Introduction-of-IC-Package-Substrate

IntroductionofICPackageSubstrateApr13,2010VincentWChenAsiaMarketing,InterconnectTechnologiesDowElectronicMaterialsOutline
IntroductionofICPackaging
ReasonforSAP–FineLineSolution
IntroductionofSAP
DEM’sproductofferingWhyICNeedsPackaging?LevelofInterconnection1st-levelpackage2nd-levelpackage3rd-levelpackage0th-levelpackageICSubstrateApplicationinPCDatasource:NanyawebsiteNorthbridgeSouthbridgeCPUAGPMemoryPCIUSBAudioHardDiskOthersEvolutionofICPackageDatasource:IEKPinNo.HighLowBGASMTPTHICMSILSIVLSIULSIChipInterconnection—11stlevelpackageChipInterconnection—2WireBondingTapeAutomaticBondingFlipChipBondingChipInterconnection—31.以自動銲接帶的方式威接一次完成，生產效率高2.易與細間距引腳相對應3.適合於薄形微組裝4.可靠性高1.能減小微組裝面積2.可在晶片上整體布置凸塊3.銲接一次完成，生產效率高4.可靠性高1.晶片與引腳的連接很方便，按程序進行多打線接合，自由度大2.很容易獲得這種LSI晶片優點優點優點優點缺點缺點缺點缺點結構及特徵結構及特徵結構及特徵結構及特徵良中差1中良中2良中良3TABFCWB1.當引腳數較多時，生產效率低中1.需要在LSI晶片上形成凸塊，不容易獲得這樣的晶片2.由於是覆晶，難於進行目檢優1.需要在LSI晶片上形成凸塊，不容易獲得這樣的晶片2.用於捲帶式的聚亞醯胺材料比較貴優4結構及特徵:1.測試難易性2.可維修性3.散熱性4.適應超薄性Datasource:ElectronicPackagingTechnologyforSemiconductorDevicesSubstrateMaterialsInorganicTypeOrganicTypeMetalCeramicOthersPaperCompoundOthersBuildupCTEisclosertoSilicondiesuitableforbarediepackagingHigherheatconductivitysuitableforhighpowercomponentsLowercostCostadvantageEasytomanufactureRichfieldexperiencesfromPCBSubstrateMajorCountryProducingICSubstrateOthers4%Korea12%Taiwan26%Japan58%Datasource:IEK,2008/11IbidenShinkoNGKSEMCONanyaUnimicronPPTKinsusASETripodMultekFounderMeadvilleDatasource:TSCICPackageTrendbyApplication應用領域應用領域應用領域應用領域電腦資訊產品目前採用目前採用目前採用目前採用載板型式載板型式載板型式載板型式產品變化產品變化產品變化產品變化•Intel力推45nm製程•晶片組合併風起，功能整合成驅趨勢•低價NB興起未來採用未來採用未來採用未來採用載板型式載板型式載板型式載板型式手機通訊產品消費性電子產品FCCSPBGA•高階手機切入一般消費市場，市場比重揚升•高階手機晶片廠力推65nm製程•配合數位家庭週邊產品需求，產品畫數，傳輸速度要求提升FCFCCSPFCDatasource:IEKFC成為高階成為高階成為高階成為高階封裝主流封裝主流封裝主流封裝主流KeyICSubstratePlayersinTaiwan接腳數較CSP為高，可符合StackDIE封裝方式需求景碩Broadcom,Qualcomm,Marvell,TI手通及通訊晶片40~50%高頻高腳位HF-FC-CSP具輕量及小型化特性、符合手機及攜帶式產品需求景碩、欣興Broadcom,Qualcomm,Marvell,TI,Kingston,SanDiskMemory、DSP、RFIC、DSC、ASIC20~25%高頻低腳位CSP景碩Xilinx,Altera通訊晶片50~55%高頻高腳位BT-FC散熱性、資料傳輸效率及接腳數肭可較BGA大幅提升全懋、景碩、欣興Nvidia,Broadcom,AMD-ATI,威盛,矽統,Intel,AMD繪圖晶片、晶片組、網通晶片30~35%高頻高腳位ABF-FC相較導線架散熱及電性較佳，接腳數亦可大量增加全懋、景碩、南電Nvidia,Broadcom,AMD-ATI,聯發科,威盛,矽統,SanDisk,Toshiba繪圖晶片、晶片組、ASIC、網通晶片15~25%低頻高腳位PBGA優點及特性國內主要供應商主要採用客戶主要應用毛利率適用型態載板種類Datasource:IEKReasonforSAP—Finelinesolution—SummaryofKeyDevelopmentofFCSubstrateFlipChipSubstrateApproachComparison:Subtractivev.s.AdditiveDatasource:PCBHandbookIssues:•L/Scapability=open/shortproblem•Nonrectangularshape=skineffect=problemathighfrequencySAPProcess:Core—1IssueThinCuetchingMechanicaldrillingPlatingthroughholeSAPProcess:Core—2PluggingpretreatmentSurfacebrushingInkpluggingGrindingISAPProcess:Core—3ThinCuetchingGrindingIIDesmear→→→→ElsCu→→→→CuplatingDryfilmlaminationSAPProcess:Core—4ExposureDevelopingEtchingDryfilmstripingSAPProcess:BuildupLayer—1LaminationpretreatmentDielectriclaminationLaserdrillingSAPProcess:BuildupLayer—2DesmearElectrolessCopperSAPProcess:BuildupLayer—3DryfilmlaminationExposureDeveloping25um25umSAPProcess:BuildupLayer—4ElectrolyticCuplatingDryfilmstripingQuicketching25um25umElectrolessCopperElectrolessCopperElectrolyticCopperElectrolyticCopperSAPProcess:SolderMaskS/MpretreatmentS/MprintingExposureDevelopingPost-treatmentSAPProcess:MetalFinishENIGImmersionTinENEPIGRouting→→→→CleaningQC→→→→ShippingMetallizationbySemiAdditiveProcessDryFilmStripping&FlashEtchingElectrolessCopperPlatingElectrolyticCopperPlatingAdhesionPromotion&ViaCleaningDryFilmPatterningLamination&LaserViaformationDryFilmStripping&FlashEtchingElectrolessCopperPlatingElectrolyticCopperPlatingAdhesionPromotion&ViaCleaningDryFilmPatterningLamination&LaserViaformationMetallizationbyFullAdditiveProcessLamination&LaserViaformationAdhesionPromotion&ViaCleaningElectrolessCopperPlatingDryFilmPatterningDryFilmStrippingRequirementofSAPforPackageSubstrateDEMChemicalApplicationinPackageSubstrateNIT23525;3025NIT425NIT425NIT425DryFilmMicroFillVFNEVFMicroFillVFNEVFMicroFillVFNEVFMicroFillVFNEVFCopperViaFillC7800DesemarC4000C4000C4000Desmear/PTHBuildup/HDICG2001/HS/200/ST901HS200/ST901HS200/ST901HS200/ST901CopperPlatingPTH/MicroViaC4000C4000C4000C4000Desmear/PTHCoreFC-BGAFC-CSPWB-CSPWB-BGA