焊膏厚度对CBGA组装板可靠性的影响

CBGA,,(,430074):CBGA,0.10mm0.15mm0.20mmCBGA0.15mm,:;;;;:TN6:A:1001-3474(2000)04-0153-04EffectofSolderPasteVolumeonReliabilityofCBGAAssembliesWUYi-ping,CUIKun,ZHANGLe-fu(HuazhongUniversityofScienceandTechnology,Wuhan430074,china)Abstract:Inordertoinvestigatetheeffectofstencilthicknessandreflowambientatmosphereontherelia2bilityofceramicballgridarray(CBGA)assemblies,threelevelsofstencilthickness,0.10mm,0.15mm,0.20mm,andtwolevelseachofambientatmosphere,nitrogenandcompressedairwereusedtopreparespecimens.Propertiesoftheassemblies,suchasshearstrength,bendingfatiguelife,thermalshockcyclesandvibrationfa2tiguelifeweretestedtofindouttheoptimumassemblingprocess.Theresultsshowthatassembliespreparedwithstencil0.15mmthickyieldmaximizedperformance.Andthenitrogenambientatmosphereshowedremark2ableeffectonimprovingthefatiguelife.Theoreticalmodelsaregiventoqualitativelyexplaintherelationshipbetweenthesolderjointvolumeandperformance.Keywords:CBGA;Reliability;Reflow;Fatiguetesting;NitrogenambientDocumentCode:AArticleID:1001-3474(2000)04-0153-04(CBGA),,,,[13]CBGA,CBGA,,CBGA,1CBGA1.1CBGACBGA77,Topline2525CBGACBGA625T1.27-DC81(1957-),,,,BGACBGACSP35121420007ElectronicsProcessTechnologyCBGA90Pb/10Sn,,PCBCBGA0.71mm,PCB0.635mm,0.89mm,PCB1.2mmFR-41.2,:0.10mm,0.15mm,0.20mm,25mm/s,20kg()r,()h,(V)r2h0.635mm,PCB,,,CBGAPCB,:90%,1.1g/cm38.48g/cm3,54.3%11b/mm0.100.150.20V/mm30.03170.04750.0633V/mm30.01720.02580.03441.3PCBCBGAPCB,BTUVIP-70NCBGAPCB:10010-6PBGA,CBGA,,,,PCB[5]22.1CBGA(),2132CBGAINSTRONmini441mm/sINSTRONmini4460010-6,,1HzKingDesign9363-EMI98m/s2(100g),50Hz12.2CBGATABAITSA-70L,-5585,15min,30010-6,,30010-6,,,,4234512143,0.15mm,,,0.15mm45CBGA,,CBGACBGA,5,:1,CBGA(CBGA,);2,PCB(),PCB,,PCB,,,;,,[4][6]CBGACBGA,Pb90/Sn10PCBXPCB,PCB6,F,X=F/A6,,Coffin,,,6PCB,PCB,,,,PCB,,X,[4](PCBFR-4,Pb90Sn10)55120007:CBGA,CBGA33(C=-0.383)b/mm()//()/0.104477720.152172862960.20123133178,CBGA0.10mm,,,PCB,,,,0.15mm0.20mm,PCB,,,,2,PCB2,1,23,CBGA,,PCB,PCB,,2,CBGAPCB,CBGA/PBGA:PCB21,,4CBGA:4.1CBGA,0.15mm,;4.2Coffin-MansonCBGA,;4.3CBGA;4.4CBGA::[1]KromannG,GerkeD,HuangWetal.MotorolasPowerPC603andPowerPC604RISCMicroprocessor:TheC4/Ceramic-Ball-GridArrayInterconnectTechnology[C].ProceedingsoftheIEEEElectronicComponentsandTechnologyConfer2ence,1995.1-9.[2]KromannG,GerkeD,HuangWetal.AHighDensityC4/CBGAInterconnectTechnologyforaCMOSMicroprocess[C].ProceedingsofNEPCONWest,1995.1523-1529.[3]SMatsuda,KawabataK,ItohNetal.HighReliabilityCeram2icBGA[C].ProceedingsofInternationalSymposiumonMi2croelectronics,1995.13-17.[4]LiY,MahajanR,SubbarayanGetal.TheEffectofStencilPrintingOptimizationonReliabilityofCBGAandPBGASol2derJoints[J].TransactionsoftheASME,1998,120(3):54-60.[5],,.PBGA[J].,1999,20(7):153-156.[6]RenkenFP,SubbarayanG.ATwo-BodyFormulationforSolderJointShapePrediction[J].TransactionsoftheASME,1998,120(9):302-308.[7]MansonSS.BehaviorofMaterialsUnderConditionsofTher2malStress[C].HeatTransferSymposium:UniversityofMichi2genEngineeringResearchInstitute,1953.9-75.:1999-12-25651214