AP6181 大智联创新科技

正基科技股份有限公司SPECIFICATIONSPEC.NO.：REV：1.1DATE：12.26.2012PRODUCTNAME：AP6181APPROVEDCHECKEDPREPAREDDCCISSUENAMEAMPAKAP6181Wi-Fi802.11b/g/nSIPModuleSpecSheetRevisionHistoryDateRevisionContentRevisedByVersion2012/10/01-InitialreleasedJoe1.02012/12/26-ModifyPinname29,30Brian1.1ContentsRevisionHistory.......................................................................................................1 Contents...................................................................................................................2 1. Introduction.........................................................................................................3 2. Features...............................................................................................................4 3. Deliverables........................................................................................................5 3.1Deliverables....................................................................................................5 3.2Regulatorycertifications.................................................................................5 4. GeneralSpecification.........................................................................................6 4.1Wi-FiRFSpecification....................................................................................6 4.2Voltages..........................................................................................................7 4.2.1AbsoluteMaximumRatings....................................................................7 4.2.2RecommendedOperatingRatings.........................................................7 5. PinAssignments.................................................................................................8 5.1PCBPinOutline..............................................................................................8 5.2PinDefinition..................................................................................................8 6. Dimensions.......................................................................................................10 6.1PhysicalDimensions.....................................................................................10 6.2RecommendedFootprint..............................................................................11 7. Externalclockreference..................................................................................12 7.1SDIOPinDescription....................................................................................12 8. HostInterfaceTimingDiagram........................................................................13 8.1Power-upSequenceTimingDiagram...........................................................13 8.2SDIODefaultModeTimingDiagram............................................................14 8.3SDIOHighSpeedModeTimingDiagram.....................................................15 9. RecommendedReflowProfile.........................................................................16 10. PackingInformation.........................................................................................17 10.1Label...........................................................................................................17 10.2Dimension...................................................................................................18 10.3MSLLevel/StorageCondition...................................................................20 1.IntroductionAMPAKTechnologywouldliketoannouncealow-costandlow-powerconsumptionmodulewhichhasalloftheWi-Fifunctionalities.Thehighlyintegratedmodulemakesthepossibilitiesofwebbrowsing,VoIP,headsetsandotherapplications.Withseamlessroamingcapabilitiesandadvancedsecurity,alsocouldinteractwithdifferentvendors’802.11b/g/nAccessPointsinthewirelessLAN.ThiswirelessmodulecomplieswithIEEE802.11b/g/nstandardanditcanachieveuptoaspeedof72.2Mbpswithsinglestreamin802.11ndraft,54MbpsasspecifiedinIEEE802.11g,or11MbpsforIEEE802.11btoconnecttothewirelessLAN.TheintegratedmoduleprovidesSDIOinterfaceforWi-Fi.ThiscompactmoduleisatotalsolutionforWi-Fitechnologies.ThemoduleisspecificallydevelopedforTablet,SmartphonesandPortabledevices.2.FeaturesSingle-band2.4GHzIEEE802.11b/g/nSupportsstandardinterfacesSDIOv2.0(50MHz,4-bitand1-bit)IntegratedARMCortex-M3TMCPUwithon-chipmemoryenablesrunningIEEE802.11firmwarethatcanbefield-upgradedwithfuturefeatures.Security:i.HardwareWAPIaccelerationengineii.AESandTKIPinhardwareforfasterdataencryptionandIEEE802.11icompatibilityiii.WPATM–andWPA2TM-(Personal)supportforpowerfulencryptionandauthenticationAsimplifiedblockdiagramofthemoduleisdepictedinthefigurebelow.3.Deliverables3.1DeliverablesThefollowingproductsandsoftwarewillbepartoftheproduct.ModulewithpackagingEvaluationKitsSoftwareutilityforintegration,performancetest.ProductDatasheet.Agencycertifiedpre-testedreportwiththeadapterboard.3.2RegulatorycertificationsTheproductdeliveryisapre-testedmodule,withoutthemodulelevelcertification.Form