AEC-Q101-003A

AEC-Q101-003-REV-AJuly18,2005ComponentTechnicalCommitteeAutomotiveElectronicsCouncilATTACHMENT3AEC-Q101-003Rev-AWIREBONDSHEARTESTAEC-Q101-003-REV-AJuly18,2005ComponentTechnicalCommitteeAutomotiveElectronicsCouncilNOTICEAECdocumentscontainmaterialthathasbeenprepared,reviewed,andapprovedthroughtheAECTechnicalCommittee.AECdocumentsaredesignedtoservetheautomotiveelectronicsindustrythrougheliminatingmisunderstandingsbetweenmanufacturersandpurchasers,facilitatinginterchangeabilityandimprovementofproducts,andassistingthepurchaserinselectingandobtainingwithminimumdelaytheproperproductforusebythoseotherthanAECmembers,whetherthestandardistobeusedeitherdomesticallyorinternationally.AECdocumentsareadoptedwithoutregardtowhetherornottheiradoptionmayinvolvepatentsorarticles,materials,orprocesses.BysuchactionAECdoesnotassumeanyliabilitytoanypatentowner,nordoesitassumeanyobligationwhatevertopartiesadoptingtheAECdocuments.TheinformationincludedinAECdocumentsrepresentsasoundapproachtoproductspecificationandapplication,principallyfromtheautomotiveelectronicssystemmanufacturerviewpoint.NoclaimstobeinConformancewiththisdocumentmaybemadeunlessallrequirementsstatedinthedocumentaremet.Inquiries,comments,andsuggestionsrelativetothecontentofthisAECdocumentshouldbeaddressedtotheAECTechnicalCommitteeonthelink©2005byDelphi,SiemensVDO,andVisteonCorporation.Thisdocumentmaybefreelyreprintedwiththiscopyrightnotice.ThisdocumentcannotbechangedwithoutapprovalbytheAECComponentsTechnicalCommittee.AEC-Q101-003-REV-AJuly18,2005ComponentTechnicalCommitteeAutomotiveElectronicsCouncilPage1of11METHOD-003DISCRETECOMPONENTWIREBONDSHEARTEST1.SCOPE:1.1Description:Thistestestablishesaprocedurefordeterminingthestrengthoftheinterfacebetweenagoldballbondandadiebondingsurface,oranaluminumwedge/stichbondandadieorpackagebondingsurface,oneitherpre-encapsulationorpost-encapsulationcomponents.Thisstrengthmeasurementisextremelyimportantindeterminingtwofeatures:1)theintegrityofthemetallurgicalbondwhichhasbeenformed.2)thereliabilityofgoldandaluminumwirebondstodieorpackagebondingsurfaces.Thistestmethodcanbeusedonlywhentheballheightanddiameterforballbonds,orthewireheight(1.25milandlargeratthecompressedbondarea)forwedge/stitchbonds,arelargeenoughandadjacentinterferingstructuresarefarenoughawaytoallowsuitableplacementandclearance(e.g.,abovethebondingsurfaceandbetweenadjacentbonds)whenperformingthewirebondsheartest.Thewirebondsheartestisdestructive.Itisappropriateforuseinprocessdevelopment,processmonitoring,and/orqualityassurance.1.2ReferenceDocuments:NotApplicable1.3TermsandDefinitions:Thetermsanddefinitionsshallbeinaccordancewiththefollowingsections.1.3.1BallBond:Theweldingofathinwire,usuallygold,toadiebondingsurface,usuallyanaluminumalloybondpad,usingathermalcompressionorthermosonicwirebondingprocess.Theballbondincludestheenlargedsphericalportionofthewire(sometimesreferredtoasthenailheadandformedbytheflame-offandfirstbondingoperationinthermalcompressionandthermosonicprocess),theunderlyingbondingsurface,andtheintermetallicweldinterface.Forthepurposesofthisdocument,allreferencestoballbondsareapplicabletogoldballbondsondiebondingsurfaces;otherballbondmaterialcombinationsmayrequireanewsetoffailurecriteria(seesection4.1).AEC-Q101-003-REV-AJuly18,2005ComponentTechnicalCommitteeAutomotiveElectronicsCouncilPage2of111.3.2BondingSurface:Either1)thediesurface(e.g.,diebondpad)or2)thepackagebondingsurface(e.g.,platedleadframepostorfinger,downbondtotheflagorpaddle,etc.)towhichthewireisball,wedge,orstitchbonded.1.3.3BondShear:Aprocessinwhichaninstrumentusesachiselshapedtooltoshearorpushaballorwedge/stitchbondoffthebondingsurface(seeFigure1).Theforcerequiredtocausethisseparationisrecordedandisreferredtoasthebondshearstrength.Thebondshearstrengthofagoldballbond,whencorrelatedtothediameteroftheballbond,isanindicatorofthequalityofthemetallurgicalbondbetweenthegoldballbondandthediebondingsurfacemetallization.Thebondshearstrengthofanaluminumwedge/stitchbond,whencomparedtothemanufacturer’sbondwiretensilestrength,isanindicatoroftheintegrityoftheweldbetweenthealuminumwireandthedieorpackagebondingsurface.ShearToolhSpecimenClampTestSpecimenBondingBondWeldAreaBondCLSurfaceFigure1:BondShearSet-up1.3.4DefinitionofBondShearTypesforBallandWedge/StitchBonds(seeFigure3):1.3.4.1Type1-BondLift:Aseparationoftheentirewirebondfromthebondingsurfacewithonlyanimprintbeingleftonthebondingsurface.Thereisverylittleevidenceofintermetallicformationorweldingtothebondingsurfacemetallization.1.3.4.2Type2-BondShear:Aseparationofthewirebondwhere:1)Athinlayerofbondingsurfacemetallizationremainswiththewirebondandanimpressionisleftinthebondingsurface,or2)Intermetallicsremainonthebondingsurfaceandwiththewirebond,or3)Amajorportionofthewirebondremainso