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5,2Vol.5.No.2ELECTRONICS&PACKAGING2220052、(98l208,6101X()):。,。:;;:TN305.94;TN32:A:16811070(2005)02126DISCrete(]208,98`DevicePackaigngandItsTyPicalTyPesLongIJeChangbaiRoad,gquanhCedu,Siehuan,10100,hCina)Abstract:Diseertedevieepaekaging15oneofthebasisandthepioneerofmieroeleetornieteehnolo.Anoverallerviewofthemaindevelopmentofteehnologyandporduetionsforsemieonduetordiseertede-vieepaekaging15madeinthispaper.Thebusinessandmarketdevelopingtrendforthesedevieesaerde-seribedtoo.Keywords:SemieonduetorPaekaginDiseerteDeviee,,、,,、、、、、。,,、,,。,40%,or%。1.88,。,,,,,,,。2,,,、:200491612DOI:10.16257/j.cnki.1681-1070.2005.02.0065,2:,。,,,。,,,,。,TSFP3(1.0x0.6x0.4)mm,SOT2386%。MELFSOD,,SOTDPAK、DZPAK、SOD123、DOZ14AA/AB/AC、DOZ16AA、SOD882,。,sOD123,SOT23,PCB0.SWMELF,SOD123FL,。SMAJDO-Z14AC,IA/W,DO1Z4AB,PCB。DO-1Z6AA、、,SMA,,1.lmm.(1.0xo.6)mmSFP,40%,1.8%,,SFP。SOD-882,、、、、、PIN,,180mm1。SOT23/89/143SMT,、SOT、TSOP、TSSOP、SSOP,。,56SOT553/563PCB,、l。PCB,2,,2,SOT5535/63、、、。SOT,20GH:,SOT、TSFP、/STLP-3/6。3,。。,,200636.6%。1PCBBB(((((mm)))(mm)))(mm,)))))TTTSOP5/6663.00002.75551.000000SSSC88/88AAA2.00002.10001.000049%%%SSSOT553/563331.60001.60000.600039%%%1é`2DDDPeJ、、CPBPD/mmZZZ。J、/mmZZZ(((((mw)))(℃/W)))(mmZ)))(mw)))(℃/W)))SSSOT233324666508886.88836.22274.777SSSC888818777670004.22244.555159.555SSSOT5633335777350002.5666139.555136.7773OJeee(((((℃/W)))(mm)))(mm)))TTTO263、DZPAKKK23336xs.3xl2.80x2.8000TTTO252AA、DPAKKK56666.2x10x1.252.54x2.5444SSSOT223、TO26lAAAA6.5x3.5x1.6660.889x1.7777((((((()))))55508881oooo4.85x3.85x1.55552.43x3.0444SSSOT23555130002.9x1.6x1.111135,2:,PCB。,,/、,PCB。,、,。3,,,,。5、6、14、、、4,、、PNP、PNP/NPN、4、,,PCB,,。,6、,TSOP6,、(1.016x1.778)mm(0.6096x0.7112)mm,NP、NPMOSFET。iMcors8,50850%,,(1.778x2.159)mm(1.106x1.778)mm。MOS-FETFETKY,MOSFET,,。GIBT,。SOT666vcESat,,IA、4080VSC74。SOT-363(),MOSFET,,PCB。、ESD。14(),,、、、、,、、。(),SOTTO。、,,、、;,,3,,;SATO220,TO254、MO-78、DPAK、BZolB/C,(3xZ)nlm,;,TO220,,。,,,,,。4,FTO3,TO220、ISOTO3P、ISOF4、TO3P,H、Q,,,MOSFET、。,SMT,TsoP6、soT23、sMA、SMB,20%,80%,/40%,BGA。Spacer,BGA,BGAMosFET,,J0.5℃/W,50inz,,50wi/n,5,2:40A,,(5.ox5.5)mm6pH,RDS(on)。pMOSFET(1.5x1.5x0.8)mmBGA,SSoT6TSOP6MOSFET75%,75%。MoSFETlFipFET,,,BGA,,100%,,,,。6IGBT5FETMOS-FET,DpAK、508、Powe:Pak、LFPAK、(iDerct)FET,4。FETMOSFET,PCB508,0.7mm,5081.75mm。,,PCB;,,PCB。、,,,,,。FET,,FET,508,oPwerPak,DC/DC,PCB,。4GIBTMOSFET,5,600v,,,、、、、。600V/SA、1OA、1SAIGBTDZPakTO220,ZkV,,“”10。l000W6oAIGBT,TO264,IPC/EJDEC()JSTD-OZOB,、。jùōùōùùù7,,,20067,。,,,。,,90/10,PcB。,,5。,100%,5ōù“PCB!(((((mn)111{(nH)))h((℃/W)))55508881.6661.555lllll888508881110.8881000l555oPPPwerPakkk0.8880.888333l000FETTT0.15550.111lll1.444(((((℃/S)))(℃)))(S)))(℃)))(((((((((((S)))))0222150~1700030~9000309000215220000222222260900023224555(((L)))))))))))))0~2.555150170000600030~6000235255550222150~170000~12000206OOO24529000j`,,155,2:、,,、、MOSFET、、、、、。100%,100%,,/,。,。,IPCJ/EDECJSTD020B。,,,,,、、。8,,,6。6、、、,200430%,。,,,,。,、、,,,22%,、,40,6。、SOT23,SOT2390%,95%,20105。7\\\\\\2001200220032《((((((((((()))()))24000375555oooo67000()))23222369995100066000()))47.66648.22250006666ccID,20031/3,20%,、、,、,,,,90%,10%。、、,72003。,,、,,、、、、16(%)))((((((()))))lllll23.85556.32222222221.8000578883333316.9666450004444414.14443.75555555513.35553.54446666612.12223.21117777711.8888315558888810.62222,8111999999.86662.6111lll0008.922223666llllll7.55552.0000lll2227.51111.9999lll3337.49991.9888lll444728881.9333lll5556.79991.8000197.188888,,,。,43.3%,24.9%,19.3%,12.5%,80%,70%,。100,TO925,2:,,30/、MOSFET、,,。、,,。,,。,2007,2330,543。SIA2004,200420078,8(:)9,,,,,,,,,。}20031%}2(X)4}20071133120.21l6()1176%(2X()320()7)7.2,2003,。,,。:[1〕、:,,2《.6.18[2]http://~.1neon.eom.edesignlink[3]。iarsia@ifr.Com[4」[5][6」http://~.philipssemi.。om[7」〔8〕displays.nationaz.Com〔9]、、、,,Zt4,(3):29,222ee2…/·“2004”,“2004”,400。。,,,。,,,,、、、,。,、,。,,、、、;,。,,,、IT、、,,。、、、、、,。,,。,“SHMoible”、、,,,,。()、`ōJóō-ùù1.“17
本文标题:分立器件封装及其主流类型_龙乐
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