贺利氏键合线

W.C.HeraeusBondingWiresforSemiconductorTechnologyW.C.Heraeus2ContentsIntroduction3Presentatfivelocations4–5Applications6–7Goldbondingwires8–15Aluminumbondingwires16–18Copperbondingwires19Foilsforbondingandsoldering20Specialbondingwires21Physicalproperties22Productionlocations243Fromthemeltingofpreciousmetalstomicro-joiningtechnologySincethecompanywasfounded,thecentralfeatureofallactivitiesofW.C.HeraeusGmbHhasbeenthepurchase,trading,manufacture,processingandfabricationofpreciousandspecialmetals.Heraeushasdevelopedamultitudeofinnovationsandbroughtthemtoindustrialmaturity,thusbecominganimportantandindispensablepartnerforcompaniesintheelectronicsandelectricalindustries,inaero-space,metalprocessing,thechemicalandpharmaceuticalindustries,andinscience,researchandmedicine.ThematerialqualitiesofHeraeuspreciousandspecialmetalproductsaredistinguishedbytheiroptimizedreproduciblestructures,characteristicmicrostructuresandtheirextremepuritiesreachingintotheppbrange.Theyhavefoundworldwiderecognition.Today,inclosecooperationwiththecustomer,Heraeusproducestopqualityproductsforsemiconductortechnology,forcommunicationsandcomputertechnologyaswellasformeasurementandcontroltechnology,andforrelaysandswitchingapplications.Electricallyconductingconnectionshavetobemanufacturedforintegratedandhighlyintegratedcircuitstojointheconnectionpadofthechiptothesystemcarrierofthesemiconductorcomponent.Fineandultra-finewiresareusedforthispurpose.Thesewiresofpreciselydopedandalloyedmetalshaveadiameterrangingfrom15µmto500µm.Highestdemandsaremadeonthereliabilityandqualityofthesebond-ingwireconnections;oneofthemostimportantprerequisitesistheuniformityexpectedofthewireproperties.Thisisachievedbytheuseofhigh-puritystartingmaterials,thehomogeneousdistributionofthedopingelementsandthepreciseadjustmentofthebasicpropertiesoftherelevantmetalsandalloys.Theexperienceofdecades,thehightechnicalcompetenceandthecontinualintegrationofthewidevarietyofcus-tomerrequirementsinourproductionexpertiseguaranteethehighqualityofHeraeusproducts.Worldwideactivitiesandanintensiveinterchangeoftechnologyandinforma-tionbetweenourworldwidedistributedproductionsitespermitoptimumsup-pliesandbestpossiblepromptservice.4GermanyW.C.HeraeusGmbHisconsideredtobeoneofthebestaddressesintheindustrialpreciousandspecialmetalsbusinessworldwide.AgroupofcompaniesinEurope,NorthAmerica,AsiaandAfricamaintainsproductionfacilitiesforallstagesofpreciousmetalextraction,refininganddistribution.Since1994thequalitymanagementoftheEngineeredMaterialsDivisionhasbeencertifiedtotheinternationalstand-ardsDINENISO9001andDINENISO14001.ThecertificationISOTS16949hasbeenachievedattheendof2004.Adheringtostrictqualitycriteria,thisstandardguaranteesthereliabilityofallprocessstepsfromtheproductplanningstagetofinaldelivery.TheplantinGermanyisthe“CentreofCompetence”forourworldwidebond-ingwireactivitiesinKorea,ChinaandthePhilippines.KoreaHeraeusOrientalHiTecCo.,Ltd.isawhollyownedsubsidiaryofW.C.HeraeusGmbHandiscertifiedtobothDINISO9001,ISO14001andQS9000.Thankstoitslongexperience,HeraeusOrientalHiTechasprofoundexpertiseinallareasofthemanufactureandprocessingofhigh-performancebondingwires,therebysatisfyingthedemandingrequirementsoftheAsianmarketforqualityandreliability.ForthisreasonHOTistodayoneoftheworld’sleadingmanufacturersofbondingwires.HeraeusOrientalHiTecCo.,Ltd.(HOT),Incheon,foundedin1984W.C.HeraeusGmbH(WCH)Hanau,foundedin1851Presentatfivelocations5PresentatfivelocationsPhilippinesHeraeusElectronicMaterialsPhilippines,Inc.istheyoungestbondingwirepro-ducingsubsidiaryofW.C.HeraeusGmbHandiscertifiedbothtoDINENISO9002andISO14001.Thecompany’splantissituatedinahigh-technologyparksouthofManilawhereitisadirectneighbourofHeraeus’mostimportantcustomers.Thecompanyproducesdifferenttypesofbondingwiresthatmeetthehighinternationalrequirementsofthesemi-conductorandelectronicindustries.ChinaHeraeusZhaoyuanPreciousMetalMaterialsCo.,Ltd.andHeraeusZhaoyuanChangshuElectronicMaterialsCo.,Ltd.aretwoofeightsub-sidiariesoftheHeraeusgroupinChina.HZPMiscertifiedtobothDINISO9002,ISO14001andQS9000.HZCMisalsocertifiedtoDINISO9001andISO14001.HZPMandHZCMsupplytheirproductstonationalandinternationalmanufacturersofsemi-conductorsinChina.HZCMislocatedinthesocalled“silicontriangle”,thegreaterShanghairegion.ThetechnologyandproductionexpertisewasimportedtoChinafromGermany.Trainedpersonnelnowcarrythefullresponsibilityfortheproductionandtheconsistentlyhighqualitylevelofthebondingwires.HeraeusZhaoyuanPreciousMetalsMaterialsCo.,Ltd.(HZPM),Zhaoyuan,foundedin1995HeraeusZhaoyuanChangshuElectronicMaterialsCo.,Ltd.(HZCM),Changshu,foundedin2002HeraeusElectronicMaterialsPhilippines,Inc.(HEP),Cavite,foundedin19976ApplicationsBondingwiresbasedongold,copper,palladiumandaluminumwithdiametersextendingintothemicronrangeareusedfortheelectricallyconductingconnectionsfromtheterminalpadonthechiptothesystemcarrierofthesemiconductorcomponents.Ultra-finegold,palladiumandcopperwiresareprocessedbythethermosonicball/wedgebondingprocess.Aluminumoraluminumalloybondingwiresa