ADNS-7530中文资料

ADNS-7530Integratedmoldedlead-frameDIPSensorDataSheetTheoryofOperationTheADNS-7530integratedmoldedlead-frameDIPsensorcomprisesofsensorandVCSELinasinglepackage.TheadvancedclassofVCSELwasengineeredbyAvagoTechnologiestoprovidealaserdiodewithasinglelon-gitudinalandasingletransversemode.Incontrasttomostoxide-basedsingle-modeVCSEL,thisclassofAvagoVCSELremainswithinsinglemodeoperationoverawiderangeofoutputpower.IthassignificantlylowerpowerconsumptionthanaLED.Itisanexcellentchoiceforopticalnavigationapplications.ThesensorisbasedonLaserStream™technology,whichmeasureschangesinpositionbyopticallyacquiringse-quentialsurfaceimages(frames)andmathematicallydeterminingthedirectionandmagnitudeofmovement.ItcontainsanImageAcquisitionSystem(IAS),aDigitalSignalProcessor(DSP),andafourwireserialport.TheIASacquiresmicroscopicsurfaceimagesviathelensandil-luminationsystem.TheseimagesareprocessedbytheDSPtodeterminethedirectionanddistanceofmotion.TheDSPcalculatestheΔxandΔyrelativedisplacementvalues.AnexternalmicrocontrollerreadstheΔxandΔyinformationfromthesensorserialport.Themicrocon-trollerthentranslatesthedataintoPS2,USB,orRFsignalsbeforesendingthemtothehostPCorgameconsole.Features•Wideoperatingvoltage:2.7V-3.6V•Smallformfactor,integratedmoldedleadframeDIPpackage•Lowpowerarchitecture•LaserStream™technology•Self-adjustingpower-savingmodesforlongestbatterylife•Highspeedmotiondetectionupto30ipsand8g•EnhancedSmartSpeedself-adjustingframerateforoptimumperformance•Motiondetectpinoutput•12-bitsmotiondataregisters.•Internaloscillator–noclockinputneeded.•Selectable400,800,1200,1600cpiresolution.•Fourwireserialport•Minimalnumberofpassivecomponents•Laserfaultdetectcircuitryon-chipforEyeSafetyCompliance•AdvancedTechnologyVCSELchip•SingleModeLasingoperation•832-865nmwavelengthApplications•LaserMice•Opticaltrackballs•Integratedinputdevices•Battery-poweredinputdevicesPinoutofADNS-7530OpticalMouseSensorPinNameDescription1+VCSELPositiveTerminalofVCSEL2LASER_NENLASEREnable(ActiveLOW)3NCSChipselect(activelowinput)4MISOSerialdataoutput(MasterIn/SlaveOut)5SCLKSerialclockinput6MOSISerialdatainput(MasterOut/SlaveIn)7MOTIONMotionDetect(activelowoutput)8XYLASERXYLASER9VDD33VInput10NCNoConnection11GNDGround12VDD33VInput13RefA1.8Vregulatoroutput14DGNDDigitalGround15VDDIOIOVoltageinput(1.65~3.6V)16-VCSELNegativeTerminalofVCSELFigure1.Devicepin-outforADNS-7530A7530XYYWWZVCSEL+VE12LASER_NEN3NCSMISO45SCLKMOSI67MOTION8XYLASERVDD39NC10GND11RefB12RefA1314DGNDVDDIO1516VCSEL-VECAUTION:Itisadvisedthatnormalstaticprecautionsbetakeninhandlingandassemblyofthiscomponenttopreventdamageand/ordegradationwhichmaybeinducedbyESDFigure2.Packageoutlinedrawing9.100.358Pin116.200.63816X0.500.020Protectivekaptontape0.200.00810.900.429(Atshoulder)9.100.3580.500.0202.410.0953.960.1563.17650.12506Sensorhole4.100.161SECTIONA-A4.050.1592.830.1111.690.0670.360.0140.890.0351.780.070OpticalcenterVCSELhole5.050.19910.100.3980.780.0311.520.06010.90±0.40.429±.016(Atleadtip)Notes:1.Dimensionsinmillileters(inches).2.Dimensionaltolerance:±0.1mm.3.Coplanarityoflead:0.1mm.4.CumulativepitchtoleranceL±0.15mm.6.Angulartolerance:±3.0°.7.Maxumumflash:±0.2mm.8.Chamfer(25°x2)onthetapersideofthelead.RegulatoryRequirements•PassesFCCBandworldwideanalogousemissionlimitswhenassembledintoamousewithshieldedcableandfollowingAvagorecommendations.•PassesIEC-1000-4-3radiatedsusceptibilitylevelwhenassembledintoamousewithshieldedcableandfollowingAvagorecommendations.•PassesEN61000-4-4/IEC801-4EFTtestswhenassembledintoamousewithshieldedcableandfollowingAvagorecommendations.•ProvidessufficientESDcreepage/clearancedistancetoavoiddischargeupto15kVwhenassembledintoamouseaccordingtousageinstructionsabove.Figure3.BlockdiagramofADNS-7530integratedmoldedlead-frameDIPsensorOverviewofLaserMouseSensorAssemblyFigure4.2DAssemblydrawingofADNS-7530sensorcoupledwiththeADNS-6150lens,PCBandbaseplate(topandcross-sectionalview)OscillatorLASERDriveMISOMOTIONMOSILASER_NEN+VCSELXYLSR-VCSELDGNDVDDIOGNDVDD3RefAPowerandControlImageArrayDSPVCSELLaserMouseSensorSerialandRegistersSCLKNCSBottomoflensflangetoSurfaceTopofPCBtoSurfaceDietoSurfacePCBthicknessGapBetweenPCBandbaseplateTopofsensortoSurfaceDetailASECTIONA-A2.400.0947.400.2917.830.3089.050.3563.400.1341.600.063GuidepostBGuidepostADetailA(5X)AANavigationSurfaceBasePlateBasePlateFootPCBSensorSensorHoleLensVCSELHoleGuidePostAFigure5.RecommendedPCBmechanicalcutoutsandspacingAssemblyRecommendation1.Inserttheintegratedmoldedlead-frameDIPsensorandallotherelectricalcomponentsintotheapplicationPCB.2.Wave-soldertheentireassemblyinano-washsolderprocessutilizingasolderfixture.Thesolderfixtureisneededtoprotectthesensorduringthesolderprocess.Thefixtureshouldbedesignedtoexposethesensorleadstosolderwhileshieldingtheopticalaperturefromdirectsoldercontact.3.Placethelensontothebaseplate.Caremustbetakentoavoidcontaminationontheopticalsurfaces.4.RemovetheprotectivekaptontapesfromtheopticalapertureofthesensorandVCSELrespectively.Caremustbetakentokeepcontaminantsfromenteringtheaperture.5.InsertthePCBassemblyov