AWR_RFPCBDesign

RFPCBDesign1HenryLauLexiwaveTechnology,IncDecember4,2012AWRCorporation–Overview&IntroductionAWR-AtaGlanceTheInnovationLeaderinHigh-FrequencyEDAProductPortfolio:•MicrowaveOffice™-MMIC,RFPCBandmodule•VisualSystemSimulator™-Wirelesscomms/radar•AXIEM®-3DplanarEM•AXIEM®-3DplanarEM•AnalogOffice®-RFICGlobalPresence(directoffices)•LosAngeles,California(headquarters)•California,Wisconsin,Colorado•UnitedKingdomandFinland•Japan,KoreaandChina12/3/2012MicrowaveOffice•MMIC•RFPCB•ModulesRFandMicrowaveDesignSoftware12/3/2012MicrowaveOfficeforPCBDesign•Unifiedschematic&layoutforeasydesignentry,simulation,optimization,tuningandexporttomanufacturing•Versatilesimulationtechnology:–APLAC®-HarmonicBalance–ACE™-AutomatedCircuitExtractionAlcatel-LucentReducesDesignTimebyEliminatingFiletranslationIssuesBetweenPCBandHigh-FrequencyDesign”TheintegratedflowbetweenthementorandAWRtoolshasenabledustosignificantlycutourdesigntimes.ByconcurrentlydesigningtheRFcircuits12/3/2012–ACE™-AutomatedCircuitExtraction–AXIEM®–3DPlanarElectromagnetics–Analyst™–3DFEMElectromagnetics•PCBlinkstothird-partytoolsforpost-layoutverification–CadenceAllegro,–MentorExpedition,–ZukenCR-5000/8000–Altium,Intercept,andmore…concurrentlydesigningtheRFcircuitsinthecontextoftherestofthePCB,wecanalsoreduceourdesignandmanufacturingrespins,whichhelpsusmeetaggressivetime-to-marketgoals..“XavierLeblanc,HarwareToolsManagerAlcatel-Lucent•BenchtopmillingmachinesPCBprototypingwithLPKF•Benchtopmillingmachines•Lab-readylasersystems•SMTassemblyequipment•OntheflyrevisionsPCBsondemand•Ontheflyrevisions•Multipleiterationsinasingleday•Beatyourdeadlines•Visitwww.LPKFUSA.comtolearnmoreNextlevelprototyping•Visitwww.LPKFUSA.comtolearnmoreRFPCBDesignHenryLauLexiwaveTechnology,Inc9•ToacquiretechnicalinsightsanddesigntechniquesonRFprintedcircuitboarddesignforWirelessNetworks,ProductsandTelecommunicationAims10Telecommunication*PCBofRFcircuits*PCBofdigital,analogandaudiocircuits*DesignissuesforEMI/EMC*DesignformassproductionCopyrightContentsPrintedCircuitBoarddesignofRFcircuits-Fromproductideatomassproduction-Designflow-Layerstackassignment-Boardsizeandarea-Componentplacement-GroundingMethod-Powerrouting11-Powerrouting-Decoupling-Tracerouting-Viaholes:location,sizeandquantity-ShieldingCopyrightFromProductIdeatoMassProductionProductDefinitionGenerateTechnicalSpecificationComponentSelectionCircuitDesignPCBDesignEngineeringSamplePre-productionSampleMassProductionProductperformance&EMCpassfailfailMechanicalDesignSystemMechanical,ElectricalandSoftwareEngineeringProductperformance&EMCpass12CopyrightfailfailPCBfailcircuitfailLongcycletimeprocessSimulationSoftwareDesignCooperationBetweenMechanical&ElectronicDesignCaseStudy:SamsungCellphone•Marketingconcerns•Outlook,features•Cost•Electricalperformanceconcerns13•Electricalperformanceconcerns•Receptionreliability•Sensitivity•Talktime•Stand-bytime•EMCconcerns•Transmitpowersandduration•ESD•ImmunitytestsCopyright•Typeandlocationofloudspeaker,microphone,display,keypad,switch•Typeofbattery•LocationofI/OCooperationBetweenMechanical&ElectronicDesign14•LocationofI/O–antenna,power,analog,audio,digital....•Mountingmethod–screwandmountingholes,supportpoles–mechanicalreliabilityanddroptestCopyright•Maximumthickness•Maximumboardsizeandoptimalshape−maximumspaceutilization•PowersupplyandlargeCooperationBetweenMechanical&ElectronicDesignAntennacontactRFconnector15•Powersupplyandlargecurrentconnections•Massproductionconcerns•easyassembly,alignmentandrepairCopyright•Circuitgroupingandpartitioning•Audio,video,digital,RF,CooperationBetweenMechanical&ElectronicDesignRFTransceiverAudioRFPoweramplifierLCDDriverRFFilterConnector16digital,RF,analog•BoardmountingandassemblyCopyrightPowerMemory&DigitalCooperationBetweenMechanical&ElectronicDesignKeyPad17CopyrightMembraneVeryfewcomponentsonbottomlayerCooperationBetweenMechanical&ElectronicDesignCamera18CopyrightCameraSpeakerLCDModule•Shieldingandisolation•Method,material•EMI/EMC/ESDissuesCooperationBetweenMechanical&ElectronicDesignMetallizationonplastic19CopyrightLayerStackupAssignment•Single-layerPCB*Typicalthickness:1.6mm,1.2mm,0.8mm,0.6mm*Cheapest*SampleTurn-aroundtime-about3days*Componentmountingoccupiesmostarea*Mostdifficulttodesign20ComponentsideSoldersidesurfacemountcomponentsthru-holecomponentsCopyright*Mostdifficulttodesign•Single-sidePCB*Groundandpowerroutingisverycritical*Largercurrentcircuits-closertopowersource;lownoisecircuits-farfrompowersource*MetalshieldservesasauxiliarygroundLayerStackupAssignment21RFamplifierinashieldboxCopyrightTVsignalboosterRFamplifier+PowerSupply•Single-sidePCBLayerStackupAssignmentSafetyissueonACboardSMT+Leadtypecomponents22TVModulatorInputShieldingwithcoverCopyrightLayerStackupAssignment•Double-sidePCB*Pricecompetitive*SampleTurn-aroundtime:1week*Toplayer:componentmountingandmajorsignaltracings*Bottomlayer:primarilywithgroundplanepowertrace*PutSMD/THmixedcomponentdesignononesidetosaveproductioncost23ToplayerBottomlayersurfacemountcomponentsthru-holecomponentssurfacemountcomponentsCopyrightV