面板制程-CF process 简介

CFProcess簡介JerryTFT/LCD材料工程部CMOConfidential•LCD&CF結構簡介•CF光阻材料簡介•CF製程及檢驗手法簡介•MacroInspection判定方法•MicroInspection判定方法•CFProductIDnamingrule課程大綱CMOConfidentialLCD面板結構圖下玻璃基板上玻璃基板上偏光板PS液晶分子下偏光板框膠配向膜TFT元件彩色濾光板液晶層光線(背光源)LCD:LiquidCrystalDisplay(液晶顯示器)CMOConfidentialCF結構圖ITO剖面示意圖俯視示意圖實際圖例素玻璃BMRLayerGBMVAPSCF:ColorFilter(彩色濾光片)CMOConfidential光阻材料分類與成分•正型光阻:BM(Cr),MVA•負型光阻:ColorResist(R,G,B),PS,RBM彩色光阻溶劑固成分PastePolymerMonomerPhoto-initiatorAdditivePigmentDispersantSolventMonomerInitiatorCMOConfidential光阻材料成分v.s光阻特性成分塗布性顯影性色表現對比度信賴性ProfilePaste○○○○○○Polymer○○○○○○○Photoinitiator○○Monomer○○Additive○○Solvent○CMOConfidentialCF製造流程1.廣視角產品(MVA產品):2.非廣視角產品(TN產品):BMRGBITOPSBMRGBITOMVAPS*BM依材質類型有Resin及CrBM二種CMOConfidentialCF製作方法CMOConfidentialCF製程機制:PhotolithographyPhotosensitiveMaterialsSubstrateNegativeTypePositiveTypeMMBinderUVPigmentPhoto-initiatorSolubleInsolubleCoatingExposureDevelopmentImagesUVPhotolithography:顯影液:KOHCMOConfidentialCFProcess優點:1.Process減少(設備簡化)2.光阻用量減少(1)Spin---轉速(rpm)決定膜厚(2)Spinless---吐出量(PR值)決定膜厚CoaterSpinVCDEBRHP/CPExposureDevelopmentAOIOvenCassetteCoaterVCDHP/CPExposureDevelopmentAOIOvenCassetteCoater:優點:塗佈均勻性較好缺點：1.多一道製程2.光阻用量多(浪費光阻,增加成本)CMOConfidentialBMProcess(1300)BM:遮蔽漏光區,增加對比RGB:提供色度ITO:提供電場所需之電極MVA/DJITO:提供廣視角PS:支撐TFT/CF所需之CellGapCMOConfidentialBMProcess鉻玻璃清洗正光阻塗佈(1)正光阻塗佈(2)Pre-cleanerSlitcoaterSpincoater2.BMphotolineUnpacker&Initialcleaner鉻膜濺鍍素玻璃投入1.Crsputtering鉻玻璃CrsputterCrglassCrOx,CrNy,Cr一.CrBMprocess:XX:Spinless無CMOConfidentialBMProcess蝕刻去光阻紫外線曝光顯影烘烤(Oven)去掉邊緣光阻EBR(EdgeBeadRinse)AlignerDeveloperHotplate3.EtchinglineEtchingStrippingBMpatternglass真空乾燥VacuumDryerPre-bake&CoolplateXX:Spinless無預烘烤(HP)與冷卻(CP)CMOConfidentialBMProcess二.RBMprocess:素玻璃清洗負光阻塗佈(1)負光阻塗佈(2)Pre-cleanerSlitcoaterSpincoaterXX:Spinless無紫外線曝光顯影烘烤(Oven)去掉邊緣光阻EBR(EdgeBeadRinse)AlignerDeveloperHotplate真空乾燥VacuumDryerPre-bake&CoolplateX預烘烤(HP)與冷卻(CP)CMOConfidential•環保意識•降低設備及建廠成本(省掉sputtering及Etching的設備)•簡化製程流程•製程一致性(BM,RGB,PS均使用負光阻)RBM的優點CMOConfidentialBlackmatrix的功用遮蔽TFT避免pixel以外區域漏光增進色彩對比性降低面板的反射光Blackmatrix的需求☆低反射率:減低外來光線的干擾☆高OD值:阻隔pixel間的背光(增高對比)☆膜厚薄(避免角斷差發生)☆低pinhole數:避免漏光,產生亮點☆低particle數:增加良率CMOConfidentialBMInspection1231.TotalPitch(長寸法)2.CD(CriticalDimension)3.MarktoEdge(端寸法)SubstrateR1.OD=-log(I/Io)42.反射率(CrBM)3.Thickness(ResinBM)顯影後缺陷檢查ADI(AfterDeveloperInspection)巨觀檢查(Macroreview)IoIBMTP/EGDEX1DEYDEX2DEY212345671098131211141516171819202122CMOConfidentialILSP01:OD–Start區&平坦區各1點,片片檢–避免Start區&平坦區的OD值差異太大.MUIN01:Macro–確認In-lineMacro品質狀況(有無mura)PRIN01:AOI,CD–確認In-lineMicro品質狀況–避免CD太低,造成LCD漏光RBMLayerIn-lineSamplingCMOConfidentialRBMLayeroff-lineSamplingSPME01:OD–避免OD太低,造成LCD漏光MACR51:Macro–確認BMoff-lineMacro品質狀況CDME01:CD,端寸,Totalpitch–避免CD太低,造成LCD漏光–避免T/P太大or太小,造成LCD對組後漏光SUFT01:BMThickness–控制角段差及ODCMOConfidentialRGBProcess(2300,3300,4300)BM:遮蔽漏光區,增加對比RGB:提供色度ITO:提供電場所需之電極MVA/DJITO:提供廣視角PS:支撐TFT/CF所需之CellGapCMOConfidentialRGBProcess---R-Layer紅色光阻塗佈(1)紅色光阻塗佈(2)Pre-cleanerSlitcoaterSpincoaterBMpatternglass清洗紫外線曝光顯影去掉邊緣光阻EBR(EdgeBeadRinse)AlignerDeveloper烘烤Oven真空乾燥VacuumDryer預烘烤(HP)與冷卻(CP)Pre-bake&CoolplateXXX:Spinless無CMOConfidentialRGBProcess---G-Layer綠色光阻塗佈(1)綠色光阻塗佈(2)Pre-cleanerSlitcoaterSpincoaterRglass清洗紫外線曝光顯影去掉邊緣光阻EBR(EdgeBeadRinse)AlignerDeveloper烘烤Oven真空乾燥VacuumDryerPre-bake&CoolplateXX預烘烤(HP)與冷卻(CP)X:Spinless無CMOConfidentialRGBProcess---B-Layer藍色光阻塗佈(1)藍色光阻塗佈(2)Pre-cleanerSlitcoaterSpincoaterR,Gglass清洗紫外線曝光顯影去掉邊緣光阻EBR(EdgeBeadRinse)AlignerDeveloper烘烤Oven真空乾燥VacuumDryerPre-bake&CoolplateXX預烘烤(HP)與冷卻(CP)X:Spinless無CMOConfidential121.PixelCD2.Overlay3.厚度(RGB段差)50060070080040020406080100透過率波長(nm)0.20.40.60.81.00.20.40.60.81.0xyCRTNTSCSEC神東肅だ床猭4.RGB色度量測3RGBInspectionCMOConfidentialITOProcess(5200)BM:遮蔽漏光區,增加對比RGB:提供色度ITO:提供電場所需之電極MVA/DJITO:提供廣視角PS:支撐TFT/CF所需之CellGapCMOConfidentialWhatisITO?ITO=IndiumTinOxide(銦錫氧化物)90wt.%In2O3+10wt.%SnO2CMOConfidentialSputtering(濺鍍)的原理於真空環境下,通入高電壓及Ar/O2混合氣體,產生Ar+離子撞擊ITO靶材,形成銦錫離子與O離子反應成銦錫氧化物(ITO),濺鍍於產品上.VacuumChamberSubstrateTargetPlasmaAr+e-GasInletVacuumPumps-2kVCMOConfidentialITOsputteringprocess氧化銦錫膜濺鍍ITOsputterITOpre-cleaner(水洗,清洗無機物)R,G,B玻璃投入ITO玻璃ITOglassDefectInspection(缺陷檢查機)(Micro1,4560)UVasher(清洗有機物)紫外線灰化Repair(修補)(repair1,4578)CMOConfidentialITOInspection1.RGB色度量測2.Rs(電阻值)量測3.光穿透率量測4.ITO膜厚量測5.T/P量測50060070080040020406080100透過率波長(nm)0.20.40.60.81.00.20.40.60.81.0xyCRTNTSCSEC神東肅だ床猭ITOCMOConfidentialMVAProcess(6300)BM:遮蔽漏光區,增加對比RGB:提供色度ITO:提供電場所需之電極MVA/DJITO:提供廣視角PS:支撐TFT/CF所需之CellGapCMOConfidential何謂廣視角?TNtypeSuperMVACMOConfidentialMVAProcess(Multi-domainVerticalAlignment)X:Spinless無正光阻塗佈(1)正光阻塗佈(2)Pre-cleanerSlitcoaterSpincoaterITOglass清洗紫外線曝光顯影去掉邊緣光阻EBR(EdgeBeadRinse)AlignerDeveloper烘烤Oven真空乾燥VacuumDryerPre-bake&CoolplateXX預烘烤(HP)與冷卻(CP)CMOConfidentialMVAInspection1.厚度量測2.PixelCD量測3.Overlay4.Macro膜厚CMOConfidentialPSProcess(7300)BM:遮蔽漏光區,增加對比RGB:提供色度ITO:提供電場所需之電極MVA/DJITO:提供廣視角PS:支撐TFT/CF所需之CellGap(間距)PSCFTFTCMOConfidentialPSProcessPS光阻塗佈(1)PS光阻塗佈(2)Pre-cleanerSlitcoaterSpincoaterglass清洗紫外線曝光顯影去掉邊緣光阻EBR(EdgeBeadRinse)AlignerDeveloper烘烤Oven真空