SMT模板设计制造规范

:PG-3-LS-01-A:Sep10,2000SMT:4/36–POWERGROUP1.0(Purpose)2.0(Terms,DefinitionandApplicableDocuments)2.12.1.1Aperture2.1.2/AspectRatio/AreaRatioW/T=WT=WidthofAperture/Thicknessoffoil=W/T1AP/AA=AreaofAperture(LW)AreaofApertureWalls2(L+W)T2.1.3EtchFactorEtchedDepthLateralEtch.,(LateralEtch)2.1.4FiducialMarkCCDPCB2.1.5FPT-Fine-PitchTechnology0.635mm2.1.6Frame==:PG-3-LS-01-A:Sep10,2000SMT:5/36–POWERGROUP2.1.7Squeegee2.1.8ReflowforTHT/IntrusiveReflow2.1.9BGA/CSP--MicroBallGridArray/ChipScalePackage1mmBGABGA1-2CSP2.1.10/Edit&Modification2.1.11BGAStandardBGA1mmBGA2.1.12Multi-levelstencilStepDownStepUpStep2.1.13Ultra-FPTIC0.4mm2.22.2.1IPCIPC-T-50TermsandDefinitionsforInterconnectingandPackagingElectronicCircuits();IPC-A-610AcceptabilityofElectronicAssemblies();IPC-SM-782SurfaceMountDesignandLandPatternStandard();2.2.2:PG-3-LS-01-A:Sep10,2000SMT:6/36–POWERGROUPJ-STD-005RequirementsforSolderingPastes3.0(StencilDesign)3.1Stencildata(Format)(Transmite)3.1.1GerberHPGLDXFPDFASC*.GWK*.CWK*.PWKPCB(PADS2000PowerPCBProtelAutoCADClient98CAM350)PCB&FilmPowerScanSystemGerberData3.1.2ModemFTPE-mail*.ZIP*.ARJ*.LZH3.1.3SMTSolderPasteLayerFiducialMarkPCBTopText&BottomText3.1.4GerberRS-274D—X-YDataD-codeApertureRS-274XGerberD-codeApertureX-YData3.1.5D-codeApertureASCIID-codeD-codeX-Y....D-CODED-CODE1.RS-274DGerberD10*D-codeX862Y5232D02*X837Y5207D01*X787D01*X762Y5232D01*X&YY535D01*:PG-3-LS-01-A:Sep10,2000SMT:7/36–POWERGROUPX787Y5382D01*X837D01*D14*X2413Y2286D02*D02X2540Y2386D01*D01D13*X2794Y762D03*D16*X2540Y1524D03*D03D16M02M02D-CODEApertureListCoordinates:Absolute&RelativeCoordinatesformat:m—mn—nZeros:Leading&TrailingUnit:mil/inch/mmD-codeShapeModeSizeXYD10CircleDraw6D13RectangleFlash2070D14SquareBoth50D16FingerFlash85302RS-274XGERBER%FSLAX33Y33*%FSFormatStatement()L&T:Leading&TrailingA&R:Absolute&RelativeCoordinates33:m.n(X.YFormat):PG-3-LS-01-A:Sep10,2000SMT:8/36–POWERGROUP%MOMM*%%ADD11C,0.127*%%ADD12C,0.200*%%ADD29R,2.800×0.300*%%ADD33R,0.7001.900*%D11*X2156Y3271D03*D12*X2156Y3371D03*D29*X5211Y2718D03*D33*X862Y4328D03*M02*3.1.6PCBXYGerber3.1.7PCB3.1.8PCB3.2(ApertureDesign)PCBAD:ApertureDefinitionD11Circle0.127mmD29Rectangle2.8X0.3mmMO:mm&inch:PG-3-LS-01-A:Sep10,2000SMT:9/36–POWERGROUP3.2.1PITCH()PLCC1.27mm(50mil)0.65mm(25.6mil)2.00mm(78.7mil)0.6mm(23.6mil)1.95mm(76.8mil)0.15-0.25mm(5.91-9.84mil)2.3-3.80.88-1.48QFP0.635mm(25mil)0.35mm(13.8mil)1.50mm(59.1mil)0.3mm(11.8mil)1.45mm(57.1mil)0.15-0.18mm(5.91-7.5mil)1.7-2.00.71-0.83QFP0.5mm(20mil)0.254-0.33mm(10-13mil)1.25mm(49.2mil)0.22-0.25mm(9-10mil)1.2mm(47.2mil)0.125-0.15mm(4.92~5.91mil)1.7-2.00.69-0.83QFP0.4mm(15.7mil)0.25mm(9.84mil)1.25mm(49.2mil)0.2mm(7.87mil)1.20mm(47.2mil)0.10-0.125mm(3.94-4.92mil)1.6-2.00.68-0.86QFP0.3mm(11.8mil)0.20mm(7.87mil)1.00mm(39.4mil)0.15mm(5.91mil)0.95mm(37.4mil)0.075-0.125mm(2.95-3.94mil)1.5-2.00.65-0.860402N/A0.50mm(19.7mil)0.65mm(25.6mil)0.45mm(17.7mil)0.60mm(23.6mil)0.125-0.15mm(4.92-5.91mil)N/A0.84-1.000201N/A0.25mm(9.84mil)0.40mm(15.7mil)0.23mm(9.06mil)0.35mm(13.8mil)0.075-0.125mm(2.95-3.94mil)N/A0.66-0.89BGA1.27mm(50mil)0.80mm(31.5mil)N/A0.75mm(29.5mil)N/A0.15-0.20mm(5.91-7.87mil)N/A0.93-1.25BGA1.00mm(39.4mil)0.38mm(15.0mm)N/A0.35mm(13.8mil)0.35mm(13.8mil)0.115-0.135mm(4.53-5.31mil)N/A0.67-0.78BGA0.50mm(19.7mil)0.30mm(11.8mil)N/A0.28mm(11.0mil)0.28mm(11.0mil)0.075-0.125mm(2.95-3.94mil)N/A0.69-0.92Flipchip0.25mm(10mil)0.12mm(5mil)0.12mm(5mil)0.12mm(5mil)0.12mm(5mil)0.08-0.1mm(3-4mil)N/A1.0Flipchip0.2mm(8mil)0.1mm(4mil)0.1mm(4mil)0.1mm(4mil)0.1mm(4mil)0.05-0.1mm(2-4mil)N/A1.0Flipchip0.15mm(6mil)0.08mm(3mil)0.08mm(3mil)0.08mm(3mil)0.08mm(3mil)0.025-0.08mm(1-3mil)N/A1.03.2.2PCBPCBPCBPCB(1)(2)(3)3.2.2.1/(AreaRatio/AspectRatio)(AspectRatio)WT==:PG-3-LS-01-A:Sep10,2000SMT:10/36–POWERGROUP(AreaRatio)L×W2×(L+W)×TW/T1.5,L×W/[2(L×W)×T]0.66LWPCBPCB2/3PCB3.2.2.2PCBPCB3.2.2.2.1SMD1.27-0.4mm[50-16mil]0.03-0.08mm[1.2-3.1mil],0.05-0.13mm[2.0-5.1mil]3.2.2.2.2BGAPBGA0.05mm[2.0mil]3.2.2.2.3BGACBGA0.05-0.08mm[2.0-3.1mil]0.2mm(7.9mil)3.2.2.2.4BGACSP,,0.025mm(0.98mil)0.25mm(9.8mil)0.06mm(2.4mil);0.35mm(14mil)0.09mm(3.5mil)3.2.2.2.52==:PG-3-LS-01-A:Sep10,2000SMT:11/36–POWERGROUP3.2.2.2.6MELFMELF”C”(3)3.2.2.2.7IC(4)(SOIC)(QFP:PITCH=0.5mm,0.235mm)32:PG-3-LS-01-A:Sep10,2000SMT:12/36–POWERGROUP(FPD:)(FPD:)5%85%(1)DataFilmPCBSMDPADS11(2)(Data)FilmChipPADS12~15milICPADS8~10mil(3)3mm0.3-0.5mm;(4)300-700PA.S;3.2.2.33.2.2.3.1(T)060308051206T(mm)0.15-0.180.20.25-0.34:PG-3-LS-01-A:Sep10,2000SMT:13/36–POWERGROUP3.2.2.3.2(1)200PA.S(2)(3)(5)0.4W52-d0603080512063212d(mm)0.350.550.81.03-d080512063212d(mm)0.550.81.0……2mm:PG-3-LS-01-A:Sep10,2000SMT:14/36–POWERGROUP3.3(IntrusiveReflow)SMDTHD:,,,0.65-1.60mm(25.6-63.0mil)0.75-1.25mm(29.5-49.2mil)0.075mm(2.95mil)0.125mm(4.92mil)6.35mm(250mil)4mm(157mil)0.125-0.635mm(4.92-25.0mil)0.15mm(7.87mil)0.20mm(5.91mil)FPT211.25-3.75cm/sec(0.492-1.48in/sec2.5cm/sec(0.984in/sec)3.3.1V=Ts(LoWo)={TB(AU-AP)+(FT+FB)+Vp}-VH1S:PG-3-LS-01-A:Sep10,2000SMT:15/36–POWERGROUPTopViewCrossSectionView6V—Vp—PCBTOP&BTMS—AH—Ap—TB—PCBTs—FT+FB—Lo—Lp—:PG-3-LS-01-A:Sep10,