印刷电路板UL认证申请指南（PDF30页）

ULCERTIFICATIONAPPLICATIONGUIDEFORPRINTEDWIRINGBOARDUL(Version2.0)1CONTENTINTRODUCTION...........................................................................................................................2ChapterIProcessofApplyingULCertificationforPWBPWBUL................3ChapterIICommon-usedGLOSSARYofPWB.............................4ChapterIIIBOMPreparationofRigidPWB.......................7ChapterIVCOMMONTESTITEMS.........................................................17ChapterVSAMPLEPREPARATION.....................................................................21AppendixIAttachmentI..........................................................................................................272INTRODUCTIONThishandbookistheguidetohelpyoutounderstandULcertificationprocedureclearlyforPWBcategory.YoucanunderstandthembyreadingfromChapter1toChapter5.Pleaseusethisforyourapplication.ULULBythehandbook,wehopethatyoucanadequatelyprepareforBOMandthesamplestoincreasethenicetyofinformationcollectionandsamplepreparation.()ULstandardsforPWBcertification:ULoUL796Printed-WiringBoardsUL796oUL94TestsforFlammabilityofPlasticMaterialsforPartsinDevicesandAppliancesUL94oUL746EPolymericMaterials-IndustrialLaminates,FilamentWoundTubing,VulcanizedFibre,andMaterialsUsedinPrintedWiringBoardsUL746EoUL746FPolymericMaterials-FlexibleDielectricFilmMaterialsForUseInPrinted-WiringBoardsandFlexibleMaterialsInterconnectConstructionsUL746FIfyouhaveanotherquestion,pleasefeelfreetocontactus.,Thankyouforyourcooperation.3ChapterIProcessofApplyingULCertificationforPWBPWBUL4ChapterIICommon-usedGLOSSARYofPWB2.1BASEMATERIALAninsulator,consistingoforganicorinorganicmaterialthatsupportsapatternofconductivematerial.2.2BUILD-UPTHICKNESSOverallthicknessofacombinationofmaterials.Unlessotherwiseindicated,thebuild-upthicknesswillrefertotheoverallthicknessofaboardconstructionwherenointernalorexternalconductormaterialresides.2.3SINGLELAYERBOARDAPWBwithonlyonelayerlaminate,mayincludesinglesidedcopperanddoublesidedcopper.AndinUL,wedifferentiatethemintosinglelayersinglesidedandsinglelayerdoublesided.,UL,2.4EDGECONDUCTOR–Aconductorparallelwithandspacednotmorethan0.4mm(1/64inch)fromtheedgeofaprinted-wiringboard.0.4mmA00.4mmA52.5IMMERSIONSILVERConsistsofaverythincoatingtypicallylessthan0.55microns(0.0217mils)ofnearlypuresilvercreatedbygalvanicdisplacementandmaycontainaslightamountoforganicmaterialdepositedwiththesilver.0.552.6MAXIMUMOPERATIONTEMPERATUREThemaximumtemperaturetheboardwillbeexposedtointheendproductduringoperatingconditions.2.7MIDBOARDCONDUCTORAconductorspacedmorethan0.4mm(1/64inch)fromtheedgeofaprinted-wiringboard.DifferentwiththeEdgeConductor.0.4mm2.8DELAMINATIONAplanarseparationofmaterials(i.e.separationbetweenconductorandbasematerial,prepreg,dielectricmaterial,etc.).2.9SOLDERLIMITS:maximumtemperatureandtimesubjectedduringsolderingprocessforcomponentmounting.ButNOTsolderapplicationprocessduringPWBmanufacturing.2.10MAXIMUMAREADIMETERShortenedformisMAD,meansMaximumunpiercedconductorareameasurementMAD,,A–PWB;B–Largestunpiercedconductorsection.;E–LargestcirclethatfitsB(theareaisnottoexceedthatofcircleEinFigure).BE62.11UL94FlameClass:degreeofflammabilityofthematerialUL942.12MinimumCopperThicknessMinimumamountofcopperforconductorlinesorplanes.2.13MeetUL746EDSR:DirectSupportRequirementsarereferenceinTable9.4ofUL746E.Theserequirementsrelatetotheabilityofthematerialtosupportpartsdirectlyontoitssurfacethatcarryelectricalcurrent.DirectSupportvalueisbasedontheIndividuallaminaterecognition.UL746EDirectSupportRequirements()UL746E9.4DSR2.14CTI:ComparativeTrackingIndexisapropertyofelectricalresistanceofamaterialwettedwithionicsolution.CTIvaluearebasedontheIndividuallaminaterecognitionCTICTI7ChapterIIIBOMPreparationofRigidPWB3.1PWB3.1.1SingleLayerPWB:SSDSPWB3.1.2MassLaminatedPWB:ULMassLaminationPWB3.1.3MultilayerPWB:PWBLaminatePrepregPWB3.23.2.1TypicalBOMforSingleLayerPWB/Table1.DesiredParameterforPWB.1..YourDesiredPWBParameters1.PWBTypeDesignation2.MinimumThicknessPWB______mma.Maximum______mic3.CopperThicknessb.Minimum______mic4.NumberofCladdingSides(SingleorDouble)5.MaximumOperatingTemperature(oC)______oCa.Temperature(oC)______oC6.SolderingLimitsb.Time(seconds)______seca.MinimumMidboardConductorWidth______mmb.MaximumUnpiercedAreaDiameter______mm7.PatternLimitsc.MinimumEdgeConductorWidth______mm8.ManufacturingProcessDesignation(e.g.AorB)AB9.UL94FlammabilityClass8REMARKSBOMSheet():1.PWBTypeDesignation:Pleasefillthetypedesignationintheblank,andnotethatpleasedon’tuseANSIgradeorflameratingasthePWBDesignation.UL/ANSIGradeFR-4,V-02.MinimumThicknessPWB:TherequiredminimumPWBthicknessisnottheminimumthicknessofthelaminate,buttheminimumPWBthicknessyouhavecapabilitytoproducethroughyourmanufacturingprocess,whichisalwaysnotlessthanminimumlaminatethickness.TheminimumthicknessofPWBismeasuredwithoutanycopperand/orplating.PWB3.CopperThickness:Pleaseuse“mic”(micron)asunitwhenmeasuringcopperthickness;mic()1oz344.NumberofCladdingSides(SingleorDouble):Pleasefollowyourrequirement,fillins