某电子芯片厂洁净室华夫板施工技术_王永好

20104394CONSTRUCTIONTECHNOLOGY37518000。。、、、、、、。TU755.2A1002-8498201004-0037-03ConstructionTechnologyofWaferboardUsedinElectronicChipPlantCleanRoomWangYonghaoLiQizhiShenzhenConstructionEngineeringCompanyofChinaConstructionSecondEngineeringBureauLtd.ShenzhenGuangdong518000ChinaAbstractBecauseoftechniqueandaircleanlinessrequirementwaferboardisadoptedincleanroomofelectronicchipplant.Normaloperationofacleanroomliesonhighconstructionqualityofwaferboard.Combiningwithprojectexampletheauthorsintroduceconstructionmethodandkeypointsofwaferboardfromsomeaspectsofslabsettingscaffolderectingandformworkinstallingwaferboardinstallingsteelbarbindingofribbeamconcretepouringscaffoldandformworkdismantlingandwaferboardcleaning.Keywordselectronicchipplantcleanroomwaferboardcon[e-mail]1Fig.1Waferboardfloor、。。FRP1。FAB15。1FAB15347m2。。2～3④～瑐瑡100④～瑐瑡3。④～⑨500mm、⑨～瑐瑡600mm、350mm、600mm250mm×500600mm。2。12000m2。2。3m×3m3mm。38392Fig.2Standardsix-holewaferboardformwork3→→→→→→。3.1。。。。3.26.6m。。1.0m、1.2m100mm×100mm50mm×100mm。12mm。“”3m×3m3mm。①、②③④、。3.312mm。2。。。300。1h1～2。。3①②。3.4250mm500～600mm、。、、、。。。①②③④⑤。3.512mm3m×3m3mm。2010No.439。3～5mm。6m×6m600mm+20cm。5mm。2500～600mm、2h。。10mm。。32m6m。。3mm。4。。250mm。4h、5mm。①②③④。。。5500～600mm4～6h。6①3～5d。②。③FRP。3.6。。。3.7。。①②③④。4。1.GB50204-2002S.2002.ChinaAcademyofBuildingResearch.GB50204-2002CodeforacceptanceofconstructionqualityofconcretestructuresS.BeijingChinaPlanningPress2002.inChinese2.J.2008373.ChenMingliu.ConstructiontechnologiesofcleanroomchessslabJ.ConstructionTechnology2008373.inChinese3.FRPJ.2008S1.SunQiongWanKun.ApplicationofwaferboardinworkshopJ.ConstructionTechnology2008S1.inChinese4.D.2009.DingHaitao.StudyonwaffleslabintheconstructionofelectricchipplantanditsapplicationD.Xi’anXi’anBuildingTechnologyUniversity2009.inChinese5.J.20093.ZhangYong.ConstructionmethodofchessslabJ.ScienceandTechnologyInnovationHerald20093.inChinese6.D.2009.QianJun.AnalysisandstudyonkeyproblemsaboutconstructionofwaffleslabD.ChongqingChongqingUniversity2009.inChinese