Telinksolutions_201411

TelinkZigbeeSolutionsTelinkSemiconductorProprietary2OverviewofZigbeeSolutions•Companystartedwithhighperformance802.15.4chipdevelopmentsince2010–In-house32-bitMCUwithhighperformanceRF/Analogfrontend–3Generationsof15.4ICalready–ContinuousroadmaponZigbeewithlightlinkspecificICexpectedsoon•CompleteportfolioofZigbeeSolution–TelinkSDKwithcompletetoolchainanddebuggingtools–EVBs,Zigbeemodules,referenceapplicationdesigns–CompletefirmwareplatformwithZigbeePRO,ZLL,ZHA,ZID,RF4CE,ZRCsupportsTelinkSemiconductorProprietary3ZigbeePortfolioTLSR8616TLSR8626TLSR8636PackagesQFN48/32QFN56/48/32QFN48/32CORE32bitMCU,Upto48MHz32bitMCU,upto48Mhz32bitMCU,Upto48MHzFlashExternalExternalExternal/Internal512KBRAM16KB8KB16KBInterfacesUART/I2C/SPI/EthernetMAC/SW/USBUART/I2C/SPI/SW/USBUART/I2C/SPI/SWADC/Comparator14-bitADCupto12channelsComparator14-bitADCupto12channelsPWM266LinkBudget104dB102dB106dBTRXPeakCurrent30mA@RXmode30mA@TXMax30mA@Rx28mA@TXmax12mA@RXmode12mA@TX0dBmSleepCurrent1uA1uA1uAMPMPsinceearly2012MPsincelate2012ES2014.7TelinkSemiconductorProprietary4TelinkZigbeeFirmwareStackApplicationZRCZIDZHAZLLSchedulerNetworkLayerRF4CEZigbeeProMACLayerIEEE802.15.4-MACPHYIEEE802.15.4TelinkSemiconductorProprietary5TelinkRF4CEFeatures•ZigbeeAlliancecertifiedRF4CEplatform•SupportbothZIDandZRCprofiles•SupportCablelabRF4CEMSOprofile•SupportZRC2.0profilesTelinkSemiconductorProprietary6SupportedRF4CEProfilesKeyItemsZRC1.0MSOZRC2.0DiscoveryOnlySupportZRC1.0DeviceOnlySupprotMSOdeviceBothZRC1.0andZRC2.0devicePairingYesYesYesConfigurationOptionalMandatoryMandatoryValidationOptionalMandatoryMandatoryExtendedValidationNoNoOptionalAfterBindingFailStayinUnpairStayinUnbondorbacktopreviousbondnodeBacktoprevbondnodeortrybindinganotherfreshnodeMulti-PairingYesYesYesTelinkSemiconductorProprietary7NewFeaturesinZRC2.0KeyItemsZRC1.0MSOZRC2.0LQIFilterinDiscoveryNoYesYesBondingFailProcedureNoYesYesActionBandandActionCodeNoNoYesPollingNoNoYesIdentifyNoNoYesActionmappingNoNoYesEnhancedSecurityNoNoYesBindingProxyNoNoYesTelinkSemiconductorProprietary8BOMComparisonwithCompetitorG•Remotecontrolfeatures:–IRLibraryincludingUniversalNorthAmericaTV–27RFkeysand1LED–RF4CEMSOprofile–2xAAAbatteries•BOMdifferences(withTLSR8626):–Reductionof24componentsTelinkSemiconductorProprietary9BomComparisonwithCompetitorT•Remotecontrolfeatures–IRcontrol–RFkeysandLEDs–RF4CE–2xAAAbattery•BOMdifferences(withTLSR8626)–Reductionof12componentsTelinkSemiconductorProprietary10TelinkZHAFeatures•Integratescontrolandmonitoringfunctionsforsmarthomecontrol,includinglighting,security,occupancy,andmotiondetection•Devicessupported–Genericdevices–Lighting–Closures:Windowcovering,shades–HVAC:heating/cooling,thermostat,varioussensors–IntruderAlarmSystemsTelinkSemiconductorProprietary11TelinkZLLFeatures•MainFunctionalities:–Easystepstostartandmanagealightingnetwork–Controllightingfromremotecontrol,switches/dimmers,sensorsorsmartphone–Controllightsindividuallyoringroups•LightingFeatures:On/Off,Identify,LevelControl,ColorsSpace(XY,HUE/SAT),Group,Scene•RemoteFeatures:Color/Non-colorController,Scene/Non-SceneController,Controlbridge,On/OffSensor•GreatinteroperabilitywithothersolutionsTelinkZigbee/RF4CEDevelopmentKitsTelinkSemiconductorProprietary13TelinkTLSR8626SDKHardwareComponentsTLSR8626EVK–256KBFlash–3genericbuttons,1Flashresetbutton–5LEDlights–USBinterfaceforprogramminganddebuggingTLSR8626USBDongle–256KBFlash–PCBantenna–USBinterfaceforprogramminganddebuggingTelinkSemiconductorProprietary14TelinkTLSR8636SDKHardwareComponentsTLSR8636EVB–256KBFlash–PCBantenna–Buttons,LEDS,andGPIOsTLSR8636USBDongle–256KBFlash–PCBantenna–2buttons,2LEDlightsTelinkSemiconductorProprietary15ReferenceDesignExample–RF4CEMSORemoteControlTLSR8626-basedMSORemoteControl–27buttons–1LED–IRrange10minline-of-sight–RFrange16minline-of-sight–AAAbatteries–Sleepcurrent~1uA–RF4CEMSOprofileTelinkBluetoothLowEnergy(BluetoothSmart)SolutionsTelinkSemiconductorProprietary17TelinkBLEChipHighlightsLowestBOMcost:TelinkBLEmoduleneedonly6offchipcomponents,32kcrystalnotrequiredSupportvoicein/out:digital/analogmicandmonooutHighRFtransmitpower:+8dBmLowpowerconsumption:12mARX/TXoperationcurrent,1uAsleepcurrentTelinkSemiconductorProprietary18TelinkBluetoothLESoCTargetApplication–RemoteControland3Dglasses–Sportsandfitnesstracking–WirelesssensornetworkInterfaces–I/O:SPI,USB,I2C,UART–TLSR8266:upto41/37/22GPIOs–TLSR8266F512:Upto35/20GPIOs–VoiceIn:DigitalandAnalogMic.–Voiceout:SDM(mono)–PWM:Upto6channelPerformance–RFSensitivity:-92dBm@1Mbps–Power:TX12mA@0dBm;RX12mA–MaxRFpower:8dBmPackage–TLSR8266:QFN32/48/56–TLSR8266F512:QFN32/48Features32bitMCU,upto48MHz–External128/256/512KBFlash(TLSR8266)orinternal512KBFlash(TLSR8266F512)–16KSRAMBOMsaving–32kcrystalnoneeded–EmbeddedRFmatchcircuit–Only6offchippassivecomponents.Power–EmbeddedLDO–ADCforbatterymonitoringSensorsupport–14bitsADCwithPGA–TemperaturesensorTelinkSemiconductorProprietary19TelinkBluetoothLESOCBlockdiagram32bitMCU16MHzCrystalOscillator32.768KHzCrystalOscillator32MHzRCOscillator32KHzRCO