基于MSP430的体温测量仪设计

本科生毕业论文(设计)题目基于MSP430的体温测量仪设计学生姓名高兴乐学号20121321030学院电子与信息工程学院专业电子科学与技术指导教师李敏二Ｏ一六年5月20日第1页基于MSP430的体温测量仪的设计高兴乐南京信息工程大学电子与信息工程学院，江苏南京210044摘要：随着人们生活水平的提高，对于自身的健康问题变得越来越关注。而体温作为检测人体健康状况的一个必备的体征数据一直以来都备受关注。传统体温计无法快速测出人体体温，故设计一种基于msp430单片机控制的电子体温计，实现了实时、快速、简易地测量与显示人体温度的功能。本设计主要由MSP430单片机控制模块、电源电路模块、温度检测和A/D转换电路模块，温度值液晶显示模块组成，单片机控制模块采用msp430单片机实现对系统的自动控制。温度采集模块是通过NTC热敏电阻来采集外界温度，然后转换为电压信号。电压信号由数字和模拟转换电路中的AD7799芯片完成数字信号和模拟信号两者之间的转换，数字信号通过采集电路采集进入单片机内。然后单片机将接受的温度大小显示在LCD1602液晶显示屏。关键词：MSP430单片机；AD7799；NTC热敏电阻；温度第2页TheDesignOfTheThermometerBasedOnMSP430XinglegaoElectronicandInformationEngineeringCollege，NUIST，Nanjing210044，ChinaAbstract:Becauseofthecontinuousimprovementofthequalityoflife,peoplepaymoreandmoreattentiontotheirhealth.Bodytemperatureasanessentialsignofthehumanbody'shealthconditionhasbeenconcernedaboutallthetime.Thetraditionalthermometercannotmeasuringbodytemperaturequickly.SothedesignofanelectronicthermometerbasedonMSP430singlechipisnecessary.Ｉｔrealizeareal-time,fastandeasytomeasureanddisplaythetemperatureofthehumanbodyfunction.Thisdesignismainlycomposedoｆthesinglechipmodule、powersupplycircuitmodule、temperaturedetectionandＡ/Dconversioncircuitmodule．thetemperaturemoduleGatheringoutsidetemperaturebyNTCthermistor.theMCUcontrolmoduleusingMSP430singlechipmicrocomputertorealizetheautomaticcontrolofthesystem.ThemoduleselectsNTCthermistortocollecttheexternaltemperatureandconvertstothelinearvoltagesignal.LinearvoltagesignalbytheA/DconversioncircuitmoduleintheAD7799completeA/Dconversion,thedigitalsignalissenttothehostoftheautomaticcontrolmodule.ThetemperaturenumberwillbedisplayedontheLCDscreen.Keywords:MSP430MCU;AD7799;NTCThermistor;Temperature第3页目录目录................................................................................................................................................3第1章绪论.................................................................41.1研究背景及意义...............................................................................................................41.2功能及方案分析...............................................................................................................4第2章设计方案论证.....................................................................................................................52.1设计方案的选择...............................................................................................................52.2各模块部分的基本设计原理...........................................................................................72.2.1单片机主控模块....................................................................................................72.2.2体温测量模块........................................................................................................72.2.3显示模块................................................................................................................83.硬件系统设计...............................................................................................................................93.1主要元器件工作原理简介................................................................................................93.1.1MSP430F149单片机...............................................................................................93.1.2NTC热敏电阻........................................................................................................103.1.3AD7799的原理......................................................................................................113.1.4LCD1602液晶显示器介绍.....................................................................................133.2硬件电路设计................................................................................................................133.2.1电源稳压电路........................................................................................................133.2.2MSP430复位电路..................................................................................................143.2.3MSP430晶振电路..................................................................................................153.2.4信号采集电路和信号与温度的转换电路............................................................153.2.5显示电路设计........................................................................................................174.软件系统设计..............................................................174.1系统整体主程序流程图..................................................................................................174.2温度得测量与换算子程序流程图........................................185.系统测试...................................................................................................................................195.1硬件测试..........................................................................................................................205.1.1分单元的模块测试.............................................................................................205.1.2系统的整体测试.................................................................................................205.3硬件与软件的进行联机测试..........................................