金球推力国际标准Wire-Bond-Shear-Test

EIA/JEDECSTANDARDWireBondShearTestMethodEIA/JESD22-B116JULY1998ELECTRONICINDUSTRIESALLIANCENOTICEJEDECstandardsandpublicationscontainmaterialthathasbeenprepared,reviewed,andapprovedthroughtheJEDECCouncillevelandsubsequentlyreviewedandapprovedbytheEIAGeneralCounsel.JEDECstandardsandpublicationsaredesignedtoservethepublicinterestthrougheliminatingmisunderstandingsbetweenmanufacturersandpurchasers,facilitatinginterchangeabilityandimprovementofproducts,andassistingthepurchaserinselectingandobtainingwithminimumdelaytheproperproductforusebythoseotherthanJEDECmembers,whetherthestandardistobeusedeitherdomesticallyorinternationally.JEDECstandardsandpublicationsareadoptedwithoutregardtowhetherornottheiradoptionmayinvolvepatentsorarticles,materials,orprocesses.BysuchactionJEDECdoesnotassumeanyliabilitytoanypatentowner,nordoesitassumeanyobligationwhatevertopartiesadoptingtheJEDECstandardsorpublications.TheinformationincludedinJEDECstandardsandpublicationsrepresentsasoundapproachtoproductspecificationandapplication,principallyfromthesolidstatedevicemanufacturerviewpoint.WithintheJEDECorganizationthereareprocedureswherebyaJEDECstandardorpublicationmaybefurtherprocessedandultimatelybecomeanEIAstandard.Noclaimstobeinconformancewiththisstandardmaybemadeunlessallrequirementsstatedinthestandardaremet.Inquiries,comments,andsuggestionsrelativetothecontentofthisJEDECstandardorpublicationshouldbeaddressedtoJEDECSolidStateTechnologyDivision,2500WilsonBoulevard,Arlington,VA22201-3834,[phone]/7559or©ELECTRONICINDUSTRIESALLIANCEEngineeringDepartment2500WilsonBoulevardArlington,VA22201-3834CopyrightdoesnotapplytoJEDECmembercompaniesastheyarefreetoduplicatethisdocumentinaccordancewiththelatestrevisionofJEDECPublication21ManualofOrganizationandProcedure.PRICE:PleaserefertothecurrentCatalogofJEDECEngineeringStandardsandPublicationsorcallGlobalEngineeringDocuments,USAandCanada(1-800-854-7179),International(303-397-7956)PrintedintheU.S.A.AllrightsreservedJEDECStandard22-B116Page1TestMethodB116WIREBONDSHEARTEST(FromJEDECCouncilBallotJCB-97-64,formulatedunderthecognizanceoftheJC-14.1SubcommitteeonReliabilityTestMethodsforPackagedDevices.)1ScopeThistestprovidesameansfordeterminingthestrengthofthebondbetweenagoldballbondonadiebondingsurfaceoranaluminumwedgeorstitchbondonapackagebondingsurface,andmaybeperformedonpre-encapsulationorpost-encapsulationparts.Thismeasureofbondstrengthisextremelyimportantindeterminingtwofeatures:1)theintegrityofthemetallurgicalbondwhichhasbeenformed.2)thequalityofgoldandaluminumwirebondstodieorpackagebondingsurfaces.Thesetestmethodscoverballbondsmadewithsmalldiameter(from18to76µm,orfrom0.7to3mil)wireandwedgebondsmadewithlargerdiameter(minimumof3mil)wire,ofthetypeusedinintegratedcircuitsandhybridmicroelectronicassemblies.Thesetestmethodscanbeusedonlywhentheballheight(atleast10.16µmor0.4mil)anddiameterforballbonds,orthewireheight(atleast1.25milsinheightatthecompressedbondedarea)ofthewedgebond,arelargeenoughandadjacentinterferingstructuresarefarenoughawaytoallowsuitableplacementandclearance(abovethebondingpadorleadframepostandbetweenadjacentbonds)ofthesheartestchisel.Thistestmethodmayalsoapplytogoldwedgeorstitchbondsifthewireisthickenoughtoallowshearingofthewirefromthebondingsurfacewithoutsmearingsimilartoashearingskip.Thewirebondsheartestisdestructive.Itisappropriateforuseinprocessdevelopment,processcontroland/orqualityassurance.2TermsandDefinitionsThetermsanddefinitionsshallbeinaccordancewiththefollowingparagraphs.2.1BallBondTheadhesionorweldingofathinwire,usuallygold,toadiepadmetallization,usuallyanaluminumalloy,usingathermosonicwirebondprocess.Theballbondincludestheenlargedspherical,ornailhead,portionofthewire(providedbytheflame-offandfirstbondingoperationinthethermalcompressionandthermosonicprocess,orboth),theunderlyingbondingpadandtheballbond-bondingpadintermetallicweldinterface.2.2BondingSurfaceEither1)thediepadmetallizationor2)thepackagesurfacemetallizationtowhichthewireisball,wedgeorstitchbonded.TestMethodB116JEDECStandard22-B116Page22TermsandDefinitions(cont’d)2.3BondShearAprocessinwhichaninstrumentusesachiselshapedtooltoshearorpushaballorwedgebondoffthebondpad(seeFigure1).Theforcerequiredtocausethisseparationisrecordedandisreferredtoasthebondshearforce.Thebondshearforceofagoldballbond,whencorrelatedtothediameteroftheballbond,isanindicatorofthequalityofthemetallurgicalbondbetweenthegoldballbondandthebondpadmetallization.Thebondshearforceofanaluminumwedgebond,whencomparedtothemanufacturer'stensilestrengthofthewire,isanindicatoroftheintegrityoftheweldbetweenthealuminumwireandthebondpadorpackagesurfacemetallization.Figure1—BondShearset-up2.4DefinitionofBondShearCodesforBallandWedgeBonds(seeFigure2)2.4.1Type1-BondLiftAseparationoftheentirewirebondfromthebondingsurfacewithonlyanimprintbeingleftonthebondingsurface.Thereisverylittleevidenceofintermetallicformationorwelding,ordisturbanceofthebondingsurfacemetallization.2.4.2Type2-BondShearAseparationofthewirebondwhere1)Athinlayerofth