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8152008816711819(2008)15425807ScienceTechnologyandEngineeringVol8No15Aug.20082008SciTechEngng电子芯片液体冷却技术研究进展雷俊禧朱冬生王长宏胡韩莹(,510640)摘要随着电子芯片发热量不断上升,传统的风冷方案已不能满足芯片日益增长的散热要求,着重介绍了芯片液体冷却技术中液体喷射冷却微通道液体冷却和宏观水冷管路冷却三种冷却方式的研究进展从理论研究实验研究数值模拟和实际应用等方面对其进行了详细的分析,并在此基础上介绍了一些芯片液冷的新技术,对芯片液冷的发展也提出了一些建议,以满足芯片冷却的要求关键词电子芯片液体冷却芯片液冷中图法分类号TP271.2;文献标志码A2008421:(1983),,,:,Emai:lleijunxi105@163.com,CPU100W200W,104Wm-2-105Wm-2,[1,2],10!,50%,55%[3,4][5],,,,,,,,,,,,1液体喷射冷却,,,,,[6],:,1,MartinSchraderGlaser,:[7]Hrycak:()()[8],,,,,[9]r0=1.95(/a)1/2,,m2s-1;a,,,,,[10],,,,1,1983IBM4381,2080,M780[11][12]:512,,,,,,,Mudawar,[13],,S.C.Yao[14],,,,,[15],,,,,,(CHF),[16][17]FC72L12378,,,[18],,,2微通道液体冷却,,80,[19],,425915,:[20]2,,,2,TuckermanPease[21],Goodson,,,ArelHaim[22],Vijay[23],,Ryu[24],,[25]Ryu,2,(SQP)[26],,,,,,,,Harm[27],,,Flockhart[28],Li[2931][32],,[33],,,[3436][37]6,,,[38],,,42608,,,[39][40]ESCCoventorWare[41][42],PCR[43],3宏观水冷管路冷却技术,,,,,3,:CPU,CPU,3,[44,45],,[46],[47]Fluent1GBT,[48]ANSYS,,,CPU,,IBMIntelNEC,IBMES/3090ES/9000,FACOMVP2000FACOMM780,NECSXHoneywell[49][46],[46],45CPU,,,,CoolerMasterTt(PCCooler)ThermaltakeCPU426115,:4芯片液冷研究新进展,,,,,;,,[50][51],,5结论,,,,,1.CPU.,2003;3(1):46492MochizukiM,NguyenT,MashikoK,etal.PracticalapplicationofHeatpipeandvaporchamberforcoolinghighperformancepersonalcomputer.12#IntemationalHeatPipeConference.ShagnhaiChina,20043,,,..,2003;(4):9124BelhardjS,MimouniS,SaidaneA,etal.Usingmicrochannelstocoolmicroprocessors:atransmissionlinematrixstudy.MicroelectronicsJourna,l2003;(34):2472535,..:,20006..:,1995;1661827MartinH.Heatandmasstransferbetweenimpinginggasjetsandsolidsurfaces.AdvancesinHeatTransfer,1993;23:1231268HrycakP.HeattransferfromimpingingjetsAliteraturereview.AFWALTR813054,FlightDynamicsLaboratory,WrightPattersonAFB,Ohio,1981:529..,:,2000:636510,..42628,2004;(3):223211YamamotoH,elat.CoolingandPackagingTechnologyfortheFACOMM780.Fujitsu1986;37:12412.,2005;7413MudawarI.Assessmentofhighheatfluxthermalmanagementschemes.IEEETransactionsonComponentsandPackagingTechnologies,2001;24:12214014HsiehCC,YaoSC.Evaporativeheattransfercharacteristicsofawatersprayonmicrostructuredsiliconsurfaces.InternationalJournalofHeatandMassTransfer,2006;49(56):96297415,.MEMS.,2006;23(8):212316,,.FC72.,1996;17(1):697417,,.L12378.,2001;35(9):95896118...:,2007:374419,./.,2004;(8):212820,,,..,2003;31(5):73774121TuckermanDB,PeaseRFW.HighperformanceheatsinkforVISI.IEEEElectronDeviceLetters,1981;2(4):12612922WeisbergA,BauHH.Analysisofmicrochannelsforintegratedcooling.IntJHeatMassTransfer,1992;35(10):2465247423VijayKS.Convectiveheattransferinmicrochannels.JournalofElectronicMaterials.1989;18(5):61161724RyuJH,ChoiDH,KimSJ.Threedimensionalnumericaloptimizationofamanifoldmicrochannelheatsink.InternationalJournalofHeatandMassTransfer,2003;46:1553156225,,..(),2007;37(2):31331826,,...2005;21(1):202227HarmsTM,KazmierczakMJ,GernerFM.DevelopingconvectiveheattransferinEEPrectangularmicrochannels.IntJHeatFluidFlow,1999;20(2):14915728FlockhartSM,DhariwalRS.Experimentalandnumericalinvestigationintotheflowcharacteristicsofchannelsetchedin(100)silicon.TransASMEJFluidsEngng,1998;(120):29129529LiZX,DuDX,GuoZY.Experimentalstudyonflowcharacteristicsofliquidincircularmicrotubes.ProceedingoftheIntConferenceonHeatTransferandTransportPhenomenainMicroScale.Banff,Canada,2000:16216730MandelbrotBB.Thefractalgeometryofnature.NewYork:W.H.Freeman,198231PenceDV.Improvedthermalefficiencyandtemperatureuniformityusingfractaltreelikebranchingchannelnetworks.ProceedingoftheInt.ConferenceonHeatTransferandTransportPhenomenainMicroScale.Banff,Canada,2000:14214832,,..,2003;31(11):1717172033,..,2006;19(5):2025203034PengXF,PetersonGP.Theeffectofthermofluidandgeometricalparametersonconvectionofliquidsthroughrectangularmicrochannels.IntJHeatMassTransfer,1995;38(4):75575835NguyenNT,BochniaD.InvestigationofForcedconvectioninmicrofluidsystems.SensorsActuatorsA,1996;55(1):495536AdamsTM,AbdelKhalikSI,JeterSM.Anexperimentalinvestigationofsinglephaseforcedconvectioninmicrochannels.IntJHeatMassTransfer,1998;41(627):85185737,..().2003;16(1):71138,..,2006;22(1):4639,,,..,2005;21(3):151840,,,..,2005;17(SO):879041,,,..,2003;14(21):1860186442,,,.PCR.,2004;(4):697343..,2006;22(2):141944,,,..,2006;28(4):40340645,,,..,2005;39(11):1207121046...,200647...,200648...::2832(下转第4269页)426315,:46..:.2003:636547KeahChoonTan.Aframeworkofsupplychainmanagementliterature.EuropeanJPurchasing&SupplyManagement,2001;40(7):394848,,..,2000;5(5):464849,,,..,2000,20(8):1117.50SelcukES,SimpsonNC,VakhariaAJ.Integratedproduction/distributionplanninginsupplychain:aninvitedreview.EuropeanJ.OperationalResearch,1999;115(5):21923651..:.2003;27ReviewofShipbuildingSupplyChainManagementRENWenyuan,ZHAOHong(JiangsuUniversityofScienceandTechnology,Zhenjiang212003,P.R.China)[Abstract]Theconceptofshipbuildingsupplychainmanagementisexplaind,thenpresentdaresearchofcurrentliteratures,pointoutexistingproblemsinthecurrentSSCMpractice.Intheend,thefutureresearchdirectionsisdiscussed.[Keywords]shipbuildingsupplychainmanagementecosystemresearchframe
本文标题:电子芯片液体冷却技术研究进展
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