PCB工程部专业英语词汇

1PCB工程部专业英文词汇词汇1.板料:material2.最低限度:minimum或者min.3.最大限度:maximum或者max.4.基准点(零点)datumpoint5.周期Datecode6.V-cut余厚V-cutremainthickness7.抢电铜皮（假铜）dummycopper8.实物板actualboard9.外形及尺寸错误dimensionerror10.异常情形errordatafile11.焊锡面与零件面对位偏差misregistration12.孔塞plughole13.要求requirement14.缺少miss15.偏公差uneventolerance16.补偿compensation17.表面处理surfacetreatment18.无铅喷锡LeadfreeHAL19.金手指斜边bevelofG/F20.制程能力processcapability21.建议,暗示suggest22.确保ensure23.满足,达到meet24.为了inorderto25.交货期deliverydate26.绿油桥soldermaskbridge或者soldermaskdam27.根据accordingto28.单边3milperside3mil29.直径diameter30.半径radius31.小于3millessthan3mil32.高于3milmorethan3mil33.压合结构stackingstructure或者stack_up34.附件：attachedfile35.样品：sample36.文档：Document37.答复：answer;reply38.规格：spec39.与...同样的：thesameas40.前版本：previousversion(oldversion)41.生产：production42.确认：confirm43.再次确认：confirmagain44.工程问题：engineeringquery（EQ）45.尽快：assoonaspossible46.生产文件：productionGerber47.联系某人：contactsomebody48.提交样板：submitsample49.交货期：deliverydate50.电测成本：ET（electricaltest）cost51.通断测试：Openandshorttesting52.参考：referto53.IPC标准：IPCstandard54.IPC二级：IPCclass255.可接受的：acceptable56.允许：permit57.制造：manufacture或者fabricate58.修改：revision59.公差：tolerance60.忽略：ignore61.工具孔：toolinghole62.安装孔：mountinghole63.元件孔：componenthole264.槽孔：slothole65.邮票孔：snapoffhole或者stamphole66.导通孔：viahole67.盲孔：blindviahole68.埋孔：buriedviahole69.金属化孔：PTH(platedthroughhole)70.非金属化孔：NPTH(noplatedthroughhole)71.孔位：holelocation72.避免：avoid73.原设计：originaldesign74.修改：modify75.按原设计：followuporiginaldesign76.附边：wastetab,wastearea或者breakawaytab77.铜条：copperstrip78.拼板：paneldrawing79.板厚：boardthickness80.删除：remove(delete)81.削铜：shavethecopper82.露铜：copperexposure或者exposedcopper83.光标点:fiducialmark84.不同：bedifferentfrom(differfrom)85.内弧：insideradius86.焊环：annularring87.单板尺寸：singlesize88.拼板尺寸：panelsize89.铣,锣：routing90.铣刀：router或者Routingbit91.楔形掏槽V-cut或者Vscoring92.哑光：matt93.光亮的：glossy94.锡珠：solderball(solderplugs)95.阻焊：soldermask(solderresist)96.阻焊开窗：soldermaskopening97.单面开窗：singlesidemaskopening98.补油：touchupsoldermask99.补线：trackwelds100.毛刺：burrs101.去毛刺：deburr102.镀层厚度：platingthickness103.清洁度：cleanliness104.离子污染：ioniccontamination105.阻燃性等级：flammabilityretardantrating106.黑化：blackoxidation107.棕化：brownoxidation108.红化：redoxidation109.可焊性不良：poorsolderability110.焊料：solder111.包装：packaging112.角标：cornermark113.特性阻抗：characteristicimpedance114.正像：positive115.负片：negative116.镜像：mirror117.线宽：linewidth或者tracewidth118.线距：linespacing或者tracespacing119.做样：buildsample120.按照：accordingto121.成品：finished122.做变更：makethechange123.相类似：similarto124.规格：specification125.下移：shiftdown126.垂直地：vertically127.水平的：horizontally128.增大：increase129.缩小：decrease3130.表面处理：SurfaceFinishing131.波峰焊：wavesolder132.钻孔数据：drillingdata133.标记：Logo134.Ul标记：ULlogo,或者UlMarking135.蚀刻标记：etchedmarking136.周期：datecode137.翘曲：bowandtwist138.外层：outerlayer或者externallayer139.内层：innerlayer或者internallayer140.顶层：toplayer141.底层：bottomlayer142.元件面：componentside143.焊接面：solderside144.阻焊层：soldermasklayer145.字符层：legendlayer(silkscreenlayeroroverlayer)146.兰胶层：peelableSMlayer147.贴片层：pastemasklayer148.碳油层：carbonlayer149.外形层：outlinelayer(profilelayer)150.白油：whiteink151.绿油：greenink152.喷锡：hotairleveling(HAL)153.电金,水金：flashgold154.插头镀金：platedgoldedge-boardcontacts155.金手指：Gold-finger156.防氧化：Entek(OSP)157.沉金：Immersiongold(chem.Gold)158.沉锡：ImmersionTin(chem.Tin)159.沉银：ImmersionSilver(chem.silver)160.单面板：singlesidedboard161.双面板：doublesidedboard162.多层板：multilayerboard163.刚性板：rigidboard164.挠性板：flexibleboard165.刚挠板：flex-rigidboard166.铣：CNC(mill,routing)167.冲：punching168.倒角：beveling169.斜面：chamfer170.倒圆角：fillet171.尺寸：dimension172.材料：material173.介电常数：Dielectricconstant174.菲林：film175.成像：Imaging176.板镀：PanelPlating177.图镀：PatternPlating178.后清洗：FinalCleaning179.叠层：stackingstructure(stack-up)180.污染焊盘：contaminatepad181.分孔图：drillchart或者drillmap182.度数：degree183.被…覆盖：becoveredwith184.负公差：minustolerance185.标靶盘：targetpad186.外形公差：routingtolerance187.芯板：core188.半固化片Prepreg189.阻抗线：impedancetrace190.评估estimate191.玻纤显露FiberExposure192.底铜basecopper193.工作搞workingGerber194.原稿originalartwork195.放宽relax4196.挖空blanking或者cut-out197.一般性阻焊油墨generalresistink198.孔位错误misholelocation199.压合周期presscycle200.毛边serratededges201.跳印skipprinting202.气泡blistering203.隔离焊盘isolatedpad204.泪滴teardrops205.箭头arrows206.加大Enlarge207.压合周期presscycle208.毛边serratededges209.跳印,漏印skipprinting210.宽度与厚度的比值width-to-thicknessratio211.调整adjust212.铜箔基板coppercladedlaminates213.线路露铜copperexposure214.孔内异物dirtyhole215.椭圆形ellipticalset216.纤维突出fiberprotrusion217.填充料filler218.互相连通interconnection219.改善方案implementation220.板料使用率materialusefactor221.回路,网络network222.缺口nick223.氧化oxidation224.剥离(剥落)peelingoff225.补线不良poortouch-up226.品质等级qualityclassification227.对位孔registration228.拒收rejectable229.树脂含量resincontent230.排列电阻resistornetwork231.锣刀（铣刀）routingbit232.孔内沾文字S/Lonhole233.孔内绿漆S/Monhole234.线路沾锡solderontrace235.金手指沾锡solderonG/F236.废框scrap237.封孔处理sealing238.间距不足spacingnon-enough239.靶位孔targethole240.测试线路testcircuit241.热应力试验thermalstress242.厚度分布thicknessdistribution243.薄基板,内层板thincore244.线路缺口及针孔tracknick&pinhole245.裁切线trimline246.真平整trueleveling247.真正位置的