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项目序号内容制程能力1最大工作板尺寸(英寸)36*48;40*48;42*482完成板厚度(MAX)7.0mm3最大厚径比14:14最大层数60L5成品板厚公差(板厚≥0.8mm)±8%6板翘曲MAX0.5%,不对称层压结构需1.5%7两面图形对准公差±0.035mm8层间对准度(≥2张芯板,Min)0.05mm9板边离线路的距离(Min)0.40mm(初级)0.50mm(次级)10初级与次级介质层厚度(Min)0.40mm。(次级)1最大铜厚10oz0.5oz:3.5mil/3.5mil(0.09/0.09mm)样品:3.0mil/3.0mil1.0oz:4mil/4mil(0.10/0.10mm)样品:3.5mil/3.5mil2.0oz:4mil/6mil(0.10/0.15mm)样品:3.5mil/5.5mil3.0oz:5.0mil/7mil(0.13/0.18mm)样品:4.5mil/7.0milPCB(厚铜)制程能力2内层线宽/线距(Min)基材铜箔4.0oz:6.0mil/8.5mil(0.15/0.22mm)样品:5.5mil/8.5mil5.0oz:7.0mil/10mil(0.18/0.25mm)样品:6.5mil/10mil6.0oz:7.0mil/12mil(0.18/0.30mm)样品:6.5mil/10mil1.0oz:4mil/4mil(0.10/0.10mm)样品:3.5mil/3.5mil2.0oz:4mil/6mil(0.10/0.15mm)样品:3.5mil/6mil3.0oz:5.0mil/7mil(0.13/0.18mm)样品:4.5mil/7.0mil4.0oz:7.0mil/9.5mil(0.18/0.24mm)样品:6.5mil/9.5mil5.0oz:7.0mil/11.0mil(0.18/0.28mm)样品:6.5mil/11mil6.0oz:7.5mil/12.5mil(0.19/0.32mm)样品:7.0mil/12.5mil孔与孔的距离(Min)0.25mm内层孔与轮廓的距离(Min)0.30mm次级0.6mm初级内层连接孔(Min)0.40mm(成型孔),0.35(电镀后的孔径)0.7焊盘次级过孔次级过孔在线圈内要做埋孔处理3-4层板:0.15mm5-9层板:0.17mm≥10层板:0.20mm6内层线路公差(Min)±10%2内层线宽/线距(Min)5内层孔到线3外层线宽/线距(Min)4铜箔7内层阻抗控制公差±10%1孔径(Min)机械钻孔Φ0.15mm2孔位精度±0.05mm3NPTH孔径公差(圆孔)+/-0.0254mm4NPTH孔径公差(Slot槽)槽宽:±0.05mm;槽长:±0.08mm5扩孔孔径公差±0.08mm6沉头孔深度公差±0.15mm7沉头孔制作角度90°-180°1防焊对位精度±0.035mm绿色、蓝色、红色、黄色油墨:0.3mm白色、黑色油墨:0.10mm;基材上:高度1.2mm*线宽0.15mm;铜面上:高度1.2mm*线宽0.25mm。4防焊负字间距(MIN)0.1mm5防焊字符油墨块宽度(MIN)0.25mm(沉锡板),0.08mm(其它表面处理)1字符与焊盘的间距(MIN)0.13mm2字符线宽(MIN)0.08mm防焊2防焊绿油桥(MIN)3防焊负字(MIN)字符钻孔铜箔3字符尺寸(MIN)0.7mm(宽)*0.76mm(高)1HASL1.焊接次数:62.控制厚度:1um-50um3.储存期:大于12个月2OSP1.焊接次数:32.控制厚度:0.2-0.6um3.储存期:6个月左右3化学镍金1.焊接次数:62.控制厚度:Ni≥3um;Au≥0.05um3.储存期:大于12个月4化学锡1.焊接次数:4-52.控制厚度:0.8um-1.2um3.储存期:大于12个月5化学银1.焊接次数:62.控制厚度:0.15um-0.3um3.储存期:大于12个月6离子污染度(MIN)0.5ug/cm21PP介质耐压500V/1mil2阻焊油墨100V/1mil3PP介质厚度2.1mil4覆铜板厚度3.15mil(2oz)1布线结构P-V-屏蔽-S-屏蔽-V-P2PCB铜箔电流密度20A/mm21电阻范围DCR计算铜箔厚度选择:1oz:0.03mm;2oz:0.60mm.2高压(MAX)1500/2sec(初级);4200Vac/2sec(次级)。(依据客户需求制定高压标准)1V-Cut线位置水平偏差±0.05mm2V-Cut线之间距离公差±0.10mmV-Cut表面处理字符布线电性范围介质层3V-Cut线上下位置对准偏差≤0.10mm4V-Cut最小余厚0.2mm5V-Cut余厚公差±0.05mm6V-Cut角度公差±5°7V-CUT线跳刀间距(MIN)8mmV-Cut
本文标题:PCB制程工艺标准
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