCProcessIntroductionWBCProcessIntroductionXUEYoung---WBCGeneralIntroductionandCapabilitySet-upinChina4WBCProcessOverviewWBCprocessutilizesexistingdownstreamDieAttachinfrastructuWBCprocessutilizesexistingdownstreamDieAttachinfrastructurereandrequiresonlystandard,readilyavailableprintingmachines.andrequiresonlystandard,readilyavailableprintingmachines.XUEYoung---WBCGeneralIntroductionandCapabilitySet-upinChina5WBCMerits-1WBCProcessPasteProcessWBCcanoffersignificantprocessbenefitsatleast20WBCcanoffersignificantprocessbenefitsatleast20--30%cheaperthanfilm.30%cheaperthanfilm.ICApplicationLeadframestandardizationNoneedfordispensing;glueisalreadyon100%ofthechipatthedesiredthicknessImprovedreliabilityregardlessofLDFtypeL1,260cpossibleonAg,Cu,PPFandAolly42ImprovedyieldsReduceddietilt;NobleedingImproveddesignflexibilityTighterdiebondtopadratios;AbilitytochoosethicknessXUEYoung---WBCGeneralIntroductionandCapabilitySet-upinChina6WBCMerits-2WBCcanbedroppedintoexistingsoftsolderandeutecticlines.WBCcanbedroppedintoexistingsoftsolderandeutecticlines.Discrete/SmallSOApplications----Eutecticandsoftsolderishighstress.WBCcanimprovereliabilitybyreducingcracks----EliminateN2orH2forminggassesduetolowertemperaturecureEutectic----ReduceandstandardizebacksidecoatinglayerSoftSolder----Increaselinespeedsby2-3times----Pb-freedieattachsolution(Typicallysoftsolderis95%Pb)XUEYoung---WBCGeneralIntroductionandCapabilitySet-upinChina7WBCWaferBackSideCoatingStencilPrintingScreenPrintingSpinCoatingAblestikhasthreemethodstoachievewaferbacksidecoatingproAblestikhasthreemethodstoachievewaferbacksidecoatingprocess.cess.XUEYoung---WBCGeneralIntroductionandCapabilitySet-upinChina8StencilprintingVacuumtubeSqueegeePalettePaletteStencilprintingismainlywaferbacksidecoatingmethodrecommendedtocustomer.Stencilprintingisabletoprovidesmoothsurface(goodperformanceinroughness)andhasgoodthicknesscontrol.Moreover,itsprocessisstableandeasytocontrol.Stencilprintinghasastrictrequesttoshimandstencilthicknessuniformity.Inaddition,theflatnessofpaletteandsqueegeearekeyfactorsforprintingperformance.XUEYoung---WBCGeneralIntroductionandCapabilitySet-upinChina9StencilForthickercoating(1mil),itistypicallyrecommendedtouseopencutstencils.Opencutisbigopeninginthemetalstencil.Stencilopeningcanselectedbasedontheprintarearequirements.Typicallyopeningwillbe2mmlessthanthewaferdiameter.(Example:198mmopeningfor200mmwafer).Stencilthicknessdependsonthecoatingthicknessrequirement.Forthinnercoating(≤1mil),screensarerecommended.FrameFrameMetalMetalOpeningOpeningXUEYoung---WBCGeneralIntroductionandCapabilitySet-upinChina10ShimShimsarerecommendedtoreducethestencildeflectionduringprinting.Printinguniformityacrossthewaferisimprovedusingshims.Shimismetalsheetwithopeningofwaferdiameter+1milandthicknessequalstothewaferthicknessoralittlerlower.waferStencilMetalShimWaferbacksidematerialwaferStencilMetalShimWaferbacksidematerialXUEYoung---WBCGeneralIntroductionandCapabilitySet-upinChina11SqueegeeRollbarsqueegee(ormetalsqueegeewithreinforcedrodattheedge)isrecommendtoreducethescoopingduringprintingwithbigopeningstencils.Rollbarsqueegeeisnotrecommendedforscreenprinting.Rubbersqueegeesormetalbladearerecommendedforscreenprinting.waferStencilMetalShimWaferbacksidematerialSqueegeeXUEYoung---WBCGeneralIntroductionandCapabilitySet-upinChina12RollBarSqueegeeRollbarsqueegeeisveryrigidanditcanofferperfectflatperformanceascomparedwithmetalbladeandrubbersqueegees.RollbarsqueegeewasdevelopedbyDEKandAblestikTStogether.Anditsdesignwasprotectedbypatent.XUEYoung---WBCGeneralIntroductionandCapabilitySet-upinChina13PaletteVacuumtubeSqueegeePrintingbacksidecoatingonwafersrequiresvacuumchucktomakethewaferstable.Paletteneedstobeverysmoothandflatsoasnottodamagethefrontfaceofthewafer.Besides,theflatnessofpalettewillcauseprintthicknessvariation.Granitepaletteusuallyshowsbetterperformancethanmetalpalette.Butitsweightisreallyhighanditmaycausenegativeeffectonprinter.PalettePaletteXUEYoung---WBCGeneralIntroductionandCapabilitySet-upinChina14SketchofstencilprintingSqueegeePalettePaletteVacuumtubeNoadhesivearoundwaferXUEYoung---WBCGeneralIntroductionandCapabilitySet-
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本文标题：半导体封装刷胶汉高WBCCapabilityinChina
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