IPC TM-650实验方法手册

IPCTM-650实验方法手册IPCTM-650TestMethodsManualIPCMemberTestingLaboratoriesListSection1.0ReportingandMeasurementAnalysisMethodsSection2.1VisualTestMethodsSection2.2DimensionalTestMethodsSection2.3ChemicalTestMethodsSection2.4MechanicalTestMethodsSection2.5ElectricalTestMethodsSection2.6EnvironmentalTestMethodsSECTION1.0-ReportingandMeasurementAnalysisMethods1.1Introduction1.2Calibration1.3AmbientConditions1.4Reporting,General1.5Reporting,Format1.6NumericalReporting1.7Reporting,InvalidTestResults1.8MeasurementPrecisionEstimationforBinaryData-1/03MeasurementPrecisionCalculator-BinaryDataMeasurementPrecisionCalculatorUsersGuide(forusewithtestmethod1.8)1.9MeasurementPrecisionEstimationforVariablesData-1/03MeasurementPrecisionCalculator-VariableDataMeasurementPrecisionCalculatorUsersGuide(forusewithtestmethod1.9)SECTION2.1-VISUALTESTMETHODS2.1.1DMicrosectioning-3/982.1.1.1Microsectioning,CeramicSubstrate-12/872.1.1.2Microsectioning-SemiorAutomaticTechniqueMicrosectionEquipment(Alternate)-7/932.1.2APinholeEvaluation,DyePenetrationMethod-3/762.1.3APlated-ThroughHoleStructureEvaluation-8/762.1.5ASurfaceExamination,UncladandMetalCladMaterial-12/822.1.6BThicknessofGlassFabric-12/942.1.6.1WeightofFabricReinforcements-12/942.1.7CThreadCountofGlassFabric-12/942.1.7.1ThreadCount,OrganicFibers-12/872.1.8BWorkmanship-12/942.1.9SurfaceScratchExaminationMetalCladFoil-5/862.1.10AVisualInspectionforUndissolvedDicyandiamide-12/942.1.13AInspectionforInclusionsandVoidsinFlexiblePrintedWiringMaterials-5/98SECTION2.2-DIMENSIONALTESTMETHODS2.2.1AMechanicalDimensionalVerification-8/972.2.2BOpticalDimensionalVerification-8/972.2.4CDimensionalStability,FlexibleDielectricMaterials-5/982.2.5ADimensionalInspectionsUsingMircosections-8/972.2.6AHoleSizeMeasurement,Drilled-8/972.2.7AHoleSizeMeasurement,Plated-5/862.2.8LocationofHoles-4/732.2.10AHoleLocationandConductorLocation-12/832.2.12AThicknessofCopperbyWeight-3/762.2.12.1OverallThicknessandProfileFactorofCopperFoilsTreatedandUntreated-9/872.2.12.2WeightandThicknessofCopperFoilswithReleasableCarriers-7/892.2.12.3WeightandThicknessDeterminationofCopperFoilsWithEtchableCarriers-7/892.2.13.1AThickness,PlatinginHoles,MicrohmMethod-1/832.2.14SolderPowderParticleSizeDistribution-ScreenMethodforTypes1-4-1/952.2.14.1SolderPowderParticleSizeDistribution-MeasuringMicroscopeMethod-1/952.2.14.2SolderPowderParticleSizeDistribution-OpticalImageAnalyzerMethod--1/952.2.14.3DeterminationofMaximumSolderPowderParticleSize-1/952.2.15CableDimensions(FlatCable)-6/792.2.16ArtworkMasterEvaluationbyUseofaDrilledPanel-12/872.2.16.1ArtworkMasterEvaluationbyOverlay-12/872.2.17SurfaceRoughnessandProfileofMetallicFoils(ContactingStylusTechnique)-3/902.2.17ASurfaceRoughnessandProfileofMetallicFoils(ContactingStylusTechnique)-2/012.2.18DeterminationofThicknessofLaminatesbyMechanicalMeasurement-12/942.2.18.1DeterminationofThicknessofMetallicCladLaminates,Cross-sectional-12/942.2.19MeasuringHolePatternLocation-12/872.2.19.1Length,WidthandPerpendicularityofLaminateandPrepregPanels-12/942.2.20SolderPasteMetalContentbyWeight-1/952.2.21PlanarityofDielectricsforHighDensityInterconnection(HDI)MicroviaTechnology-11-98SECTION2.3-CHEMICALTESTMETHODS2.3.1ChemicalProcessing,SuitableProcessingMaterial-4/732.3.1.1BChemicalCleaningofMetalCladLaminates-5/862.3.2FChemicalResistanceOfFlexiblePrintedWiringMaterials-5/982.3.3AChemicalResistanceofInsulatingMaterials-2/782.3.4BChemicalResistance,MarkingPaintsandInks-8/972.3.4.2AChemicalResistanceofLaminates,PrepregandCoatedFoilProducts,bySolventExposure-12/942.3.4.3ChemicalResistanceofCoreMaterialstoMethyleneChloride-5/862.3.5BDensity,InsulatingMaterial-8/972.3.6AEtching,AmmoniumPersulfateMethod-7/752.3.7AEtching,FerricChlorideMethod-7/752.3.7.1ACupricChlorideEtchingMethod-12/942.3.7.2AAlkalineEtchingMethod-12/942.3.8AFlammability,FlexibleInsulatingMaterials-12/822.3.8.1FlammabilityofFlexiblePrintedWiring-12/882.3.9DFlammabilityofPrepregandThinLaminate-8/972.3.10BFlammabilityofLaminate-12/942.3.10.1FlammabilityofSoldermaskonPrintedWiringLaminate-8/982.3.11GlassFabricConstruction-4/732.3.13DeterminationofAcidValueofLiquidSolderFlux-PotentiometricandVisualTitrationMethods-1/952.3.14Print,Etch,andPlateTest-4/732.3.15CPurity,CopperFoilorPlating-8/972.3.16BResinContentofPrepreg,byBurn-off-12/942.3.16.1CResinContentofPrepeg,byTreatedWeight--12/942.3.16.2TreatedWeightofPrepreg-12/942.3.17DResinFlowPercentofPrepreg-8/972.3.17.1BResinFlowofAdhesiveCoatedFilmsandUnsupportedAdhesiveFilms-5/982.3.17.2BResinFlowofNoFlowPrepreg-8/972.3.18AGelTime,PrepregMaterials-4/862.3.19CVolatileContentofPrepreg-12/942.3.21PlatingQuality,HullCellMethod-8/972.3.22CopperProtectiveCoatingQuality-2-782.3.23BCure(Permanency)ThermallyCuredSolderMask-2/882.3.23.1ACure(Permanency)UVInitiatedDryFilmSolderMask-2/882.3.24PorosityofGoldPlating-2/782.3.24.1PorosityTestingofGoldElectrodepositedonaNickelPlatedCopperSubstrateElectrographicMethod-10/852.3.24.2APorosityofMetallicCoatingsonCopper-BasedAlloysandNickel(NitricAcidVaporTest)-8/972