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当前位置:首页 > 商业/管理/HR > 质量控制/管理 > 氮化硼基电器用导电陶瓷的制备及性能研究-方振龙
《》201594418,。2090,,[1-3]。,,、[4-5]。Al2O3、SiC、BeOAlN,、,MCM[6-7]。,,,,[6-8]。(h-BN),。TiB2,,TiB2,TiB2,[9-10]。h-BNTiB2,,[11-12]。,h-BNTiB2,。、、,。15μmh-BN(BN),1μmTiB2,1μmY2O3,2μmAlN1μmSi3N4,。A,1,,h-BNTiB23∶1,Y2O3、AlNSi3N41∶4∶4。。,,,120℃。,(,130033):h-BNTiB2,Y2O3、AlNSi3N4,,、、。,h-BN48wt%,TiB216wt%,Y2O34wt%,AlN16wt%,Si3N416wt%,,2.69g·cm-3,139.5MPa,199.7kgf/mm2,595μΩ·cm。:h-BN;TiB2;;;DOI:10.14158/j.cnki.1001-3814.2015.18.032:TB33;TP211:A:1001-3814(2015)18-0111-04StudyonPreparationandPropertiesofBoronNitrideBasedConductiveCeramicFANGZhenlong(ChangchunVocationalInstituteofTechnology,Changchun130033,China)Abstract:Boronnitridebasedconductiveceramicwasfabricatedwithhot-pressingsinteringtechniquebyusingmicroh-BNandTiB2asmainmaterialandY2O3,AlNandSi3N4asadditives.Thepropertiesofbulkdensity,flexuralstrength,hardnessandconductivepropertyweretested.Theresultsshowthatwhenthecontentofmicroh-BNis48wt%,TiB2is16wt%,Y2O3is4wt%,AlNis16wt%andSi3N4is16wt%,thepreparedboronnitridebasedmaterialcanachievethebestproperties.Thebulkdensity,flexuralstrength,hardnessandconductivepropertyofboronnitridebasedconductiveceramicis2.69g·cm-3,139.5MPa,199.7kgf/mm2and595μΩ·cm,respectively.Keywords:microh-BN;microTiB2;grainboundaryphase;hot-pressingsintering;conductiveproperties:2014-09-05:(SZJ2014079):(1976-),,,,;E-mail:252225345@qq.com111HotWorkingTechnology2015,Vol.44,No.181BN(,%)Tab.1Contentsofboronnitridebasedconductiveceramic(wt%)h-BNTiB2Y2O3AlNSi3N4A160.0020.002.228.898.89100A254.0018.003.1112.4412.44100A348.0016.004.0016.0016.00100A442.0014.004.8919.5619.561001725~1850℃,25℃,25MPa,30min。。3mm×4mm×30mm,MKM-4100,,30mm,0.5mm/min。HV-120,50N,10s。RM-5。22.11。,。,,A11725℃2.57g·cm-31825℃2.66g·cm-3,1850℃2.64g·cm-3;A21725℃2.58g·cm-31800℃2.67g.cm-3,1850℃2.64g·cm-3;A31725℃2.59g·cm-31800℃2.69g.cm-3,1850℃2.66g·cm-3;A41725℃2.62g·cm-31775℃2.64g·cm-3,1850℃2.60g·cm-3。1,h-BNTiB2,Y2O3、AlNSi3N4。1800℃A,A12.62g·cm-3,h-BNTiB280%,Y2O3、AlNSi3N420%。h-BNTiB264%,A3,2.69g·cm-3。h-BNTiB256%,A4,2.63g·cm-3。,,,Y2O3,,。,,,。1,1800℃A3。2.22。,,。,,A11725℃118.5MPa1800℃131MPa,1850℃122MPa;A22.702.682.662.642.622.602.582.56172517501775180018251850A1A2A3A4/℃/(g·cm-3)1Fig.1Changingofbulkdensitywithsinteringtemperatureofboronnitridebasedconductiveceramicmaterials2Fig.2Changingofflexuralstrengthwithsinteringtemperatureofboronnitridebasedconductiveceramicmaterials172517501775180018251850A1A2A3A4/℃141138135132129126123120117/MPa112《》2015944183Fig.3ChangingofhardnesswithsinteringtemperatureofboronnitridebasedconductiveceramicmaterialsA1A2A3A4200190180170160150140172517501775180018251850/℃/(kgf·mm-2)1725℃129MPa1800℃133.5MPa,1850℃132MPa;A31725℃129.5MPa1800℃139.5MPa,1850℃133MPa;A41725℃121MPa1775℃132MPa,1850℃130MPa。1,h-BNTiB2,Y2O3、AlNSi3N4。1800℃A,A1131MPa,h-BNTiB280%,Y2O3、AlNSi3N420%。h-BNTiB264%,A3,139.5MPa。h-BNTiB256%,A4,129.5MPa。,,,,。,,,,。,1800℃A3。2.33。,A。,1725℃,A1A4143.5、158、164.5、151kgf/mm2(1kgf/mm2=10MPa)。,A1A41825、1800、18001775℃,178、182、199.7、167kgf/mm2。,h-BNTiB2,1800℃,A1A4176、182、199.7、165.5kgf/mm2。1(1),。,,,,,,。,,,。3,1800℃A3。2.44。,A。1725℃,,A1A41285、1290、1190、1310μΩ·cm。,,A1、A2、A3A41825、1800、1800℃1775℃,630、625、595、770μΩ·cm。,,,A1、A2、A3A41850℃670、710、690、850μΩ·cm。1,h-BNTiB24Fig.4ChangingofconductivepropertywithsinteringtemperatureofboronnitridebasedconductiveceramicmaterialsA1A2A3A4172517501775180018251850/℃14001300120011001000900800700600500/(μΩ·cm)113HotWorkingTechnology2015,Vol.44,No.18,;18N,0.8059m/s,。(3),SiCP/Al,,。:[1]ThomasMP,KingJE,Improvementofthemechanicalpropertiesof2121Al/SiCpMMCplatbyoptimizationofthesolutiontreatment[J].CompositesSci,1996(56):1141-1149.[2],,,.SiCp/Al[J].,1999(2):41-44.[3]GuiMC,HanJM,LiPY.Fabricationandcharacterizationofcastmagnesiummatrixcompositesbyvacuumstircastingprocess[J].JournalofMaterialsEngineeringandPerformance,2003(12):128-134.[4]LadenK,GuérinJD,WatremezM,etal.FrictionalcharacteristicsofAl-SiCcompositebrakediscs[J].Tribologyletters,2000,8(4):237-247.[5],,,.SiC[J].,2006,30(5):62-65.[6].[D].:,2009.[7],,,.SiCp/Al-[J].,2007(6):7-10.[8],,,.[J].,1997,13(1):35-38.(110),Y2O3、AlNSi3N4。1800℃A,A1665μΩ·cm,h-BNTiB280%,Y2O3、AlNSi3N420%。h-BNTiB264%,A3,595μΩ·cm。h-BNTiB256%,A4,815μΩ·cm。,,,,,。,,。,,,,。,,,,。、、、,1800℃、A3,。3(1)h-BN48wt%,TiB216wt%,Y2O34wt%,AlN16wt%,Si3N416wt%,1800℃,,2.69g·cm-3,139.5MPa,199.7kgf/mm2,595μΩ·cm。(2)Y2O3、AlNSi3N4,、、。:[1].[J].,2001(6):36-38.[2],.IC[J].,2002(2):22-24.[3],.[J].,1991,2(2):22-25.[4],,.MDM[J].,1998,9(3):30-33.[5],.28[J].,2001,38(4):35-37.[6],.[J].,2002,37(1):26-34.[7],.[J].,1999,10(2):103-105.[8].[J].,1999,10(4):24-33.[9],.TiB2[J].,1999,20(2):112-117.[10],.TiB2[J].,2004,14(2):7-10.[11],.BN-TiB2[J].,1990,21(1):50-56.[12],,.TiB2-BN[J].,1998,8(2):310-312.114
本文标题:氮化硼基电器用导电陶瓷的制备及性能研究-方振龙
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