倒装焊与芯片级封装技术的研究（PPT10页）

倒裝焊与晶片級封裝技術的研究WhyFlipChip?Bettermanufacturingyieldthanwirebondforhighpin-countchips.對于高密度引腳芯片，成品率优于丝键合。Fastermanufacturingthrough-putthanwirebondforhighpin-countchips.對于高密度引腳芯片，生产效率高于丝键合。Morereliabilitythanwirebondedchips.可靠性优于丝键合封装芯片。Betterelectricalcharacteristics(lessinductance)forhigh-speedchips.AmustforRF,optoelectronics,high-speeddigital(500MHz).对于高速芯片，具有良好的电学性能。MoreonWhyFlipChip?Desirableforhigh-performanceBallGridArray(BGA)package.高性能球形焊点阵列封装需要倒装焊。DesirableforChipSizePackage(CSP).芯片尺寸封装技术需要倒装焊。TheFlipchipbondedwafermarketispredictedtogrow37%annuallywhiletheoverallICunitswillonlygrow8%.倒装焊晶片市场预计年增长37%，而整体IC增长仅8%。TheFlipchipbondedwaferisexpectedtoincreasefrom3.4million(2000)to26.2million(2005)wafers.倒装焊晶片预计由三百四十万片(2000年)增长至二千六百二十万片(2005年)。ForecastonICUnitIC产量预测(2000-2005)020406080100120140200020012002200320042005Units(Billion)YearSource:ElectronicTrendPublicationsInc,2001CompoundAnnualGrowthRate:8.3%来自中国最大的资料库下载DQForecastBareDieUsage(1999-2004)(UnitsinMillion)CAGR(%)1999200020012002200320042000-2004(UNIT)3,3744,0264,6915,6267,1659,71119.3%FlipChip12091823265538765534886837.2%FCIP14420145510011646262567.2%FCOB10651622220028753888624330.9%COB15161542142512251142590-17.5%COF260264244228212110-16.1%TAB17317616314013067-17.5%DCA21722020415814776-19.2%Total33744026469156267165971119.3%Note:FCIPisFlipChipinPackageFCOBisFlipChiponBoardCOBiswirebondeddiedirectlytosubstratesuchasthoseusedinwatches,smartcardsDCAisdirectchipattachtosubstratesviaothermethods,suchasconductiveadhesive,microspring(FormFactor);weldingTABistab-on-board(notinapackage)TotalBareChip(Die)Source:Dataquest,April2001ForecastonBumpedWafersUsage凸点晶片使用预测(2000-2005)26.22014.810.46.863.4No.ofBumpedWafers200520042003200220012000YearSource:Dataquest,April2001(UnitsinMillion)TechnologyLeadersareSoldonFlipChip倒装焊在技术领先企业中的应用IntelhasmigratedcompletelytoflipchipbondedBGAforthePentium4productfamilyduetohighclockspeedandhighpin-count(4000).鉴于高速和高引脚(4000)要求，Intel已在奔腾4产品系列中完全采用倒装焊键合的BGA技术。Themostadvancedopto-electronicscomponentsfromNTTusesflip-chiptechnologyexclusively.来自NTT的最新光电器件也使用了倒装焊技术。IBMhasusedflip-chip30years.倒装焊技术已在IBM使用了超过30年LowRiskandEstablishedInfrastructure低风险和建厂基础Wellestablishedindustrialinfrastructure.良好的建厂工业基础Productionequipmentsimilartochipandprintercircuitboardindustries.生产设备与芯片和印刷电路板工业相近CompatibletoSurfaceMountTechnology(SMT).与表面贴装技术兼容Producesmallerandlighterelectronicmodulethanwirebondedchips.生产的电子模块比丝键合小且轻FlipChipandWaferLevelPackagingTechnologyinHKUST香港科技大學倒裝焊与晶片級封裝技術的研究Electroplatingsolderbumping(MainstreamFlipChipTechnology)电镀凸点工艺(主流倒装焊凸点技术)ElectrolessUBMandstencilprintingbumping(LowercostFlipChipTechnologyw/ophotolithographyandvacuumprocessing)化学镀凸点下金属(UBM)和丝网印刷凸点工艺(低成本倒装焊技术-不需用光刻和真空制造工艺)Wafer-LevelInput/outputRedistribution.晶片级输入/输出再发布工艺CommercialApplications商业应用ForIntegratedCircuitWaferFoundry集成电路晶片制造厂Waferbumping–advancedintegratedcircuitchipsforhigh-speed,highinput/outputcounts,andforchipsgoingintoadvancedpackagessuchasBallGridArray(BGA)andChipSizePackage(CSP).晶片凸点制备：用于高速高输入/输出端口的先进集成电路芯片，及先进芯片封装技术，如球形焊点阵列和芯片尺寸封装.RedistributionofperimeterI/O(designedforwirebonding)toarrayI/Oforadvancedpackaging.先进封装技术中再分布工艺(由周边输入/输出至面分布).ForPackagingandAssemblyFoundryIC封装和装配厂AssemblyofAdvancedpackagessuchasBallGridArray(BGA)andChipSizePackage(CSP).先进封装的装配，如球形焊点阵列和芯片尺寸封装.