Bumping-process-flow-FOC制程

SPILConfidential-SPILBumpingTechnology1Bumpingprocessflow-FOCPrintingUBMPSVICAl/CuPadSolderPasteUBMsputteringUBMEtching/PRstripDFCoating/Exposure;Solderprinting/DFstripSolderReflowPRDevelopingPRCoating/ExposurePRDFDFSPILConfidential-SPILBumpingTechnology2REPSVPrintingBumpProcessFlowAlPadUBM(Al/NiV/Cu)PIUBMsputteringUBMEtchingSolderprintingSolderReflowPRCoating/ExposureWaferIQCBCBCoating/ExposurePIDevelopingPRDevelopingPIPRPRPSVSolderPasteSolderPasteSiliconDFDFSPILConfidential-SPILBumpingTechnology3UBMsputteringUBMEtchingPRCoating/Exposure/DevelopingPlatingProcess–FOCFlow2.UBMSPUTTER3.PHOTOPROCESS5.PRSTRIP4.PLATReflow7.Reflow8.FV1.IQAPlatNi/SnPb6.UBMETCHSPILConfidential-SPILBumpingTechnology4Reflow&waferCleanPSVFinalPadSiliconWaferIQAPIPhoto-Coating-Exp.-Develop.UBMSputter-Ti-CuPlating-Ni-EUsolderPhotoresistStripUBMEtchingPhotoresistPhotoPIRePSVREPSVPlatingProcessFlowPISPILConfidential-SPILBumpingTechnology5SiliconAlPadPSV(SI3N4)PI1PI-1PhotoProcessRDL:MetalSputteringAlpadPI1Metaltrace:Ti/CuSiliconRDL:PhotoResistcoat/Exp./Dev.EtchingAlpadPI1Metaltrace:Ti/CuSiliconCutraceplatingPRstripAlpadPI1CuSiliconAlpadPI1CuSiliconCuAlpadPI1SiliconPlatedRDLProcessFlow(1/2)IQAInspectionP.R.SPILConfidential-SPILBumpingTechnology6UBMEtching&ReflowNi/SolderPlatingPhotoresistStripPI2RDLtraceAlpadPI1SiliconAlpadPI2RDLtracePI1SiliconPI2RDLtracePI1SiliconPI-2PhotoProcessUBM:MetalSputteringUBM:Ti/CuPI2RDLtraceAlpadPI1SiliconUBM:PhotoResistcoat/Exp./Dev.PRPI2RDLtraceAlpadPI1SiliconRDLtraceAlpadPI1SiliconPI2solderF/VInspectionPlatedRDLProcessFlow(2/2)SPILConfidential-SPILBumpingTechnology7PrintedRDLProcessFlowRDLtrace:MetalSputtering&EtchUBM:MetalSputtering&EtchSiliconAlPadPSV(SI3N4)PI1PI-1PhotoProcessSolderPrinting&ReflowAlpadPI1Metaltrace:Ti/Al/TiSiliconPI-2PhotoProcessPI1SiliconPI2RDLtracePI1SiliconPI2RDLtraceUBM:Al/NiV/CuPI1SiliconPI2RDLtraceUBMSolderBumpF/VInspectionIQAInspectionSPILConfidential-SPILBumpingTechnology8BP-WLCSPProcessFlowMetalSputtering&EtchUBMSputtering&EtchSiliconAlPadPSV(SI3N4)PBO1PBO-1PhotoProcessBallplacement&ReflowAlpadPBO1RDLtrace(Cu)SiliconPBO-2PhotoProcessPBO1SiliconPBO2RDLtrace(Cu)PBO1SiliconPBO2RDLtrace(Cu)UBMPBO1SiliconPBO2RDLtrace(Cu)UBMSolderBallF/VInspectionSPILConfidential-SPILBumpingTechnology9AuRDLProcessFlow(BCB1+AuTrace+BCB2)(forDRAMdevice)SiliconAlpadCustomerPIFuseopening*IncaseoffusestructuresSiliconCustomerPIFuseopening1.IQC2.BCB1Photo3.Sputter4.PRPhoto6.PRStrip/EtchAutrace7.BCB2Photo8.FVIBCB1SiliconCustomerPISeedLayerFuseopeningBCB1P.R.P.R.SiliconCustomerPISeedLayerFuseopeningBCB1Auplating5.AuPlatingP.R.P.R.SiliconCustomerPIFuseopeningBCB1AutraceSiliconCustomerPIFuseopeningBCB1SiliconCustomerPIFuseopeningBCB1BCB2OpeningforW/BSPILConfidential-SPILBumpingTechnology10AuRDLProcessFlow(PI1+AuTrace+PI2)(forFlashorControllerdevice)*IncaseoffusestructuresSiliconCustomerPIFuseopening1.IQC2.PI1Photo3.Sputter4.PRPhoto6.PRStrip/EtchAutrace7.PI2Photo8.FVIPI1SiliconCustomerPISeedLayerFuseopeningPI1P.R.P.R.SiliconCustomerPISeedLayerFuseopeningPI1Auplating5.AuPlatingP.R.P.R.SiliconCustomerPIFuseopeningP11AutraceSiliconCustomerPIFuseopeningPI1SiliconCustomerPIFuseopeningPI1PI2OpeningforW/BSiliconAlpadCustomerPIFuseopeningSPILConfidential-SPILBumpingTechnology11P.R.P.R.SiliconCustomerPISeedLayerP.R.P.R.AuplatingSiliconCustomerPIP.R.P.R.AutraceSiliconCustomerPIPI2SiliconAlpadCustomerPI1.IQCSiliconCustomerPISeedLayer2.Sputter3.PRPhoto4.AuPlatingAuplatingSiliconCustomerPI5.PRStrip7.PI2Photo8.FVIAuRDLProcessFlow(AuTrace+PI)(forFlashdevice)AutraceSiliconCustomerPI6.EtchOpeningforW/BSPILConfidential-SPILBumpingTechnology12WLCSPBackendProcessFlowPacking&shippingLaserMarking2ndWFInspWFMount&De-TappingWaferSawPick&PlaceTappingBacksideLappingIncomingInspection