IC Testing Knowledge (一)

IntroductiontoICTestingKnowledge(1)PreparebyLeeZhang,July2004Outline1.OverallBasicKnowledgeofTesting2.IntroductiontoTest3.TestSpecification4.DCParametricTest5.FunctionalTest6.ACParametersTest7.TestProgramDevelopment1)BasicKnowledgeofTestingOverviewTestingEstablishmentandRelatedKnowledgeTestingClassificationandMfg.&ProductionflowAutomaticTestEquipment(ATE)BasicTestItemsTestMethodologyandTestFlowGlossariesandSummary1)OverviewTestingEstablishment4OverviewICTestingEstablishment4TheTypesofTestsinICManufacturing4TheTypesofICProductTests4PurposesofTesting4BasicTestingFlowandDUTFlow4ImpactofTestingCost4ImpactofTestingCycle4ObjectivesofProductionTesting4Testingvs.QualityandReliability4OverviewICTestEstablishmentHowisICtestestablished?-Fromdesignpointofview-Frommanufacturepointofview-Fromsystemdesignpointofview-Fromfailureanalysispointofview-FromcustomerrequirementpointofviewHowimportantisthetestinginICindustry?-Measuringnewproductsrealistic-Monitoringmanufactureprocess-Evidenceforconsumeracceptance4OverviewICTestEstablishmentWhatisthefuturedevelopmentforICtest?-Designforself-test-SeparateIPcoretest-Multipletestmethodsonsingletester-Simpleproducttestwithcomplicatedtester-Reducesoftwaredevelopmenttime4TypesofTestinginICMfg.Howmanyarethemajortypesoftesting?-Designtypeoftest.-Manufactureorproducttypeoftest.-Productiontypeoftest.-Reliabilitytypeoftest.-Physicalfailureanalysistypeoftest.DetailIncludedEachTestTypeDesigntypes:designsimulationtest,designdebugtest,designcharacterizationtestanddesignqualificationtest.4TypesofTestinginICMfg.DetailIncludedEachTestTypeMfgandproducttypes:processsteptest,E(electron)test,engineeringtestandyieldenhancementtest.Productiontypes:waferprobingtest,assemblypackagetest,finaltestandQAtest.Reliabilitytypes:characterizationtestandqualificationtest.PhysicalFAtypes:4TypesofProductTestingFiveTypesofProductTestinginICFieldMemorytypes–ROMandRAMdevices.Logictypes–programmablelogicdevices.Systemtypes–embedded,microcontroller,Socdevices.Mixed-signaltypes–analoganddigitaldevices.RFtypes–opticalandcommunicationdevices.LCDtypes–displaydriverdevices.4PurposesofTestingForDesignHousesorforFoundry-Guaranteetheproductsmeetdesigntargets.-Pre-screenforreliabilitytest.-Qualityassurancetotheproductionprocess.-Meetcustomerspec.andrequirement.ForCustomers-Verificationoftheproduct’sfunctions-Monitorthequalityofincomingproducts4BasicTestingFlowICFabricationTestingShippedPartsYield:FractionofgoodpartsQuality:Defectivepartspermillion(DPM)Rejects4BasicDUTFlowTestStimulusDUTResponseDUTPassFailGoodOrBad?DUT–DeviceUnderTest4Q&AHowdoyouunderstandtheDUT?PointouttheDUTlocationinatestenvironmentWhatistheproblemshownontheDUTduringtestinginfirstplace?4ImpactofTestingCostRequiringhugeamountsofinvestmentsLargelyvaryingwithvolumesProductandprocessmaturityProductandprocesscomplexityProductleadtime(testingonwafer,packagingcycletimeandpackagetesting)4ImpactofTestingCycleDesignforTestability(DFTindesignside)Characterization(designdevelopment)ReliabilityAssessment(processmanufacturing)Pre-productionTesting(productengineering)ProductionTesting(productionmanufacturing)YieldEnhancement(productengineering)PerformanceImprovement(processengineering)TestcostReduction(manufacturingside)ProductCostReduction(productionside)4ObjectiveofProductionTestingScreeningsequencePerformanceofspecificationCollectingdataforbettercontrolManufacturingprocessfine-tuningProgressinyieldenhancementprocessSameproductbydifferentclassesofperformance(speed,vccrange,temperaturerange,W/R&R/Wperformance)4Testingvs.QualityandReliabilityDesignofthecell,processandproductDebugandcharacterizationofprocessandproductManufacturingmachine:equipment,resources,materialsandsoonTheoverallprocesscontrolThereliabilityassessmentofprocessandproductTheoverallknow-howofthemanufacture2)TestingClassificationandMfg.&ProductionFlow4TestingClassification4ManufacturyTestFlow4ProductionTestFlow4TestingClassificationMemoryTesting(SRAM,DRAM,EEPROM,FlashMemory,EmbeddedMemory)LogicTesting(ASIC,FPGA,PLD,CPU)MixedSignalTesting(ADC,DAC,RF)SoCTesting(SystemonChipDevice)LCDTesting(LiquidCrystalDriver)IPTesting(PLL,ADC,DAC,USB,Bandgap,Vregulator,High-SpeedI/Oandsoon)4ManufacturyTestFlowWaferAcceptanceTestingDesignDebugTestingWaferSortTestingFinal(Package)TestingQualityControlTestingReliabilityTestingCharacterization(Engineering)TestingIncoming(Inspection)Testing4ProductionTestFlowWaferAcceptanceTestingWaferSortTestingRepairIfFailedTestingFinal(Package)TestingQualityControlTestingPackagingIfPassedTestingMarkingAndTestingFGorShipping4Q&AWhichtestflowwillyouuseforyieldenhancementtest?Whichtestflowwillyouuseforfailureanalysistest?Whatisthedifferencebetweenproducttestandproductiontest?3)AutomaticTestEquipment4TesterDividedbyTestCapabilities4TesterDividedbyTestFunctions4OtherImportantFacilities4TesterDividedbyTestCapabilitiesBench-topTester(PCbased,PowerMeter,PowerSupply,Oscilloscopesandsoon)4TesterDividedbyTestCapabilitiesDedicatedTester(SignalGenerator,WaveformGenerator,PCBDriversandI-VCurveTracer)4T