IPC标准清单-中文英文对照版

No.英文名称1IPC-T-50GTermsandDefinitionforInterconnectingandPackagingElectronicCircuits2IPC-TM-650TestMethodsManual3IPC/EIAJ-STD-001CRequirementsforSolderedElectrical&ElectronicAssemblies4IPC/EIAJ-STD-002BSolderabilityTestsforComponentLeads,Terminations,Lugs,TerminalsandWires5IPC/EIAJ-STD-003ASolderabilityTestsforPrintedBoards6IPC/EIAJ-STD-004ARequirementsforSolderingFluxes7IPC/EIAJ-STD-005ARequirementsforSolderingPastes8IPC-A-610DAcceptabilityofElectronicAssemblies9IPC-A-600FAcceptabilityofPrintedBoards10IPC/JEDECJ-STD-033AHandling,Packing,ShippingandUseofMoisture/ReflowSensitiveSurfaceMountDevices11IPC-7711/21A12IPC-9701PerformanceTestMethodsandQualificationRequirementsforSurfaceMountSolderAttachments13IPC-CC-830BQualificationandPerformanceofElectricalInsulatingCompoundforPrintedWiringAssemblies14IPC-7525StencilDesignGuidelines15IPC-7351GeneralReqirementsforSurfaceMountDesignandLandPatternStanderd16IPC/WHMA-A-620RequirementsandAcceptanceforCableandWireHarnessAssemblies17IPC/EIAJ-STD-032PerformanceStandardforBallGridArrayBalls18IPC-M-108CleaningGuidesandHandbookManual19IPC-5701UsersGuideforCleanlinessofUnpopulatedPrintedBoards20IPC-TP-1113CircuitBoardIonicCleanlinessMeasurement:WhatDoesItTellUs?21IPC-CH-65AGuidelinesforCleaningofPrintedBoards&Assemblies22IPC-SC-60APostSolderSolventCleaningHandbook23IPC-SA-61APostSolderSemi-aqueousCleaningHandbook24IPC-AC-62AAqueousPostSolderCleaningHandbook25IPC-TR-476AElectrochemicalMigration:ElectricallyInducedFailuresinPrintedCircuitAssemblies26IPC-TR-582CleaningandCleanlinessTestProgramfor:Phase3--LowSolids,FluxesandPastesProcessedinAmbientAir27IPC-TR-583AnIn-DepthLookAtIonicCleanlinessTesting28IPC-9201SurfaceInsulationResistanceHandbook29IPC-M-109ComponentHandlingManual30IPC-DRM-18GComponentIdentificationDeskReferenceManual31IPC-DRM-SMT-CSurfaceMountSolderJointEvaluationDeskReferenceManual32IPC-DRM-40EThrough-HoleSolderJointEvaluationDeskReferenceManual33IPC-SM-785GuidelinesforAcceleratedReliabilityTestingofSurfaceMountAttachments34IPC-PD-335ElectronicPackagingHandbookIPC标准清单35IPC-QL365ACertificationofFacilitiesThatInspect/TestPrintedBoards,ComponentsandMaterials36IPC-MI-660IncomingInspectionofRawMaterialsManual37IPC-HDBK-005GuidetoSolderPasteAssessment38IPC-HDBK-830GuidelineforDesign,SelectionandApplicationofConformalCoatings39IPC-7530GuidelinesforTemperatureProfilingforMassSoldering(Reflow&Wave)Processes40IPC-TP-1115SelectionandImplementationStrategyforaLow-ResidueNo-CleanProcess41IPC-S-816SMTProcessGuideline&Checklist42IPC-CM-770EComponentMountingGuidelinesforPrintedBoards43IPC-9850-KSurfaceMountPlacementEquipmentCharacterization-KIT44IPC-9850-TM-KW,IPC-9850-TM-KTestMaterialsKitforSurfaceMountPlacementEquipmentStandardization45•4IPC-9850PlacementAccuracyVerificationPanels46•1IPC-9850CMMMeasurementVerificationPanels47•150IPC-9850QFP-100GlassComponents48•130IPC-9850QFP-208GlassComponents49•150IPC-9850BGA-228GlassComponents50•NISTTraceableMeasurementCertificate51•CustomStorageCase52IPC-TR-464AcceleratedAgingforSolderabilityEvaluations53SMC-WP-001SolderingCapabilityWhitePaperReport54SMC-WP-005PCBSurfaceFinishesIPC:AssociationConnectingElectronicsIndustries(电子制造协会),从TheInstituteofPrintedCirciut(印制电路板协会),TheInstituteoftheInterconnectingandPackingElectronicCircuit”(电子电路互连与封装协会)逐步发展衍变而来.中文名称电子电路互连与封装的定义和术语试验方法手册电气与电子组装件锡焊要求元件引线、端子、焊片、接线柱及导线可焊性试验印制板可焊性试验助焊剂需求焊膏需求印制板组装件验收条件印制板验收条件对湿度、再流焊敏感表面贴装器件的处置、包装、发运和使用电子组装件的返工与返修表面安装锡焊件性能试验方法与鉴定要求印制板组装电气绝缘性能和质量手册网版设计导则表面安装器件和焊盘图形标准通用要求电缆和引线贴装的要求和验收BGA球形凸点的标准规范清洗导则和手册非密集型印制板清洁应用导则电路板离子洁净度测量：它告诉我们什么？印制板及组装件清洗导则锡焊后溶剂清洗手册锡焊后半水溶剂清洗手册锡焊后水溶液清洗手册电化学迁移：印制电路组件的电气诱发故障IPC第3阶段非清洗助焊剂研究深入离子洁净度测试表面绝缘电阻手册元件处理手册零件分类标识手册接插件焊接点评价手册接插件焊接点评价手册表面安装焊接件加速可靠性试验导则电子封装手册IPC标准清单印制板,元件和材料检验/试验企业的授证原材料接收检验手册焊膏性能评价手册敷形涂层的设计，选择和应用手册大规模焊接(回流焊与波峰焊)过程温度曲线指南低残留不清洗工艺的选择和实施表面安装技术过程导则及检核表印制板元件安装导则表面贴装设备性能检测方法的描述（附Gerber格式CD盘）可焊性加速老化评价(附修订)可焊性工艺导论印制电路板表面清洗电子组装的IPC标准列表IPC:AssociationConnectingElectronicsIndustries(电子制造协会),从TheInstituteofPrintedCirciut(印制电路板协会),TheInstituteoftheInterconnectingandPackingElectronicCircuit”(电子电路互连与封装协会)逐步发展衍变而来.表面贴装设备性能测试用的标准工具包No.英文名称1IPC-T-50GTermsandDefinitionforInterconnectingandPackagingElectronicCircuits2IPC-TM-650TestMethodsManual3IPC/EIAJ-STD-001CRequirementsforSolderedElectrical&ElectronicAssemblies4IPC-HDBK-001HandbookandGuidetoSupplementJ-STD-001—IncludesAmendment15IPC-A-610DAcceptabilityofElectronicAssemblies6IPC-HDBK-610HandbookandGuidetoIPC-A-610(IncludesIPC-A-610BtoCComparison7IPC-EA-100-KElectronicAssemblyReferenceSet8IPC/WHMA-A-620RequirementsandAcceptanceforCableandWireHarnessAssemblies9IPC/EIAJ-STD-012ImplementationofFlipChipandChipScaleTechnology10IPC-SM-784GuidelinesforChip-on-BoardTechnologyImplementation11IPC/EIAJ-STD-026SemiconductorDesignStandardforFlipChipApplications12J-STD-027MechanicalOutlineStandardforFlipChipandChipSizeConfigurations13IPC/EIAJ-STD-028PerformanceStandardforConstructionofFlipChipandChipScaleBumps14J-STD-013ImplementationofBallGridArrayandOtherHighDensityTechnology15IPC-7095DesignandAssemblyProcessImplementa