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1、PCB硬件设计流程SHENGLI.LIU20091118Start与客户确认的机构图及电路设计信息需设计的器件SPEC理解机构图上的重要信息(解图)SchematicDesignStep所有器件原理图封装设计新建原理图,以机种名命名原理图调用原理图封装,连接线路添加元件参数项目负责人确认线路图SchematicDesign1.CreateSchematicPackageOpenCaptureCISSchematicDesignNewLibrarySchematicDesignSchematicLibSchematicDesignNewPartSchematicDesignAddnameandreferenceprefixPartnameRefOKSchematicDesignNewPartSchematicDesignAddPinAddPinSchematicDesignSetupPinPropertiesPinnamePinNumberPinnamePinShapePinTypeSchematicDesignPinShapeClockDotD。
2、ot-ClockLineShortZeroLengthSchematicDesignAddPinSchematicDesignAddPinSchematicDesignAddPackageOutlineSchematicDesignAddPackageOutlineSchematicDesignSaveSchematicPackageSchematicDesignSaveasSchematicLibrarySchematicDesignSaveasSchematicLibrarySchematicDesignCreateLedPackagePartnameRefOKSchematicDesignAddPinSchematicDesignAddPackageOutlineSchematicDesignAddPackageOutlineSchematicDesignAddPackageOutlineSchematicDesignAddPackageOutlineSchematicDesignAddPackageOutlineSchematicDesignSel。
3、ectOutlineSchematicDesignEditPropertiesSchematicDesignFilledGraphicSchematicDesignEditoutlineSchematicDesignSaveLedPackageSchematicDesignCreateallPartsPackagetothelibrarySchematicDesignCreateNewProjectSchematicDesignNewProjectSchematicDesignPlacePartsPlacePartsSchematicDesignLoadLibtoCaptureAddLibSchematicDesignLoadLibtoCaptureSchematicPackageNewLibPackageSchematicDesignPlaceallpartsSchematicDesignAddwireSchematicDesignAddnetaliasNetaliasNetnameSchematicDesignAddnetaliasPadDesign设。
4、计器件Pad,命名规则参考《PAD设计及PCB封装命名规则》PAD设计及PCB封装命名规则Shengli.liu20090831PadDesign1.PadDesignOpenPad_DesignerPadDesignSetPartTypeSMDPaduseSinglePTHPaduseThroughUnitsuseMillimeterPad设计LEDSPECPackageDimensionsPad设计•FootprintDesignbyYuansongPad设计•AddRegularPadfortopLayer,soldermaskLayer,pastemaskLayerPadtypeandsizePad设计SaveaspadPadDesignPadrenameSameFootprintDesignNewPackagesymbolFootPrint设计设计器件FootPrint,命名参考《PAD设计及PCB封装命名规则》FootPrint应包含相关的设计信息,参考《元器件PCB封装的组成》元器件PCB封装的组成Shengli.liu20090901FootprintD。
5、esignSetupDrawingParametersFootprintDesignSetupGridsFootprintDesignAddPinFootprintDesignAddPinFootprintDesignSelectPinFootprintDesign•AddPadnumberandPinchPadnumberandPinchFootprintDesign•PlacePin1tooriginFootprintDesign•LedPadFootprintDesign•Place_Bound_topFirstpointLayerPlaceShapeEnterFootprintDesign•Place_Bound_topLastpointEnterFootprintDesign•Place_Bound_topFootprintDesign•Place极性点FootprintDesign•Place极性点R=0.1mmFootprintDesign•Place极性点FootprintDesign•SetupDimensionParameterUNITFootprintD。
6、esign•Place极性点FootprintDesign•PlaceReferenceReferenceFootprintDesign•PlaceComponentTextFootprintDesign•SaveLedFootprintFootprintnameFootprintDesign1.CreateHotbar•CreatepadFootprintDesign•CreateHotbarSchematicDesign给原理图添加PCB封装信息Footprinthotbar4rx290y130_pcbSchematicDesign给所有器件添加PCB封装信息Footprintledrx400y160SchematicDesignDRC原理图,若有问题,查看SessionLog,根据WarningorError对原理图修正DRCSchematicDesignDesignRulesCheckSchematicDesignSessionLogSchematicDesignCreateNetlistSchematicDesignCreateNetlistCreatAl。
7、legroPCBEditorSchematicDesignSelectCadenceProducttoopenPCBPCBLayoutSetupDrawingParametersPCBLayoutSetupGridPCBLayoutAddlayerPCBLayoutImportDXFfilePCBLayoutDXFInPCBLayoutEdit/ViewLayerPCBLayoutImportDXFfilePCBLayoutImportDXFfilePCBLayoutFind上视图PCBLayoutMove上视图tooriginOriginPCBLayoutPlaceBoardOutlineShapeLayerBoardOutlinePCBLayoutZ-CopyroutekeepinOutlineOffsettoBoardOutlineLayerZ-CopyRouteKeepinOutlinePCBLayoutPlaceComponentsPCBLayoutPlaceComponentsontheMechanicalLayerPCBLayoutSetu。
8、pConstraintsLineWidthSetPCBLayoutAddViaPCBLayoutSetupConstraintsSpacePCBLayoutAddconnectAddconnectActLayerLineWidthAddconnectPCBLayoutTopLayertoBottomLayerAddViaTopLayerBottomLayerPCBLayoutRouteallnetsPCBLayoutUpdateDRCDRCStatusPCBLayoutMoveRef_DesMoveRef_DesPCBLayoutSetupDimensionPCBLayoutAddBoardSizeBoardLongBoardWidthPCBLayoutAddUnitTextTextPCBLayoutAddGBMTextandBinCodeGBM&機種號LayerMirrorTextSizeAddTextBinCodePCBLayoutPlaceDrillTableUNITPCBLayoutDrillTablePCBLayoutNCDrillSetupGer。
9、beroutOutputDrillfileGerberoutSetupArtworkParameterGerberoutSetupApertureUNITGerberoutSetupTopSilkLayerGeometryOutlineSilkscreenTopAssemblyTopApplyGerberoutSetupTopSilkLayerTopsilkGerberoutAddTopsilkLayerAddTopsilkLayerGerberoutSetupBottomSilkLayerGeometryOutlineSilkscreenBottomAssemblyBottomApplyGerberoutAddBottomsilkLayerAddBottomsilkLayerGerberoutSetupTopSoldermaskLayerGeometryOutlineSoldermasktopSoldermasktopApplyGerberoutAddTopSoldermaskLayerAddTopSoldermaskLayerGerberoutSetupBot。
10、tomSoldermaskLayerGeometryOutlineSoldermaskBottomSoldermaskBottomApplyGerberoutAddBottomSoldermaskLayerAddBottomSoldermaskLayerGerberoutSetupTopPastemaskLayerGeometryOutlinePastemaskTopApplyGerberoutAddTopPastemaskLayerAddTopPastemaskLayerGerberoutSetupBottomPastemaskLayerGeometryOutlinePastemaskBottomApplyGerberoutAddBottomPastemaskLayerAddBottomPastemaskLayerGerberoutSetupMechanicalLayerGeometryOutlineDimensionApplyGerberoutAddMechanicalLayerAddMechanicalLayerGerberoutSetupDrillTableLay。
本文标题:PCB设计流程-Allegro
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