HT8-PCBPOPs分析応用

HT8-PCBのPOPs分析への応用松村千里、江崎達哉*、鶴川正寛、中野武兵庫県立健康環境科学研究センター*SGEJapan株式会社TheApplicationtoPOPsAnalysiswithHT8-PCBChisatoMatsumura,TatsuyaEzaki*,MasahiroTsurukawa,TakeshiNakano(HyogoPrefecturalInstituteofPublicHealthandEnvironmentalSciences,*SGEJapanInc.)残留性有機汚染物質（POPs）条約対象物質：12種類のPOPs(PersistentOrganicPollutants)クロルデン、DDT、トキサフェン、ヘキサクロロベンゼン、PCB、アルドリン、ディルドリン、エンドリン、ヘプタクロル、マイレックス、ダイオキシン類、ジベンゾフラン類2000年末にヨハネスブルグ会議で条約合意2001年５月のストックホルム会議条約締結長距移動性難分解性高蓄積性毒性残留性有機汚染物質（POPs）条約における具体的な規制方法1.意図的な生産に対しては製造・使用を禁止2.使用の継続を必要とする時には、物質ごとに使用目的、使用期間を特定した上で使用を認める3.非意図的副生成される物質に対しては、インベントリー作成4.国別の年間排出量の削減に技術的に利用できる最善技術・排出基準の設定5.ＰＣＢは2025年までに使用廃絶、2028年までに適正な処理を行う努力をする同一カラムによる一斉分析の検討•①農薬類、②ＰＣＢ、③ダイオキシンそれぞれカラムを変えると時間のロス。•そこで、①、②および③のうち7,8塩化物について、同時分析を試みた。表１Hp/OCDD、Hp/OCDFおよびCo-PCBsの同時分析条件•InjectorInjector:280℃,Splitless•CarrierGasHe1.0ml/min,27cm/sec,Constantflowmode（真空補正ON）•ColumnOven130℃(1min)－20℃/min－200℃－2℃/min－240℃－4℃/min－320(5min)表2POPs類の分析条件（トキサフェンを除く）•InjectorInjector:260℃,Splitless•CarrierGasHe1.0ml/min,27cm/sec,Constantflowmode（真空補正ON）•ColumnOven120℃(0min)－20℃/min－180℃－2℃/min－210℃－5℃/min－300(5min)CompoundViewPage1DqData:C:\DocumentsandSettings\T_EZAKI\ƒfƒXƒNƒgƒbƒv\Dio_Data_HT8PCB\HT8PCB-005\HT8PCB-005Injection:StackGas-B1415161718192021222324RetentionTime(min)02509010IntensityT4CB/291.9195T4CB#77#81#79#68#56/#60#55#66#76#70#61/#74#67#63/#58#40/#57#64#72/#71#41#44#59#42#52/#69#43/#49#78#65/#75/#48/#47#73#62#80CompoundViewPage1DqData:C:\DocumentsandSettings\T_EZAKI\ƒfƒXƒNƒgƒbƒv\Dio_Data_HT8PCB\HT8PCB-005\HT8PCB-005Injection:StackGas-B23.023.524.024.525.025.526.026.527.027.528.028.529.029.530.0RetentionTime(min)01798016IntensityP5CB/325.8805P5CB#82#124#109/#107#123#106#118#114#122#105#126#127H6CBCompoundViewPage1DqData:C:\DocumentsandSettings\T_EZAKI\ƒfƒXƒNƒgƒbƒv\Dio_Data_HT8PCB\HT8PCB-005\HT8PCB-005Injection:StackGas-B-229303132333435363738RetentionTime(min)0478793IntensityH6CB/361.8386#167#156#157#169CompoundViewPage1DqData:C:\DocumentsandSettings\T_EZAKI\ƒfƒXƒNƒgƒbƒv\Dio_Data_HT8PCB\HT8PCB-005\HT8PCB-005Injection:StackGas-B-2313233343536373839RetentionTime(min)0387474IntensityH7CB/393.8025H7CB#189#170#190#172#192#193#191#180CompoundViewPage1DqData:C:\DocumentsandSettings\T_EZAKI\ƒfƒXƒNƒgƒbƒv\Dio_Data_HT8PCB\HT8PCB-005\HT8PCB-005Injection:StackGas-B45.646.046.446.847.247.648.048.448.849.249.650.050.450.8RetentionTime(min)01472777IntensityO8CDF/443.7399CompoundViewPage1DqData:C:\DocumentsandSettings\T_EZAKI\ƒfƒXƒNƒgƒbƒv\Dio_Data_HT8PCB\HT8PCB-005\HT8PCB-005Injection:StackGas-B40.841.241.642.042.442.843.243.644.044.444.845.245.646.0RetentionTime(min)06177261IntensityH7CDF/407.7818OCDF123467891234678HpCDF123478912346791234689CompoundViewPage1DqData:C:\DocumentsandSettings\T_EZAKI\ƒfƒXƒNƒgƒbƒv\Dio_Data_HT8PCB\HT8PCB-005\HT8PCB-005Injection:StackGas-B45.646.046.446.847.247.648.048.448.849.249.650.050.450.8RetentionTime(min)01511794IntensityO8CDD/459.7348CompoundViewPage1DqData:C:\DocumentsandSettings\T_EZAKI\ƒfƒXƒNƒgƒbƒv\Dio_Data_HT8PCB\HT8PCB-005\HT8PCB-005Injection:StackGas-B40.841.241.642.042.442.843.243.644.044.444.845.245.646.0RetentionTime(min)02778530IntensityH7CDD/423.776612346789OCDDHpCDD12346791234678CompoundViewPage1DqData:C:\DocumentsandSettings\T_EZAKI\ƒfƒXƒNƒgƒbƒv\Dio_Data_HT8PCB\HT8PCB-005\HT8PCB-005Injection:StackGas-B1415161718192021222324RetentionTime(min)02509010IntensityT4CB/291.9195T4CB#77#81#79#68#56/#60#55#66#76#70#61/#74#67#63/#58#40/#57#64#72/#71#41#44#59#42#52/#69#43/#49#78#65/#75/#48/#47#73#62#80CompoundViewPage1DqData:C:\DocumentsandSettings\T_EZAKI\ƒfƒXƒNƒgƒbƒv\Dio_Data_HT8PCB\HT8PCB-005\HT8PCB-005Injection:StackGas-B23.023.524.024.525.025.526.026.527.027.528.028.529.029.530.0RetentionTime(min)01798016IntensityP5CB/325.8805P5CB#82#124#109/#107#123#106#118#114#122#105#126#127H6CBCompoundViewPage1DqData:C:\DocumentsandSettings\T_EZAKI\ƒfƒXƒNƒgƒbƒv\Dio_Data_HT8PCB\HT8PCB-005\HT8PCB-005Injection:StackGas-B-229303132333435363738RetentionTime(min)0478793IntensityH6CB/361.8386#167#156#157#169CompoundViewPage1DqData:C:\DocumentsandSettings\T_EZAKI\ƒfƒXƒNƒgƒbƒv\Dio_Data_HT8PCB\HT8PCB-005\HT8PCB-005Injection:StackGas-B-2313233343536373839RetentionTime(min)0387474IntensityH7CB/393.8025H7CB#189#170#190#172#192#193#191#180CompoundViewPage1DqData:C:\DocumentsandSettings\T_EZAKI\ƒfƒXƒNƒgƒbƒv\Dio_Data_HT8PCB\HT8PCB-005\HT8PCB-005Injection:StackGas-B45.646.046.446.847.247.648.048.448.849.249.650.050.450.8RetentionTime(min)01472777IntensityO8CDF/443.7399CompoundViewPage1DqData:C:\DocumentsandSettings\T_EZAKI\ƒfƒXƒNƒgƒbƒv\Dio_Data_HT8PCB\HT8PCB-005\HT8PCB-005Injection:StackGas-B40.841.241.642.042.442.843.243.644.044.444.845.245.646.0RetentionTime(min)06177261IntensityH7CDF/407.7818OCDF123467891234678HpCDF123478912346791234689CompoundViewPage1DqData:C:\DocumentsandSettings\T_EZAKI\ƒfƒXƒNƒgƒbƒv\Dio_Data_HT8PCB\HT8PCB-005\HT8PCB-005Injection:StackGas-B45.646.046.446.847.247.648.048.448.849.249.650.050.450.8RetentionTime(min)01511794IntensityO8CDD/459.7348CompoundViewPage1DqData:C:\DocumentsandSettings\T_EZAKI\ƒfƒXƒNƒgƒbƒv\Dio_Data_H