SMT元件焊接标准

CorporateQualityStandardNumber:Title:Date:29007-BWMS-Soldering(Part2:SurfaceMountedComponents)Page1of43CorporateQualityAssuranceDepartment1.0Contents目录目录目录目录Page1.0Content目录----------------------------------------------------------------------------------------12.0Purpose目的----------------------------------------------------------------------------------------13.0Scope范围----------------------------------------------------------------------------------------14.0Description定义14.1Tools&Equipment工具和设备----------------------------------------------------------14.2SolderJointforSurfaceMountedComponents表面贴装元件的焊接-------------------------------------------------------------------------24.2.1ChipComponent片状元件--------------------------------------------------3-74.2.2CylindricalDevices圆柱形元件--------------------------------------------8-94.2.3LCCDevices--------------------------------------------------------------------10-114.2.4PLCCDevices------------------------------------------------------------------12-154.2.5SOICDevices(Gull-Wing)---------------------------------------------------16-174.2.6QFPDevices(Gull-Wing)----------------------------------------------------18-214.2.7FlushTerminations----------------------------------------------------------224.2.8PartialWraparoundTerminations(TantalumCapacitor)-------------23-254.2.9RoundConductor--------------------------------------------------------------26-274.2.10SolderBalls----------------------------------------------------------------------284.2.11SolderSplash&SolderWebs-----------------------------------------------294.2.12BallArrayGrid(BGA)30-314.2.13IllustrationonAcceptableSolderingRequirements32-334.2.14IllustrationonRejectableSolderingRequirements34-425.0Reference参考资料--------------------------------------------------------------------------------436.0Remarks备注--------------------------------------------------------------------------------------437.0RevisionHistory版本-------------------------------------------------------------------------------438.0Approval批准------------------------------------------------------------------------------------------432.0Purpose目的目的目的目的ThisdocumentprovidesthesolderedjointsacceptabilityrequirementstobemetforsurfacemountedcomponentsthroughoutthePCBAsurfacemountassembly本文件制定了PCBA表面贴装过程中表面贴装元件的焊接可接受要求。3.0Scope范围范围范围范围ThisdocumentestablishedtheworkmanshipstandardcriteriaforsolderedjointsofsurfacemountedcomponentstobeappliedforPCBAthroughoutthesolderingprocesses.Thestandardsareexplainedindetailsbyillustrationsanddescriptions本文件为表面贴切装元件的焊接所制定的工艺标准规范适用于PCBA整个焊接过程。本标准在细节方面由插图和描述作解释。4.0Description定义定义定义定义4.1.ToolsandEquipment工具和设备工具和设备工具和设备工具和设备CorporateQualityStandardNumber:Title:Date:29007-BWMS-Soldering(Part2:SurfaceMountedComponents)Page2of43CorporateQualityAssuranceDepartmentRefertoCreativeWorkmanshipStandard(Docu.No.:29000)参照创新工艺标准(Docu.No.:29000)4.2SolderJointForSurfaceMountedComponents表面贴装元件的焊接表面贴装元件的焊接表面贴装元件的焊接表面贴装元件的焊接4.2.1ChipComponent片状元件片状元件片状元件片状元件4.2.1.1MinimumSolderCoverage少锡覆盖少锡覆盖少锡覆盖少锡覆盖PREFERRED(1)Solderfilletisconcaveandwettedterminationby100%oftheheight(H)and100%ofthewidth(W).焊接带呈现凹形并且终端高度和宽充分润湿。Figure4.1CorporateQualityStandardNumber:Title:Date:29007-BWMS-Soldering(Part2:SurfaceMountedComponents)Page3of43CorporateQualityAssuranceDepartmentACCEPTABLE(1)Thesolderfilletextendsatleast25%oftheheight(H)and50%ofthewidth(W).焊接带延伸至少至高度的25%和宽度的50%。Figure4.2REJECTABLE(1)Insufficientsolderwithfilletextendslessthan25%oftheheight(H)and50%ofthewidth(W).焊接带少锡，不足高度的25%和宽度和50%。Figure4.34.2.1.2MaximumSolderCoveragePREFERRED(1)Solderfilletisconcaveandwettedthe.terminationby100%oftheheight(H)and100%ofthewidth(W).焊接带呈现凹形并且终端高度和宽充分润湿.Figure4.4CorporateQualityStandardNumber:Title:Date:29007-BWMS-Soldering(Part2:SurfaceMountedComponents)Page4of43CorporateQualityAssuranceDepartmentFigure4.5ACCEPTABLE(1)Connectionareaexhibitsaconcavesolderfilletrisingtothetopofchip.Goodwettingtochipandlandsurface.连接区域呈现出一个延伸到贴片元件上表面的凹形焊接带。贴片元件与焊盘润湿良好。Figure4.6REJECTABLE(1)Excessivesolderoverhangthelandornon-metallizedportionformingaconvexfillet.Evidenceofnon-wetting.多余的焊料悬垂在焊盘或非镀金属表面上，形成了一个凸形的焊接带。明显的润湿不良。4.2.1.3Voids,BlowHoles&PinHoles空隙空隙空隙空隙，，，，气泡与针孔气泡与针孔气泡与针孔气泡与针孔PREFERRED(1)Solderissmooth,bright,shinyandcontinuouswithnoevidenceofpinholes,blowholesorvoids.焊接光滑、明亮有光泽并呈现出良好的连续性，没有明显的针孔、气泡或空隙。Figure4.7CorporateQualityStandardNumber:Title:Date:29007-BWMS-Soldering(Part2:SurfaceMountedComponents)Page5of43CorporateQualityAssuranceDepartmentACCEPTABLE(1)Thesolderconnectionmayexhibitvoids,blowholeorpinholeinwhichthesurfaceareacoverslessthan50%ofthecomponentwidth(W).焊接处有空隙、气泡或针孔，总体覆盖面积小于元件宽度的50%。Figure4.8REJECTABLE(1)Theentiresurfaceareaofthevoids,blowholeorpinholes.covermorethan50%ofthecomponentwidth(W).整个表面区域有空隙、气泡或针孔，总体覆盖面积大于元件宽度的50%。Figure4.94.2.1.4Tombstone立碑立碑立碑立碑PREFERRED(1)Chipcomponentismountedproperlyontheterminalpadswithcompletewettingofsolderonthelandsurfaceandtheendmetallizationofthecomponent.贴片元件恰当的贴装于终端焊盘，并且元件终端和焊盘均润湿良好。Figure4.10CorporateQualityStandardNumb