Viasystem SPC参数表

SPCParameterTableTITLE:SPCDOC.STAUSREF:QAI020TABLE11ProcessProcessOperationControlCharacteristicsSpec.LimitsReferenceDocumentsSampleSizeFrequencyChartTypeResp.PartyRemarksDevelopingNa2CO3conc.once/eighthoursChartforeachlineNa2CO381I&MRChem.labChartfor1lineonceashift&1I/LEtching1#,100-140g/LChartforeachlineEtching3#150-190g/LLinewidth/spacingLineWidth4.6milrefertoMI5PCs/OnceOnceaShiftX&R/LineSpacing6.8milMI5&1#&3#,1OZOnceaShiftX&RChem.labEtchinglineforsingleside&EtchingtankOnceashiftBlackoxideI&MRChem.labB.OtankTwotimesashift&TgTest(multylayer,afterbaking)T3I&MRTg(()&PressingLaminationPressingthkbias.±0.14(M187)1Pnl/OnceonceadayPRODForP/Nsofcentervalue60milorsowithoverallthk±0.13(M595/596)RefertoMI5Points/PnlX&Rsamerequirements.Chartforeachmachine±0.127(M138/842)MI15&60miLP/NSPCQAI107-1/08-11146-52G/LProcessParameter(Input)1#,3#0.9-1.3(%)NPSCu2+150-190g/lChartfor1#&3#LinewiththesamerequestoftestLineontheedgeofSomeP/Ns,For1OZCuthkKalexMulti-LayerCircuitBoard(Zhongshan)Ltd.ASubsidiaryofViasystemsGroupInc.QC-ISS.-REV.23-1PAGE1OF13SPCParameterTableSPCPHCu2+7.8-8.3MEI029111MEI09440-70G/L11QAI012MEI030271SPCParameterTableTITLE:SPCDOC.STAUSREF:QAI020TABLE11ProcessProcessOperationControlCharacteristicsSpec.LimitsReferenceDocumentsSampleSizeFrequencyChartTypeResp.PartyRemarksDrillingDrillingHoletruepositionbias1PCs/once,5Point/pnlonceaweekI&MRChartforeachmachine,eachspindleinturn.(XshaftYshaftpartchart)1,5&(XY)PTHPTHRate1#15-25u2#(H)45-65u(L)18-25uMEI014CalculateCpkbasedonpreviousDesmearRateMEI014MEI05525PointsmonthlyDeamearMEI05525CpkKMnO41#40-60g/L2#50-60g/LPTH1#2.0-2.8g/LMEI0142#1.8-2.2g/LMEI055ChartforeachLine1#,4.0-5.0g/LFourtimesadayI&MRPTHtank2#4.0-6.0g/L4&1#11.5-13.5g/L2#7.0-9.0g/L1#17-30g/lChartforeachLine2#0.11-0.13M,1#EDTACoppertankFor1#and2#line:U+U+(0.5-2.0)ml/LChartforeachLineCalculateCpksolution12:U+2001-A(1.0-2.0ml/L)OnceaweekI&MRChem.labbasedonprevious25pointsperhalfyearPanelFor3#line:20012001-C(5.0-8.0ml/L)&25Cpkplating3:2001CuplatingCusurfacethk.Referto5PCs/Line,1Point/pnlOnceadayX&RChartforeachlineagainstHoz0.75~1.25milMEI0015&QAandfirstpanelplatingboards.MEI001,ozDevelopingNa2CO3conc.onceashiftI&MRChem.labO/LD/FNa2CO3&ChartforeachlineLinewidthandspacingcheckingLinewidth/spacingLineWidth6.6(mil)refertoMEI//LineSpacing7.0(mil)MIQAI107-1/08-1ISS.-REV.23-1Cu2+QCN/A40-100uProcessParameter(Input)SPCChem.LabPAGE2OF13MEI001HCHOKalexMulti-LayerCircuitBoard(Zhongshan)Ltd.ASubsidiaryofViasystemsGroupInc.PROD3.0milMEI0150.8-1.2(%)X&R&111NaOHEDTAMEI05511MEI0341onceashift5PCs/once,1Point/pnl5,MEI014111-SPCParameterTableSPCParameterTableTITLE:SPCDOC.STAUSREF:QAI020TABLE11ProcessProcessOperationControlCharacteristicsSpec.LimitsReferenceDocumentsSampleSizeFrequencyChartTypeResp.PartyRemarkspredispose2TimesaweekChartforeachlineCutankI&MRChem.labFor1#line:20012001-A(1.0-2.0ml/L)&ChartforeachM/CCalculateCpkPatternCoppertank1#:20012001-C(5.0-8.0ml/L)Onceaweekbasedonprevious25pointsperhalfyear.platingsolutionFor2#and3#line:CPCP-A(0.5-2.0ml/L)25Cpk2#3#:CPCP-C(10-60ml/L)Platingthk.Holewallcopperthk.1#,2#1milReferto5PCs/once,1Point/pnlonceashiftX&RChartforeachlineperformance3#1~2milMI5,&PQA4#0.8milMICU2+115-135g/lOnceashiftI&MRChem.labChartforeachlineEtchingCl-4.0-5.0NMEI0171&O/LetchingPH7.8-8.4LinewidthandLinewidthandspacingLineWidth6.2±1.2mil5PCs/onceonceashiftX&RspacingcheckingLineSpacing3.9mil1point/pnl&QCMI5,1DevelopingNa2CO3conc.onceper6hoursChem.labChartforeachlineW/FNa2CO36I&MRBeforeW/FIoniccontaminationtest6.01PC/onceonceaday&phy.labugNaCl/inch21GoldInspectionNithk.150Referto1.Chartforeachline/fingerstation()MI3PCs/once,2Points/pnlonceadayX&R2.SelectP/NswithsamereqsandQCGoldthk.30MI3,2&measurementlocationofG/F.()P/NQAI107-1/08-1110.8-1.2(%)PAGE3OF13Cl-40-60g/L40-70ppMMEI016NPSrefertoMIASubsidiaryofViasystemsGroupInc.-ISS.-REV.23-11SPCProcessParameter(Input)SPCParameterTableQCKalexMulti-LayerCircuitBoard(Zhongshan)Ltd.QAI0121MEI018SPCParameterTableTITLE:SPCDOC.STAUSREF:QAI020TABLE11ProcessProcessOperationControlCharacteristicsSpec.LimitsReferenceDocumentsSampleSizeFrequencyChartTypeResp.PartyRemarksActivitortankOnceashiftImmersionNiNi2+5.2-6.2g/lTwotimesashiftI&MRtank&AutomaticImmersionOnceashiftgoldeAutank3PCS/once1Points/PanelNitank5,1HALSnContent3TimesaweekChem.labChartforeachlineHALSn3I&MRAfterHALIoniccontaminationtest6.0onceaday&phy.labugNaCl/inch2RoutingoutlineOutlinedimension±5(mil)RefertoMI1PCS/once,4Points/pnl(tolerance)R02#:±8(mil)MI1,4Routing()R12#:±4(mil)OnceadayX&RChartforeachmachineV-CutV-Cutremaindimension±5RefertoMI5PCS/Once&QCV-bias(mil)MI5V-FinalQCWarpageWarpageRefertoMI5PCS/OnceOnceadayX&RForP/Nswithsame1%MI5&requirementsandSMTPADSMTPADP/NEntekEntekTwotimesashiftI&MRChem.labForCu-106Tanker&Cu-106QAI107-1/08-1Nitank100-3006264%PH12.6-2.8MEI051KalexMulti-LayerCircuitBoard(Zhongshan)Ltd.QCPAGE4OF13ISS.-REV.23-1SPCParameterTableAuthk2-7OnceadaySPCMEI020RefertoMIMIQAI0121Au+1.5-2.5g/lMEI083MEI0834.6-4.91Chem.lab1ASubsidiaryofViasystemsGroupInc.X&R&QCMEI0831-ProcessParameter(Input)Pd+PH90-130PPm1SPCP