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AE/EIT1-Zhong|2/8/2016|©RobertBoschGmbH2016.Allrightsreserved,alsoregardinganydisposal,exploitation,reproduction,editing,distribution,aswellasintheeventofapplicationsforindustrialpropertyrights.TestEngineeringworkintroductionAutomotiveElectronics1测试工程师工作流程简介AE/EIT1-Zhong|2/8/2016|©RobertBoschGmbH2016.Allrightsreserved,alsoregardinganydisposal,exploitation,reproduction,editing,distribution,aswellasintheeventofapplicationsforindustrialpropertyrights.TestEngineeringworkintroductionAutomotiveElectronics测试软件,硬件研发流程QGC0:1.DFTReview2.收集相关项目的knowhow3.TestplanTapeOut:1.Tester硬件设计(DIB+PC)2.开始定义specificationA-Si/C-SiErprobung:hot+room确定testprogram的coverage并且releaseQGC2:1.Testspecificationrelease2.TPrelease2.transfertoproduction/Siliconfoundary1Characterizationhot+room+cold2BurnIN准备testprogram3rampupsupportProductionsupport/qualityimprovement.为客户提供Sample的测试准备testprogram2AE/EIT1-Zhong|2/8/2016|©RobertBoschGmbH2016.Allrightsreserved,alsoregardinganydisposal,exploitation,reproduction,editing,distribution,aswellasintheeventofapplicationsforindustrialpropertyrights.TestEngineeringworkintroductionAutomotiveElectronics3“TestZentrum”introductionEwstest(VM)Finaltest(EM)AE/EIT1-Zhong|2/8/2016|©RobertBoschGmbH2016.Allrightsreserved,alsoregardinganydisposal,exploitation,reproduction,editing,distribution,aswellasintheeventofapplicationsforindustrialpropertyrights.TestEngineeringworkintroductionAutomotiveElectronics4TesterHardwareFlexDIBPCMultisiteMultisitePad位置IC间距AE/EIT1-Zhong|2/8/2016|©RobertBoschGmbH2016.Allrightsreserved,alsoregardinganydisposal,exploitation,reproduction,editing,distribution,aswellasintheeventofapplicationsforindustrialpropertyrights.TestEngineeringworkintroductionAutomotiveElectronics测试软件,硬件研发流程QGC0:1.DFTReview2.收集相关项目的knowhow3.TestplanTapeOut:1.Tester硬件设计(DIB+PC)2.开始定义specificationA-Si/C-SiErprobung:hot+room确定testprogram的coverage并且releaseQGC2:1.Testspecificationrelease2.TPrelease2.transfertoproduction/Siliconfoundary1Characterizationhot+room+cold2BurnIN准备testprogram3rampupsupportProductionsupport/qualityimprovement.为客户提供Sample的测试准备testprogram5AE/EIT1-Zhong|2/8/2016|©RobertBoschGmbH2016.Allrightsreserved,alsoregardinganydisposal,exploitation,reproduction,editing,distribution,aswellasintheeventofapplicationsforindustrialpropertyrights.TestEngineeringworkintroductionAutomotiveElectronics6DFTReview参数的可测试性(包括生产测试和designer的lab测试)Test模式节省测试时间Test模式同时测试(paralleltesting)类似项目的Knowhow收集Testplan初步定义testsAE/EIT1-Zhong|2/8/2016|©RobertBoschGmbH2016.Allrightsreserved,alsoregardinganydisposal,exploitation,reproduction,editing,distribution,aswellasintheeventofapplicationsforindustrialpropertyrights.TestEngineeringworkintroductionAutomotiveElectronicsMilestoneofTestQGC0:1.DFTReview2.收集相关项目的knowhow3.TestplanTapeOut:1.Tester硬件设计(DIB+PC)2.开始定义specificationA-Si/C-SiErprobung:hot+room确定testprogram的coverage并且releaseQGC2:1.Testspecificationrelease2.TPrelease2.transfertoproduction/Siliconfoundary1Characterizationhot+room+cold2BurnIN准备testprogram3rampupsupportProductionsupport/qualityimprovement.7为客户提供Sample的测试准备testprogramAE/EIT1-Zhong|2/8/2016|©RobertBoschGmbH2016.Allrightsreserved,alsoregardinganydisposal,exploitation,reproduction,editing,distribution,aswellasintheeventofapplicationsforindustrialpropertyrights.TestEngineeringworkintroductionAutomotiveElectronicsTester硬件设计,生产的时间限制TapeOut:1.Tester硬件设计(DIB+PC)2.开始定义specification为客户提供第一次的Sample测试准备testprogram8PC设计+PC生产(4周)DIB设计+DIB生产(12周)AE/EIT1-Zhong|2/8/2016|©RobertBoschGmbH2016.Allrightsreserved,alsoregardinganydisposal,exploitation,reproduction,editing,distribution,aswellasintheeventofapplicationsforindustrialpropertyrights.TestEngineeringworkintroductionAutomotiveElectronics9TesterInstrumentsPowerinstrumentWithforce-senseconnection(生产中的contactresistor有可能达到10欧姆)高电压(到100V),高电流(到十几个安培)可切换量程数量相对较少DigitalinstrumentPatternrun(最快大约10ns)有Activeload低电压,低电流Timemeasurement精确到nsAE/EIT1-Zhong|2/8/2016|©RobertBoschGmbH2016.Allrightsreserved,alsoregardinganydisposal,exploitation,reproduction,editing,distribution,aswellasintheeventofapplicationsforindustrialpropertyrights.TestEngineeringworkintroductionAutomotiveElectronics10Testspecification•Doorsspecification•定义参数A/B/C/E/P….•QGC0toTapeoutDatasheet/designspecification•额外测试参数•QGC0toTapeoutTestdocument•和Designer在Lab中的测试参数比较•根据Erporbung/Characterization/BurnIn的报告•TPrelease过程中为达到生产要求Limitsadaption•根据Rampup的结果修改测试条件或者limits•Qualityimprovement•Costreduction(forexample,yieldimprovement)•需要changerequestproductionTestspecificationAE/EIT1-Zhong|2/8/2016|©RobertBoschGmbH2016.Allrightsreserved,alsoregardinganydisposal,exploitation,reproduction,editing,distribution,aswellasintheeventofapplicationsforindustrialpropertyrights.TestEngineeringworkintroductionAutomotiveElectronics测试软件,硬件研发流程QGC0:1.DFTReview2.收集相关项目的knowhow3.TestplanTapeOut:1.Tester硬件设计(DIB+PC)2.开始定义specificationA-Si/C-SiErprobung:hot+room确定testprogram的coverage并且releaseQGC2:1.Testspecificationrelease2.TPrelease2.transfertoproduction/Siliconfoundary1Characterizationhot+room+col
本文标题:Test Engineering work flow_2016-02-16
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