SMT电子产品基板之设计与装配之整合

SMT高級工程師教案3SMT電子產品基板之設計與裝配之整合SMT電子產品基板之設計與裝配之整合設計與製造為何需要整合？時效因素零件選擇PCBLAYOUTPILOTRUN(EVP，MVP..)DEBUGRE-LAYOUT量產成本因素開發成本(設計，試產，材料，修改…)量產成本(人力需求，加工需求，重工需求)材料成本(共用材料，專用材料，庫存材料設計變更，呆料…)SMT電子產品基板之設計與裝配之整合量產因素製造困難度(零件種類，製程方式，加工方式，設備需求，技術需求，….)測試方式(測試點尺寸及數量，PCB尺寸)維修困難度(零件形態，零件位置，零件密度，製程方式，…)品質因素電氣特性需求(高電壓，大電流，高頻，安規)製造品質需求(PCB加工方式，零件加工方式，零件腳長，零件傾斜)產品可靠度零件可靠度SMT電子產品基板之設計與裝配之整合基板PCB開發流程產品規格確認線路確認零件確認PCB外型尺寸確認零件LIBRARY建立COMPONENTPLACEMENTTRACEROUTINGTAPEOUTSMT電子產品基板之設計與裝配之整合生產線參與LAYOUT時機產品LAYOUT完成甚致試產後不易因量產性而再做大幅修改，因此產品設計與生產線相關人員必須先行討論，以改善產品製造性，或協調設計與製造之需求與限制。生產線參與LAYOUT時機可分為LAYOUT前與第一次試產後，LAYOUT前主要在確認零件位置及後續製程方式：PCB零件層面(上/下層)及製程方式零件密度(QFP，BGA，較大型零件…)PTH零件SMT製程CONNECTOR數量，型式及位置板邊預留異形零件或特殊零件試產後則詳細確認成效及修正其它誤差後，導入下次RE-LAYOUT時一併修正直至量產SMT電子產品基板之設計與裝配之整合生產線參與LAYOUT時機零件確認零件使用除R/D所要求之電氣規格外，生產線相關人員必須同時就”生產線需求”先確認，以決定製程方式及條件，如PDG建立，鋼板厚度選擇，甚致迴焊條件…等：零件外形及尺寸零件腳數量與密度(QFP)錫球腳數量及密度(BGA)零件重量零件耐溫(PTH零件SMT製程)零件封裝方式(JLEAD，GULLWINGQFP，BGA，…)零件包裝方式(TAPEANDREEL，LOSEFORM，…)SMT電子產品基板之設計與裝配之整合生產線參與LAYOUT時機PCB外形尺寸確認PCBA組裝過程中所使用之設備如錫爐或SMT製程設備…等，主要皆以PCB兩對邊做為承載，且設備最大操作範圍有一定極限，因此決定PCB外形及尺寸或有特殊需求時，有下列因素須與生產線相關人員討論：錫爐/SMT製程PCB尺寸*設備最大/小操作範圍*PCB併板方式*PCB焊接方向(彎曲變形)*PCB承載平衡(2側)*PCB外形(前後)*浴盆效應/溢錫*零件掉落(SMT製程)*特殊設計/需求(治/夾具，高架)SMT電子產品基板之設計與裝配之整合生產線參與LAYOUT時機零件LIBRARY建立零件LIBRARY之建立對零件焊接品質有絕對之影響，如焊墊長度、寬度、間距，形式與零件空焊、短路、錫球甚至墓碑效應…等皆有一定之關連性。現有之零件LIBRARY主要由零件廠商提供或由其它使用者直接套用，但由於標準各有不同易產生混淆，且其中許多並未因製程之不同而加以分類，混用之結果，造成分析不良原因時產生誤判，因此在建立LIBRARY時應協同生產線相關人員共同確立，甚至取得實際零件加以確認雖零件種類極多但以逐步建立或於零件承認時一併導入，將可建立一套利於設計且易於生產線及品質之自有標準FORREFLOWSIDE0603080510mil30mil40mil95mil37mil108mil65mil1206FORWAVESOLDERSIDE(PREFERRED)1210FORREFLOWSIDE.040.060.025.025.075.085LEVELINGPADCANBEUSEDASACONNECTIONTRACE.115.15015.037TYP1206FORREFLOWSIDE1206FORWAVESOLDERSIDE(ALTERNATE)TYP0.0370.0750.1500.015.0600.0400.0150.0150.0750.0150.015X0.0254PLACES(LEVELINGPADS)1210FORWAVESOLDERSIDEA-CASETANTALUMFORREFLOWSIDE.080.060.195.060SQTYP.060REF.1801812FLATCHIPFORREFLOWSIDEC-CASETANTALUMFORREFLOWSIDE.130TYP.100REF0.060TYP.220.080TYP.100.270.110REFD-CASETANTALUMFORREFLOWSIDEPANASONIC25VCAPACITOR0.0800.1250.190REF0.1750.2900.170REF0.0602225FLATCHIPPACKAGE1825FLATCHIPPACKAGE.250.2700.170REF0.050.250.2300.072.086REFFLATCHIPFERRITEBEADWAVESIDEFLATCHIPFERRITEBEADFORWAVESIDE.300.100.075.802PLACES.1352PLACES.220.060.110REFMINI-MELF(MLL34)FORREFLOWSIDEMELF(MLL41)FORREFLOWSIDE.060.060.140.090.215.090SOT-23FORREFLOWSIDESOT-23FORWAVESIDE0.035SQTYP.040REF.110.040REF.110.050TYP3PLACES0.075TYPREF.035.135.045REF.195.020X.025PADSOT-89FORREFLOWSIDESOT-89FORWAVESIDE.0702PLACES.059.059.040TYP.125.160REF.230.034.080.067.0502PLCS.067.100.170REF.250(.XX).080.090D-PAKFORREFLOWSIDE.240.240.430.070REF.120.0702PLACES.090.090D-PAKFORWAVESIDE.220.200.380REF.500.080.120.180B-45FORREFLOWSIDE.090.125.035.070.TYP.040.059.1189B-45FORWAVESIDE.080.100.170.250.060.080TYP.118SOIC16PINWIDEBODY0.050”CENTERS，REFLOWSIDE.050.446.406±.012LEADEXTENSION.025X.080SOIC32PIN，0.050”CENTERS，REFLOWSIDE.575MAXLEADEXTENTION.0500.6000.025X0.080TYPSOIC8，14，16PIN0.050”CENTERS,REFLOWSIDE8PINLEADEXTENSION.236+-.008.27514PIN.050.025X.080DIMENSIONSSHOWNARETYPICALSOIC8，14，16PIN0.050”CENTERS，WAVESIDE，SMALLBOARDS8PIN14PIN0.058.0500.0580.290.236+-0.008LEADEXTENSION0.022X0.0800.040X0.080BOTHENDSTHROUGHWAVE16PINSOIC8，14，16PIN0.050”CENTERS，WAVESIDE，LARGEBOARDS8PIN14PIN.050.236+-.008LEADEXTENSION.050.275.022X.080PADSTRAILINGEND2EXTRA0.040X.080THROUGHWAVESOIC20PINWIDEBODY，0.050”CENTERS，REFLOW.050.446.406±.012LEADEXTENSION.025X.080TYPSOIC20PIN，0.050”CENTERS(SPECIALWIDEBODY).505.477MAXLEADEXTENTION0.5000.025X0.080TYPSOJ20PIN，0.050”CENTERS，REFLOWSIDESOJ20PIN(26PINPACKAGE)，0.050”CENTERS，REFLOWSIDE.050TYP0.2100.025X0.0800.200.050TYP0.210CLOFLFAD.268±0.0120.025X0.080RESISTORPACK，SOIC14、16PIN，0.050”CENTERS14PIN.050TYP0.3000±.013LEADEXTENSION0.340.025X.080TYP16PINPLCC52PIN，0.050”CENTERS0.710SQ.REFCLOFCONTACT0.814SQ.600.050.025X.080PLCC52PIN，0.050”CENTERS.356.253REFCLOFLEADS0.556.050TYP0.453REFCLOFLEADS.025X.080TYP118PLCC20PIN，0.050”CENTERSPLCC28PIN，0.050”CENTERS0.0500.2000.414SQ0.310REFCLOFCONTACT0.025X0.080TYPCLOFCONTACT0.050.415REF0.025X0.080TYP0.518SQ0.300PLCC44PIN，0.050”CENTERS0.718SQ0.5000.025X0.0800.0500.615REFCLOFCONTACTPLCC100PIN，0.050”CENTERS1.2001.414SQ.050TYPTYP.025X.0801.310SQREF±0.020CENTERLINEOFCONTACTPLCC84PIN，0.050”CENTERS.0500.025X0.080TYP1.110SQREF±0.006CENTERLINEOFCONTACT1.001.214SQPLCC68PIN，0.050”CENTERS0.050TYP0.025X0.080TYP0.915SQREF+-0.006CENTERLINEOFCONTACT0.8001.018SQCONDUCTORTOFOOTPRINTSPACINGREQUIREMENTNOTES：1THISAPPLIESTO0.025WIDEFOOTRPINTSORLARGWR.WHENUSINGSMALLERFOOTPRINTSTHETRACESHOULDBEREDUCEDACCORDINGLY.TRYTOAVOIDPUTTINGPOWER(VCC)ANDGROUND(GND)SIGNALSONADJACENTPADSWHENUSINGREDUCEDFOOTPRINTSORPADSIZESREFERTOPARAGRAPH3.9FORSIZEMINIMUMDIMENSIONS.0.010MINVCC/GNDFOOTPRINTPADSTEACE0.030TYP0.01510.023MINFOOTPRINTFOOTPRINTPADS-VIA0.023MINVIA0.023MINCONDUCTORTOFOOTPRINTSPACINGREQUIREMENT0.010MINVCC/GNDFOOTPRINTPADSCOMPONENTORIENTATION0.030TYP0.0151BOTTOMBOARD(WAVESIDE)(COMPONENTSCANNOTBECHANGED)SOT23ALTERNATEROTATIONPREFERREDDA