去耦电容在PCB板设计中的应用

1RLC+VSSICGNDPCB(430072)PCBPCBPCBTN41TP33B1001-1390200204-0005-04AbstractThispaperpointoutthattheEMCshouIdbeconsiderinthedesignofPCBandthedecoupIingcapacitorsisimportant.ThepapergivesthatconsideredabouttheuseofthedecoupIingcapacitorsandsomepracticaImethoddeveIopingthedecoupIingeffectindetaiI.ThisEMCdesignmethodprovidesavariousguideIinetoachievebetterdeveIopmentanddesignsonPCBwithgreaterappIicationvaIue.KeywordsdecoupIingcapacitorPCBEMCXuLiangRuanJiangjunGanYanMoFujianWenWu(schooIofEIectricaIEngineeringWuhanUniversityWuhan430072China)-5-39436VoI.39No.43620024EIectricaIMeasurement&InstrumentationApr.20020PCBPCB1PCB112ApplicationofdecouplingcapacitorinPCBdesign3PCB!!39436VOI.39NO.43620024EIectricaIMeasurement&InstrumentatiOnApr.2002/#1!V0VNI!V0=L!I!I!VNI1!I!IL2C!I!I/!V2!I!I!I!V!V20%VNI3ic[6]dicdI!!VL34f0fmaxf0fmax4f0[1]L=02#lInlr+lr2+1\[]+rl-rl2+1\{}5lrL15nH13nHf0=12#LC\60.25[7]10fmaxf0f0=fmaxfmax=1#Ic7Ic[6]67Cmax=Ic24L81416470~1000pF!!39436VOI.39NO.43620024EIectricaIMeasurement&InstrumentatiOnApr.2002256KRAM0.1!F#PCBPCBPCB0.010.005:r10nsTTL0.1!FPCBPCBPCB200~400MHz20-H2~3PCBf0MHzf0=12LC!9f0=c2l#eff!10LnHCpFlc#effC[2]C=#0#rN-1A:11#0#r4.5NA:A1A2...:1:2...[3]C:o:al=#0#rA1:1+A2:2+A3:3+#A12$2a2DGND43103102101X10-11234567891020304050(X107)~z0.01!F100pF;100pF;0.01!F+!GNDICIC+!GNDICab239436VOI.39NO.43620024EIectricaIMeasurement&InstrumentatiOnApr.2002!!0.1!F0.001!F[4]6dB6dB6dB30.01!F100pF[4]d#/d$4/[5]5PMOSPMOS335RrLIC+VSSR,L,CGND[1]C.R.PauIIntroductiontoeIectromagneticcompatibiIityNewYorkZWiIey1992.[2]E.Bogatin.DesignruIesformicrostripcapacitanceZ.IEEETrans.Comp.HybridsManufact.TecnoI.VoI.11no.3p.253Sept.1990.[3]E.Bogatin.AcIosedfromanaIyticaImodeIfortheeIectricaI5PMOS1.M.1988.2.M.1992.3.MOSFFTJ.200010.1940-2002-02-10RrRr=\RB+RAV1/!V\!V=V1-V2V1V2KRrL5L10-8ARr5x1010Rr5x1062.2.3#R2=#R3=#R4=#R5=0.001Rr!!39436VoI.39No.43620024EIectricaIMeasurement&InstrumentationApr.20021RrR1#R1Rr#R1%1091093.84.80.12.22.80.21.71.90.31.61.70.41.11.20.50.91.00.60.70.80.70.60.650.80.50.580.90.40.561.0R1#R111#R1#R10.2%Rr2.2x109#R11%Rr5.6x1081R1=R2=80kR3=R4=50k109~101010-8~10-3A8propertiesofmicrostripinterconnectsZ.IEEETrans.Comp.Hy-bridsManufact.TecnoI.VoI.13no.2p.259June1990.[3]M.Goetz.TimeandfreguencydomainanaIysisofintegraIdecou-pIingcapacitorsZ.IEEETrans.Comp.HybridsManufact.TecnoI.VoI.19no.3p.518Augu.1996.[4]C.R.PauI.EffectiVenessofmuItipIedecoupIingcapacitorsIEEETrans.CompZEMC-34p1301992.[5]Y.YunH.YooS.HamY.KimY.lee.AfiIterforIowEMIandIownoiseZ.IEEEAP-ASIC'99.[6]V.GoIumbeanuP.SVastaD.leonescu.ThedecoupIingefficiencyofpowerforIowVoItageIogiccircuitsZ.IEEEEIec.Tech-Med'98VoI.1p.1201998.[7]M.Montrose.PrintedcircuitboarddesigntechniguesforEMCcompIianceZ.1996.[8].M.1999.(1977-)2002-02-05去耦电容在PCB板设计中的应用作者：徐亮，阮江军，甘艳，莫付江，文武作者单位：武汉大学电气工程学院,武汉,430072刊名：电测与仪表英文刊名：ELECTRICALMEASUREMENT&INSTRUMENTATION年，卷(期)：2002,39(4)被引用次数：12次参考文献(8条)1.沙斐机电一体化系统的电磁兼容技术19992.MMontrosePrintedcircuitboarddesigntechniquesforEMCcompliance19963.VGolumbeanu;PSvasta;DLeonescuThedecouplingefficiencyofpowerforlowvoltagelogiccircuits19984.Y.Yun;H.Yoo;S.Ham;YKim,YLeeAfilterforlowEMIandlownoise5.CRPaulEffectivenessofmultipledecouplingcapacitors19926.EBogatinAclosedfromanalyticalmodelfortheelectricalpropertiesofmicrostripinterconnects19907.EBogatinDesignrulesformicrostripcapacitance[外文期刊]1990(3)8.CRPaulIntroductiontoelectromagneticcompatibilityNewYork1992引证文献(12条)1.王雁彬.马国强基于ADS1234的高精度数字化称重系统的研究与实现[期刊论文]-微型机与应用2010(22)2.姜伶斌.刘思颂.党正强基于ADS1232的高精度测试技术[期刊论文]-中国测试技术2008(3)3.王尔申.胡青.张淑芳基于GPRS和GPS船载终端系统的电磁兼容设计[期刊论文]-仪器仪表学报2008(3)4.周冰航.周有庆.刘敏变电站微机保护装置的电磁兼容研究[期刊论文]-继电器2008(10)5.方志坚.余绍斌.朱跃生电磁兼容设计中电容的应用[期刊论文]-电子质量2007(9)6.胡煜MAX038在精密频率合成波形发生器中的应用[期刊论文]-现代电子技术2007(1)7.徐徐光子嫩肤仪智能监控系统的设计与实现[学位论文]硕士20068.龚馨宇CPLD在汽车制动性能检测系统中的应用[学位论文]硕士20059.周胜海.王林.李长庚电容在EMC设计中的应用技巧[期刊论文]-现代电子技术2004(18)10.周胜海抑制△I噪声的PCB设计方法[期刊论文]-计算机测量与控制2004(11)11.吴士普激光供电的光电电流互感器研究[学位论文]硕士200412.周胜海数字系统中的ΔI噪声与抑制[期刊论文]-计算机测量与控制2003(12)本文链接：