D--All-DFM-DFM-Rule-DFM--中英版-02-04-02[1]

DFM(DESIGNFORMANUFACTURE)1.00SCOPE(目的)2.00BOARDSIZE(成形板尺寸)3.00FIDUCIALMARK(基準點)4.00SOLDERMASK(防焊漆)5.00SILKSCREEN(文字面)6.00TOOLINGHOLE(定位孔)7.00PLACEMENTNOTES(零件佈置)8.00PLACEMENTNOTESFORBGA(BGA佈置)9.00ROUTINGNOTES(佈線)10.00SPACING(間距)1.0SCOPEDesignformanufacturingistheprinciplerulethatsuggeststhatyoucanimproveefficiencybyminimizingthenumberofpartsthathavetobeassembledsothattheyarecosteffectiveandeasytomake.Intoday’sworld,inordertokeepupwithorbeaheadofthecompetitionitisnecessarytodevelop,produceandpromoteproductsinshorterperiodseverytime.Manufacturabilityisthepracticeofdesigningcircuitboardproductsthatmeetnotonlythecapabilitiesofthecustomer’sassemblymanufacturingprocessbutalsothecapabilitiesoftheboardfabricationprocess.Someofthebenefitsofdesigningformanufacturabilityare:HigherqualityReducedleadtimesLowerlaborandmaterialcostsHigherfirstpassyieldsMinimizedenvironmentalimpact2.0BOARDSIZE(成形板尺寸)2.1机构图应标示容许公差范围2.1Showacceptabletolerancescopeonmechanicaldrawing2.2PCB实际成形尺寸公差:+-0.010inch(0.254mm)2.2PCBactualsizetolerance:±0.010inch(0.254mm)2.3PCB尺寸限制:2.3PCBsizelimitationPCBThickness:0.5~4mmMAX:330mmX250mm最大MIN:50mmX50mm最小Distortion:0.5mm变形量ForPanasert机器之限制另外还需考量波峰焊锡炉之限制ForUniversal机器之最大boardsize限制为:510mmX460mm由于M/I过WaveSoldering超过280mmX300mm时,容易造成弯板现象,所以也请参考PleaseconsiderthelimitationofPanasertmachineandofWavesolderingstove,andthatPCBbendingcasewillhappenwhenPCBsizeexceeds280mmX300mmandwavesolderingongoing.2.4板边邮票孔之尺距定为15mil以上,孔径φ20mil以上,以增加支撑力2.4ThedistancebetweenstampholesonPCBedgeshouldexceed15mil,anddiameterexceeds20miltoincreasesustainingability.2.5若小于80mmX50mm或小片卡(如:VGAcard,NETcard……等)以多联片板制作,若连片有部分不良情形,保留Panel标示不良之独立片,分开包装交货2.5PleasemanufacturethePCBasmulti-sheetPCBifPCBsizelessthan80mmX50mmorit’sscrapPCB,suchasVGAcard,NETcard,andsoon.Ifpartofonemulti-sheetPCBhavedefect,pleasereservethepanel,andmarktheindividualdefectivePCB,atlast,deliverorderwithplacingthedefectivePCBintodifferentpackage.2.6以多联片制作时,长板边至少需要预留大于5mm以上,FIDUCIALMARK则以使用原PCB上之FIDUCIALMARK.2.6TheresidualPCBlengthonlongedgemustexceed5mmformulti-sheet,andfiducialmarkneedn’tchange.3.0FIDUCIALMARK(基准点或称光学定位点)为了SMT机器自动放置零件之基准设定,因此必须在板子四周加上FIDUCIALMARKFIDUCIALMARKshouldbeaddedonallfoursidesofPCB,becausetheyarefiducialsymbolforauto-placingcomponentswithSMTmachine.3.1FIDUCIALMARK之形状,尺寸及SOLDERMASK大小3.1FIDUCIALMARKshape,sizeandSOLDERMASKsize3.1.1FIDUCIALMARK放在对角边(1φ,3φ,3φ)3.1.1Pleaselayoutfiducialmarkontheoppositeangleside(1φ,3φ,3φ)φ1mm为喷锡面Withinφ1mm:Copperpadφ3mm为NOMASKWithinφ3mm:NoMASKφ3mm之内不得有线路及文字Withinφ3mm:Notraceandtext3.1.2φ1mm的喷锡面需注意平整度3.1.2Pleasepayattentiontotheplanarityofcopperpadwithinφ1mm.3.2FIDUCIALMARK之位置,必须与SMT零件同一平面(ComponentSide),如为双面板,则双面亦需作FIDUCIALMARK3.2Thepositionoffiducialmarkshouldbeonthesameside(componentside)withSMTtypecomponent,pleaseplacefiducialmarkonbothside(componentsideandsolderside)ifplaceSMTtypecomponentsonbothside.3.3FIDUCIAL放在PCB四角落,边缘距板边至少5mm3.3PleaselayoutfiducialmarkonPCB’squadcorners,andtheedgeoffiducialmarkshouldhave5mmclearancetothePCB’sedgeatleast.3.4板边的FIDUCIALMARK需有3个以上,若无法做三个FIDUCIALMARK时,则最少需做两个对角的FIDUCIALMARK3.4PleaselayoutthreefiducialmarksormoreonPCB’sedge,iffailtoplacethreefiducialmarksonPCB,pleaseplacetwofiducialmarksontheoppositeanglesideofPCBatleast.3.5所有的SMT零件必须尽可能的包含在板边FIDUCIALMARK所形成的范围内3.5PleaselayoutallSMTtypecomponentsintothearea,whichisencompassedbythefiducialmarksonPCB’sedge.3.6PITCH20mil(含)以下之零件(QFP)及BGA对角处需加FIDUCIALMARK,25mil之QFP不强制加FIDUCIALMARK.但若最接近PCB四对角处之QFPPITCH为25mil(非20mil以下)该零件亦需加FIDUCIALMARK.7.6.1FIDUCIAL喷锡面外围1mm内(即φ3mm内)不得有任何线路或文字7.6.2FIDUCIAL喷锡面外围2mm内(即φ7mm内)不得有任何零件(指CHIPS零件,非QFP零件)3.6Thecomponentswiththepitchunder(include)20milmustaddFIDUCIDLMARKattheoppositecornerofQFPorBGA.ItisnotnecessarytoaddFIDUCIALMARKatthecomponentsofQFPwith25milpitch.ButweshouldaddFIDUCIALMASKifthelengthofthepitchofQFPtotheanycornerofmotherboardwithin25mil(not20mil).3.6.1Theremusthaven’tanytraceorcommentswithin1mm(3mil)atthestannousflatofFIDUCIAL.3.6.2Theremusthavenotanycomponent(whichischipscomponent,isn’tQFPcomponent)within2mm(7mil)atthestannousflatofFIDUCIAL.4.0SOLDERMASK(防焊漆)4.1任何SMDPAD之SolderMask,由pad外缘算起3mil+-1mil作SOLDERMASK.4.1AnySolderMaskofSMDPADshoulddoin3mil±1milfromtheouteredgeofPAD.4.2除了PAD与TRACE之相接触任何地方之SolderMask不得使TRACE露出4.2Excepttheplacethatthepadconnectswiththetrace,thesoldermaskcan’texposurethetraceatanywhere.4.3SMDPAD与PAD间作MASK之问题:因考虑SMDPAD与PAD间的密度问题,除SMD(QFPFinepitch)196PIN&208PIN不强制要求作MASK,其余均要求作MASK4.3TheissueofdoingmaskbetweentheSMDPADandPAD:WeshouldtaketheissueofdensityoftheSMDPADandthePADintoaccount;itisnecessarytodoMASKallthecomponentsexcepttheSMD(QFPFinepitch)with196pinsor208pins.4.4SMDQFP,PLCC或PGA等四边皆有PAD(四边有PIN)之方形零件底下所有VIAHOLE均必须作SOLDERMASK,及该零件底下之VIAHOLE均盖上防焊漆4.4AlltheVIAHOLEthatundertheSMDcomponentofQFP﹑PLCCorPGAwhichhavepadsatfourside(havepinsatfourside)shoulddosoldermask,andtheVIAHOLEunderthecomponentshouldcoverbythesoldermask.4.5测试点之防焊4.5thesoldermaskofthetestpoint:4.5.1仍以ComponentSide测试点全部防焊但不盖满,且SolderSide不被SolderMask盖到,为最佳状况4.5.1Thebeststatusofthesoldermaskisallthecompon