DOE-For-Reflow

DOEExperimentReportItem:ReflowProfileParameterSetDate:2006-May-15TeamLeaderHaifenghuTeammember:LijiangXieCanhuiXiaAnneyPang自SMT無鉛工藝導入以來﹐因無鉛錫膏的成份的變化以及錫粉顆粒的更加細小化﹐給我們的回焊站帶來了一系列的不穩定的品質問題，如下：一.短路二.空焊問題陳述使用DOE工具，幫助找出最佳最合理化的ReflowProfileParameter設定,確保SMT回焊站產品品質的穩定性﹐以達到降低DPPM并解決空焊﹐短路缺陷。實驗目的實驗步驟Step1:實驗條件制定ProductLineLine7Model5213MBPasteSolderTLF-204-19AMachineESRAHotflow9實驗步驟Step2:實驗因子&水准制訂FactorLevel(-1)Level(0)Level(+1)RaiseTempRate(From40°Cto150°C)1.0°C/Sec2.5°C/Sec4.0°C/SecWarmTimes(From150°Cto200°C)90Sec120Sec150SecPeakTemp238°C245°C255°CInputOutputResponseVMIDPPM實驗步驟Step3:實驗計划RunOrderStdOrderBlocksRTR(RaiseTempRate)WT(WarmTimes)PT(PeakTemp)13119025521512.512025531612.515023842014902455261415024562414120255725141502388811150245951112024510711150238111112.590245121119023813411120238141212.590255151412.51202451621190245172314120245181712.51502451927141502552021149025521221412023822191490238231012.590238241312.5120238251812.51502552691115025527611120255實驗結果項次組合短路空焊VMIDPPM抽樣數(pcs)1500010850200+1201750110-10111750180+1002175030+1-12126509-10021265016-1-1021265017+10021265026-1+1+112265027-10+13026501-1-1+13134505+1+103134508-1+10223450項次組合短路空焊VMIDPPM抽樣數(pcs)10-1+1-131345013-10-1313450140-1+122345020+1-1+113345022+1-1-1133450230-1-13134502400-1313450250+1+14034504+1-104143506+10+13243507+1+1-141435012-1-1-123435019+1+1+132435021+10-1324350實驗結果(續）通過ANOVA分析﹐從上表可得知:RaiseTempRate(RTR)﹕P0.05(P=0.005)WarmTimes(WT):P0.05(P=0.001)PeakTemp(PT):P0.05(P=0.005)這說明以上三個因子對DPPM有影響。總結從實驗結果得知000組合為最佳參數FactorRateOptimumSetupRaiseTempRate(From40°Cto150°C)190.74/896.30=21.3%2.5°C/SecWarmTimes(From150°Cto200°C)246.30/896.30=27.5%120SecPeakTemp190.74/896.30=21.3%245°C