SPC各月月报2

列表日期:03/02/05序號站別項目擔當單位規格單位2月管制範圍CPK值1OSP膜厚終檢課0.2~0.5u0.397~0.4492.652微蝕量終檢課10~30u20.67~25.832.443成型站成型尺寸鑽孔課+5mil-1.202~1.2901.944成品清潔度IPQC6.4ug/in20.619~1.7695.855成品板厚OQC+6mil-0.064~3.031.816#1金厚度加工課2~6u3.31~4.3362.467#1鎳厚度加工課150~300u202~239.63.418#2金厚度加工課0.05~0.15um0.055~0.0831.929#2鎳厚度加工課3~6um4.072~4.9064.4310S/M厚度IPQC0.4~1.2mil0.496~0.6361.9111油墨黏度防焊課60~80Sec.67.1~73.71.8312半成品清潔度IPQC6.4ug/in20.965~1.6753.7413PTH孔銅IPQC0.5mil0.7~0.962.2414PTH孔銅IPQC0.7mil0.89~1.133.9415面銅IPQC0.3mil0.079~0.1951.7316E-lessCuWeightGain電鍍課0.4~0.6um0.46~0.55NA17DesmearEtchRate電鍍課15~40mg/dm218.9~24.7NA18內層前處理微蝕液濃度微影課40~60g/l44.62~52.721.5819外層前處理微蝕液濃度微影課40~60g/l43.93~53.231.3520內層線寬公差微影課+1mil0.142~0.4962.5321外層線寬公差微影課+1mil0.132~0.5462.0522鑽孔課孔壁粗糙度IPQC1.2mil0.217~0.8482.0023壓合板厚壓合課+5um-0.348~2.471.8224EtchMount壓合課30~60u''38.4~47.22.3425WeightGain壓合課0.27~0.37mg/cm20.3~0.341.91審核:列表人:彭峰微影課壓合課1月SPC月報終檢課OQC加工課防焊課電鍍課列表日期:03/03/02序號站別項目擔當單位規格單位3月管制範圍CPK值1OSP膜厚終檢課0.2~0.5u0.408~0.4622.432微蝕量終檢課10~30u20.67~25.83NA4成型站成型尺寸鑽孔課+5mil-1.085~1.362.045成品清潔度IPQC6.4ug/in20.515~1.8694.617成品板厚OQC+6mil0.195~2.9772.348#1金厚度加工課2~6u2.71~4.821.949#1鎳厚度加工課150~300u178~261.62.5610#2金厚度加工課0.05~0.15um0.058~0.082.0411#2鎳厚度加工課3~6um3.59~5.372.1512S/M厚度IPQC0.4~1.2mil0.484~0.6581.8313油墨黏度防焊課60~80Sec.66.5~73.51.7714半成品清潔度IPQC6.4ug/in20.935~1.6464.2115PTH孔銅IPQC0.5mil0.685~0.9512.36PTH孔銅IPQC0.7mil0.903~1.1454.0317面銅IPQC0.3mil0.086~0.191.8118E-lessCuWeightGain電鍍課0.4~0.6um0.423~0.5941.8319DesmearEtchRate電鍍課15~40mg/dm218.68~24.661.4620內層前處理微蝕液濃度微影課40~60g/l44.2~53.61.4622外層前處理微蝕液濃度微影課40~60g/l43.93~53.911.3523內層線寬公差微影課+1mil0.132~0.5122.3424外層線寬公差微影課+1mil0.138~0.5581.9225鑽孔課孔壁粗糙度IPQC1.2mil0.221~0.8571.8326壓合板厚壓合課+5um-0.358~2.2842.1927EtchMount壓合課30~60u''38.82~46.882.5528WeightGain壓合課0.27~0.37mg/cm20.297~0.3431.89審核:列表人:彭峰2月SPC月報終檢課OQC壓合課加工課防焊課電鍍課微影課列表日期:03/04/02序號站別項目擔當單位規格單位4月管制範圍CPK值1OSP膜厚終檢課0.2~0.5um0.408~0.4622.162微蝕量終檢課10~30um------+5mil-1.318~1.582.03+8mil-2.167~2.025---5成品清潔度IPQC6.4ug/in20.515~1.8693.717成品板厚OQC+6mil-0.11~1.2382.218#1金厚度加工課2~6u3.236~4.3182.019#1鎳厚度加工課150~300u196.829~245.6232.6910#2金厚度加工課0.05~0.15um0.063~0.0752.0811#2鎳厚度加工課3~6um3.88~4.9182.2812S/M厚度IPQC0.4~1.2mil0.484~0.6581.8313油墨黏度防焊課60~80Sec.64.2~75.81.7514半成品清潔度IPQC6.4ug/in20.935~1.6464.2115PTH孔銅IPQC0.5mil0.742~0.9122.49PTH孔銅IPQC0.7mil0.876~1.13.7417面銅IPQC0.3mil0.09~0.1641.8618E-lessCuWeightGain電鍍課0.4~0.6um0.423~0.5941.4619DesmearEtchRate電鍍課15~40mg/dm218.68~24.661.8320內層前處理微蝕液濃度微影課40~60g/l---1.4522外層前處理微蝕液濃度微影課40~60g/l---1.5123內層線寬公差微影課+1mil0.157~4952.1124外層線寬公差微影課+1mil0.15~0.5461.9725鑽孔課孔壁粗糙度IPQC1.2mil0.27~0.6641.9326壓合板厚壓合課+5um-0.094~2.1022.2527EtchMount壓合課30~60u''39.784~46.1062.4728WeightGain壓合課0.27~0.37mg/cm20.297~0.3431.9審核:列表人:彭峰防焊課電鍍課微影課壓合課3月SPC月報終檢課OQC加工課4成型站成型尺寸鑽孔課列表日期:03/05/02序號站別項目擔當單位規格單位5月管制範圍CPK值1OSP膜厚終檢課0.2~0.5um0.4~0.461.032微蝕量終檢課10~30um20.27~25.931.543+5mil-1.329~1.6131.474+8mil-1.776~1.8061.975成品清潔度IPQC6.4ug/in20.752~1.6025.556成品板厚OQC+6mil2.41~0.8337.977加工課#1金厚度加工課2~6u3.236~4.3181.668#1鎳厚度加工課150~300u196.829~245.6231.399#2金厚度加工課0.05~0.15um0.063~0.0751.4710#2鎳厚度加工課3~6um3.926~4.9341.311防焊課S/M厚度IPQC0.4~1.2mil0.46~0.6860.8512油墨黏度防焊課60~80Sec.64.2~75.81.0813半成品清潔度IPQC6.4ug/in20.986~1.5987.3114電鍍課PTH孔銅IPQC0.5mil0.764~0.8942.2815PTH孔銅IPQC0.7mil0.91~1.032.3616面銅IPQC0.3mil0.109~0.1533.3917E-lessCuWeightGain電鍍課0.4~0.6umNANA18DesmearEtchRate電鍍課15~40mg/dm2NANA191#前處理微蝕液濃度微影課40~60g/lNA1.33202#前處理微蝕液濃度微影課40~60g/lNA1.69213#前處理微蝕液濃度微影課40~60g/lNA2.0422內層線寬公差微影課+1mil0.194~0.491.8523外層線寬公差微影課+1mil0.191~0.5171.624鑽孔課孔壁粗糙度IPQC1.2mil0.27~0.6643.0825壓合板厚壓合課+5um0.111~1.9051.8426EtchMount壓合課30~60u''39.652~46.0722.3127WeightGain壓合課0.27~0.37mg/cm20.296~0.3441.16審核:列表人:彭峰壓合課4月SPC月報微影課終檢課OQC成型站成型尺寸鑽孔課列表日期:2003/06/03序號站別項目編號等級擔當單位規格單位6月管制範圍SigmaCaCpCPK值1OSP膜厚1#PD-6AA終檢課0.2~0.5u0.4-0.46數據不足2微蝕量1#PD-5AB終檢課10~30u20.27-25.93數據不足3OSP膜厚2#PD-6BA終檢課0.25-0.3u0.033-0.277數據不足4微蝕量2#PD-5BB終檢課10~30u12.106-21.636數據不足5+5mil-1.410,1.6011.3040.0201.2871.2536+8mil-1.685,1.7181.4740.0021.8091.8057成品清潔度PD-4BIPQC6.4ug/in20.965-1.6750.1774.9534.9538成品板厚公差PD-26BOQC+6mil0.379-0.8100.1590.09912.56011.3169#1金厚度A加工課2~6u3.201-4.1170.3510.1101.9001.69210#1鎳厚度A加工課150~300u197.47-245.04217.6330.0501.4181.34711#2金厚度A加工課0.05~0.15um0.0581-0.07000.0050.4345.1042.88712#2鎳厚度A加工課3~6um3.969-4.9740.3730.0191.3421.31713S/M厚度PD-21BIPQC0.4~1.2mil0.475-0.7330.0740.4911.7920.91314油墨黏度PD-23A防焊課60~80Sec.65.062-72.3922.1260.1291.5681.36515PTH孔銅(水平)PD-15ABIPQC0.5mil0.726-0.8830.0482.2982.29816PTH孔銅(垂直)PD-15BBIPQCmil17PTH孔銅(水平)PD-16ABIPQC0.7mil0.833-0.9700.0442.0202.0218PTH孔銅(垂直)PD-16BBIPQCmil19面銅平均R值(水平)PD-14ABIPQC0.3mil0.113-0.1280.0068.7128.71220面銅平均R值(垂直)PD-14BBIPQCmil21E-lessCuWeightGain(水平)PD-18AB電鍍課0.4~0.6um0.429-0.5440.0350.0300.9410.91222E-lessCuWeightGain(垂直)PD-18BB電鍍課um23DesmearEtchRate(水平)PD-17AB電鍍課15~40mg/dm218.283-25.2532.0790.4592.0041.08524DesmearEtchRate(垂直)PD-17BB電鍍課mg/dm3251#前處理微蝕液濃度B微影課40~60g/l0-5.6420.72263#前處理微蝕液濃度B微影課40~60g/l0-5.5160.84274#前處理微蝕液濃度PD-20B微影課40~60g/l0-5.9680.5828內層線寬公差PD-7A微影課+1mil0.2067-0.45610.