软硬结合板简介及关键参数介绍

Rigid-FlexPresentation2Content:MaterialIntroductionDesignruleStandardProcessFlowOpenDiscussion31.軟板基材薄膜種類聚脂樹脂(Polyester,PET)-尺寸熱安定性不如PIAramid纖維布-高吸水性，單價及使用性並不理想強化型介電材料–撓曲性較差且供應者與使用者不多氟素樹脂膜-無法在高溫下維持尺寸的穩定聚亞醯胺樹脂(Polymide,PI)-熱聚合後仍保一定柔軟與彈性，同時在很寬的操作範圍下有不錯電氣特性故最常使用。MaterialIntroduction42.聚亞醯胺基材種類依軟板結構分為兩大類1.有接著劑三層軟板基材(3LFCCL)2.無接著劑二層軟板基材(2LFCCL)兩者分屬不同製造過程，製造方式與材料特性不同。3L應用在大宗軟板產品，2L用在較高階軟板製作上，例：軟硬複合板、COF。＊以單面板為例COPPERPI銅箔基板(FCCL)＊高尺寸安定需求＊高密度線路需求＊耐化性需求＊電氣特性需求＊耐燃性需求＊環保需求COPPERAdhesivePI銅箔基板(FCCL)2L-FCCL3L-FCCLMaterialIntroduction52-1.聚亞醯胺薄膜簡介聚亞醯胺薄膜(Polyimide,簡稱PI)，外觀呈黃棕色，是由芳香族的雙酐類及雙胺類合成聚亞醯胺酸高分子(簡稱PAA)，之後經高溫熱化脫水形成。2-2.品目型號說明各家標示項目不盡相同，以台虹3L-FCCL為例：MaterialIntroduction63.2L-FCCL製造方式與比較ProductionMethodCross-Section塗佈法(Casting)濺鍍法(Sputtering)壓合法(Lamination)ChillrollPIfilmTargetVaccumChamberPAAHeaterPAAHeaterCopperfoilPlatingCuSputtermetalPIfilmCopperfoilPAACopperfoilTPIPIfilmMaterialIntroduction73.2L-FCCL製造方式與比較方法塗佈法(Casting)濺鍍法(Sputtering)壓合法(Laminate)銅箔選擇性ED,RA限EDED,RA銅箔厚度薄銅(9um)有良率問題可自由控制厚度薄銅(9um)有良率問題雙面板製造性較複雜與困難相對容易相對容易接著特性優尚可優生產性優差尚可基板透明性尚可(有改善空間)優優成本低高中生產廠商代表NipponSteel（新日鐵）SumitomoMetal(住友）Ube(宇部興業)MaterialIntroduction8資料來源：JMS；工研院IEK-ITIS計劃(2004/3)4.全球FCCL廠商3LFCCL/2LFCCL概況ManufacturerAdhesivetypeAdhesivelesstypeARISAWA●◎TORAY●NipponSteel(新日鐵)●NIKKAN●NipponMektron(NOK)●UBE(宇部興產)●MitsuiChemical(三井化學)●Dupont(杜邦)●●3M●THINFLEX(台虹)●●表量產◎表小量產、試產或送樣中MaterialIntroduction9CVLCoverlayStructureRemark1.Protectcircuit2.IsolationPIfilmAdhesiveReleasepaperMaterialIntroduction10StructureRemark◎PPNon-floworLow-flowPP◎BSThickness:15um,25um,40umBondingmaterial1.‧PPPrepreg1.‧BSBondingsheetReleasepaperAdhesivePETfilmEpoxy&GlassfiberMaterialIntroduction11EMImaterial1.‧SilverfilmStructureRemarkEx:SF-PC5000SF-PC1000(32um)SF-PC5000(22um)SF-PC5500(22um)MaterialIntroduction12Content:MaterialIntroductionDesignruleStandardProcessFlowOpenDiscussion13A.WorkingPanelSizePopularWorkingPanelSizeB.Usablearea,Border(A,B)andRoutingPath(C)StructuretypeMIN.AMIN.BMIN.CMIN.C*InchmmInchmmInchmmInchmmPCB(1press)0.4711.430.6516.510.12.540.3~1.07.62~25.4PCB(2press)0.5513.970.7017.780.12.540.3~1.07.62~25.4HDI(1press)0.5513.970.7017.780.12.540.3~1.07.62~25.4HDI(2press)0.6516.510.8020.320.12.540.3~1.07.62~25.4HDI(≧3press)0.7519.051.0025.40.12.540.3~1.07.62~25.418X20inch457.2x508mmWidthXLengthYCCABPCBPCBPCBPCB*PCBwith1.G/FDesign2.ImpedancecouponDesignRule14Optimized.ArraySize16“X19.685”4.4212“x4.6”(77%)3.517“x4.6”(77%)4.4212“x3.425”(77%)3.517“x2.72”(76%)17“X19.685”4.4212“x4.8”(76%)3.517“x4.8”(76%)4.4212“x3.675”(77%)3.517“x2.92”(76%)18“X19.685”4.4212“x5.1”(76%)3.517“x5.1”(76%)4.4212“x3.925”(78%)3.517“x3.12”(77%)PaneltypePanelsizeOptimizedPanelUtilizationDesignRule15NFPrepregNFPrepregFCCLNFPrepregNFPrepregL1L2L3L4L5L6FlexareaRigidAreaTransitionZoneRigidAreaDesignRule16FCCLFCCL:FlexCopperCladLaminateCVL:CoverlayerStiffener:FR4/PI/StainlessbaseReinforcementLowflowPrepreg:ResinscaleflowlowerthannormaltypeBS:BondingSheetSF:SilverFoil(EMIshielding)PartialCVLComponentonflexPlusII-stackviaSqueezeout(fromLowflowPrepreg)Terms&Definition:DesignRule17UMTStandardUMTAdvanced1eSMTpad(edgeofpad)toboardedgespacingRigid/Flex400um300um2dShieldcan(edgeofground)toboardedgespacingRigid/Flex300um200um3dGroundplanetoboardedgespacingRigid/Flex300um200um4dPowerplanetoboardedgespacingRigid/Flex300um200um5cTrace(edgeoftrace)toboardedgespacingRigid/Flex400um250um6aMicro-via(edgeofpad)toboardedgespacingRigid/Flex400um300um7bPlatedthroughhole(edgeofpad)toboardedgespacingRigid/Flex400um300um8bNonplatedthroughholetoboardedgespacing(nopad)Rigid/Flex300um200um9bBuriedvia(edgeofpad)toboardedgespacingRigid/Flex400um300umdFlexAreaBoardedgeBoardedgeabcFlexAreaBoardedgeBoardedgeeFlexAreaBoardedgeBoardedgeTraceandcomponentpadattransitionzone:DesignRule18UMTStandardUMTAdvanced10FAdhesivesqueezeoutRigid/Flex0.80mm0.50mm11GMinimumflexwidthFlex2.00mm1.00mm12HFlexoutlineradiusFlex1000um500um13IMillingpathRigid/Flex1.00mm0.80mmGHRigidPCBRigidPCBFIFlexareaMechanicaldesignattransitionzone:DesignRule19ItemDesignIssueUMTStandardGuidelineUMTAdvancedGuidelineS1MinimumS1bendingtoboardedgedistance1.00mm0.80mmS2minimumflexiblearea(edgeofFPC)toboardedgespacing2.00mm1.50mmS1FlexibleareaRigidareaS2Mechanicaldesignattransitionzone:DesignRule20RigidsectionRigidsectionPunchwithharddierequirement,UMTsuggesttoplaceradius0.50mm.(Changefromrightangletoradius.OnlyUVlasercuttingcanmakeitrightangle.)BeforeBeforeAfterAfterMechanicaldesignforflexradius:DesignRule21RigidsectionRigidsectionRadiusonly0.2mmPunchwithharddierequirement,UMTsuggesttoplaceradius0.50mm.(Changefromrightangletoradius.OnlyUVlasercuttingcanmakeitrightangle.)BeforeAfterMechanicaldesignforflexradius:DesignRule22UMTsuggesttomakethiswasteslotasmin.1.50mmwide.RigidsectionRigidsection1.25mmNominal2.00mmOrmin.1.50mmBeforeAfterMechanicaldesignforflexoutline:DesignRule23UMTsuggesttomakethesecornersasfullradius.RigidsectionRigidsectionKeypoints:Thequalityofappearanceinspectionforthesecornerswillbebetter.(Burr-bothrigidandflexmaterialwillbelessthanpreviousde