666化学机械抛光技术的研究进展

化学机械抛光技术的研究进展作者：雷红，雒建斌，张朝辉作者单位：雷红(上海大学,纳米中心,上海,200436)，雒建斌,张朝辉(清华大学,摩擦学国家重点实验室,北京,100084)刊名：上海大学学报(自然科学版)英文刊名：JOURNALOFSHANGHAIUNIVERSITY(NATURALSCIENCE)年，卷(期)：2003,9(6)被引用次数：29次参考文献(75条)1.MenonAKCriticalrequirementsfor100Gb/in2headmediainterface19992.NguyenV;VankranenburyH;WoerleePDependencyofdishingonpolishingtimeandslurrychemistryinCuCMP[外文期刊]2000(1/4)3.ElbelN;NeureitherB;EbersbergerBTungstenchemicalmechanicalpolishing[外文期刊]1998(05)4.张朝辉;温诗铸;雒建斌薄膜润滑的微极流体模拟[期刊论文]-机械工程学报2001(09)5.FuryMichaelATheearlydaysofCMP1997(05)6.江瑞生集成电路多层结构中的化学机械抛光技术1998(01)7.ChoW;AhnY;BaekCWEffectofmechanicalprocessparametersonchemicalmechanicalpolishingofAlthinfilms[外文期刊]20038.ChenDZ;LeeBSParameteranalysisofchemicalmechanicalpolishing:Aninvestigationbasedonthepatternplanarizationmodel[外文期刊]1999(09)9.LiWD;ShinDW;TomozawaMTheeffectofthepolishingpadtreatmentonthechemical-mechanicalpolishingofSiO2films199510.MullanyB;ByrneGTheeffectofslurryviscosityonchemical-mechanicalpolishingofsiliconwafers[外文期刊]200311.BhushanBChemical,mechanicalandtribologicalcharacterizationofultra-thinandhardamorphouscarboncoatingsasthinas3.5nm,recentdevelopment[外文期刊]1999(11)12.SteigermaldJM;MurarkaSP;GutmannRJChemicalmechanicalplanarizationofmicroelectronicmaterials199613.AliIChemical-mechanicalpolishingofinterlayerdielectric:areview199414.RentlnPChemical-mechanicalplanarization:fundamentalissuesofinterleveldielectricapplications199215.ThomasLaursen;MalcolmGriefCharacterizationandoptimizationofcopperchemicalmechanicalplanarization[外文期刊]2002(10)16.SeiichiKondoAbrasivefreepolishingforcopperdamasceneinterconnection2000(10)17.LaiJY;SakaN;ChunJHEvolutionofcopperoxidedamascenestructuresinchemicalmechanicalpolishing[外文期刊]2002(01)18.ZhangCH;WenSZ;LuoJBOncharacteristicsoflubricationatnano-scaleintwo-phasefluidsystem[期刊论文]-中国科学B辑(英文版)2002(02)19.LiangH;XuGHLubricatingbehaviorinchemicalmechanicalpolishingofcopper[外文期刊]200220.RunnelsSR;EymanLMTribologyanalysisofchemical-mechanicalpolishing[外文期刊]1994(06)21.HernandezJ;WrschkaPSurfacechemistrystudiesofcopperchemicalmechanicalplanarization[外文期刊]2001(07)22.SubramanianRSTransportphenomenoainChemicalmechanicalpolishing[外文期刊]1999(11)23.SteigerwaldM;MurarkaSDChemicalprocessesinthechemicalmechanicalpolishingofcopper[外文期刊]199524.ParkSS;ChoCH;AhnYHydrodynamicanalysisofchemicalmechanicalpolishingprocess[外文期刊]200025.ChoCH;ParkSS;AhnYThree-dimensionalwaferscalehydrodynamicmodelingforchemicalmechanicalpolishing[外文期刊]2001(1/2)26.TichyJContactmechanicsandlubricationhydrodynamicsofchemical-mechanicalpolishing[外文期刊]1999(04)27.SrinivasaMurthyC;WangD;BeaudoinSPStressdistributioninchemicalmechanicalpolishing[外文期刊]199728.IEEEIntWorkshoponnumericalmodelingofprocessesanddevicesforintegratedcircuits199429.BroruckiLMathematicalmodelingofpolish-ratedecayinchemical-mechanicalpolishing[外文期刊]2002(2/4)30.TsengWT;WangYH;ChinJHEffectsoffilmstressonthechemicalmechanicalpolishingprocess[外文期刊]1999(11)31.施为得;陈宝印硅单晶片的SiO2抛光1984(01)32.LarsenBasseJ;LiangHProbableroleofabrasioninchemo-mechanicalpolishingoftungsten[外文期刊]1999(0)33.LiuC;DaiB;TsengWModelingofthewearmechanismduringchemical-mechanicalpolishing[外文期刊]1996(02)34.YuY;YuC;OrlowskiMAstatisticalpolishingpadmodelforchemical-mechanicalpolishing[外文会议]199335.SundararajanS;ThakurtaDGTwo-dimensionalwafer-scalechemical-mechanicalplanarizationmodelsbasedonlubricationtheoryandmasstransport[外文期刊]1999(02)36.RunnelsSR;EymanLMTribologyanalysisofchemical-mechanicalpolishing[外文期刊]1994(06)37.WarnockJAtwo-dimensionalprocessmodelforchemomechanicalpolishingplanarization[外文期刊]1991(08)38.BurkePASemi-empiricalmodelingofSiO2chemical-mechanicalpolishingplanarization199139.PrestonFThetheoryanddesignofplateglasspolishingmachines1927(11)40.ZhouYY;DavisECVariationofpolishpadshapeduringpaddressing1999(02)41.LiangH;MogneTL;MartinJMInterfacialtransferbetweencopperandpolyurethaneinchemical-mechanicalpolishing[外文期刊]2002(08)42.StavrevaZ;ZeidlerD;PlotnerMInfluenceofprocessparametersonchemical-mechanicalpolishingofcopper[外文期刊]199743.ChenCY;YuCC;ShenSHOperationalaspectsofchemicalmechanicalpolishing:polishpadprofileoptimization[外文期刊]2000(10)44.HooperBJ;ByrneG;GalliganSPadconditioninginchemicalmechanicalpolishing[外文期刊]2002(1)45.LuH;FookesB;ObengYQuantitiveanalysisofphysicalandchemicalchangesinCMPpolyurethanepadsurfaces200246.MoyAL;CecchiJL;HetheringtonDLPolyurethanepaddegradationandwearduetotungstenandoxideCMP47.SikderAK;IrfanIM;BelyaveAEvaluationofmechanicalandtribologicalbehavior,andsurfacecharacteristicsofCMPpads48.ThakurtaDG;BorstCL;SchwendemanDWPadporosity,compressibilityandslurrydeliveryeffectsinchemical-mechanicalplanarization:modelingandexperiments[外文期刊]2000(1/2)49.StavrevaZ;ZeidlerD;PlotnerMCharacteristicsinchemical-mechanicalpolishingofcopper:comparisonofpolishingpads199750.AliI;RoyS;ShinnGChemical-mechanicalpolishingofinterlayerdielectric:Areview1994(10)51.ShiEG;ZhaoBModelingofchemical-mechanicalpolishingwithsoftpads[外文期刊]1998(2)52.JohnSchulerTechnologyandmarketforCMP199953.BajajR;ZutshiA;SuranaRIntegrationchallengesforCMPofcopper[外文期刊]2002