化学镀铜的研究进展

3:,1982,,Tel:[phone]E2mail:[e-mail]3,,,,(,210009),pH,:TQ153.1:AResearchandDevelopmentofElectrolessCopperPlatingGAOZhiqiang,SHENXiaodong,CUISheng,XIAOSu,YUANZhengjun(CollegeofMaterialsScienceandEngineering,NanjingUniversityofTechnology,Nanjing210009)AbstractAreviewismadeonthemechanismofelectrolesscopperplating.Theeffectsofpretreatment,com2positionofplatingsolution,temperature,pHandadditivesonelectrolesscopperplatingareintroducedindetail.Simul2taneity,theapplicationanddevelopmentofelectrolesscopperplatingatpresentandinthefutureareindicated.Keywordselectrolesscopperplating,mechanism,effectfactors,applications0,,,3:[1],,CuCoAu,,,,,,,,,,,,[2]11.1,[3]:():CuL2++2e-Cu+L(1)():RO+2e-(2),,G0,:Cu2++2e-Cu(3)ECu2+/Cu=0.334V::HCHO+H2OHCOOH+2H++2e-(4)E=-0.0560.06VpH11:2HCHO+4OH-2HCOO-+H2+2H2O+2e-(5)E=-0.320.12V,pH11,:Cu2++2HCHO+4OH-Cu+2HCOO-+2H2O+H2(6),,:H2PO-2HPO-2+H(7)HPO-2OH-H2PO-3:HPO-2+OH-H2PO-3+e-(8)Cu2+Ni2+Cu2+Ni2+:H2O+e-OH-+H(9)(7)(9):H+HH2(10)712/,:2H2PO-2+Cu2++2OH-Cu+2H2PO-3+H2(11)1.2,,,,[4]:r=K[Cu2+]a[OH-]b[e]c[L]d(12):abcd4;e22.1,,,,,3[58]2.2[3,9]:(1),,,118,,,(2),151,,(3)0.025mol/L,0.5mol/L,(4),,,3:Ni2+,24h(0.2mg/L)22(5),,,2.3,,,,,,,,,,,,,[10]2.4pHpH,,;pH,pH,,pH,pH,,[11]2.5:,[12][13,14]Na2EDTATEA2,22,,:Na2EDTA,TEA;(5mg/L)2,22,,TEA,;EDTA2.6[15],(),:,;,3(PCB),,(),,,;,,[5]20,,,[16],8122007521[17],1947HNarcus[18](HCHO),,,,,(NaH2PO2)DMAB(),,[19],,;,,,,,,1,.[M].:,20032GongYingpeng,GuoZhancheng,LuWeichang.Electrolesscoppercoatingonnickelfoilsinsuper2gravityfield[J].Ma2terLett,2005,(59):6673.[M].:,20044,.[M].:,20005,,,.[J].,2005,(10):466,,.[J].,2003,11(6):4147,,,.[J].,2004,33(3):3218,,,.(Ni2P)[J].,2001,28(5):379,,.[J].,2000,33(4):310,,.[J].,2001,34:2611,,,.[J].,2004,26(4):712KondoK,IshidaN,IshikawaJ,etal.Kinetiecsofelectrolesscopperplatinginthepresenceofexcesstriethanlolamine[J].BullChemSocJpn,1992,65(1):238013,,.[J].,2004,10(1):1414LinYimao,YenShichern.Effectofadditivesandchelatingagentsonelectrolesscopperplating[J].ApplSurfSci,2001,(178):11615,,,.[J].,1998,19(5):19316JamesFRohan,GeraldORiordan,JaneBoardman.Selectiveelectrolessnickeldepositiononcopperasafinalbarrier/bondinglayermaterialformicroelectronicsapplications[J].ApplSurfSci,2002,185(12):28917,.[J].,1994,31(4):4318,.[J].,2002,31(6):519,.[J].,2000,1(7):13912/