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1MayHan,Passivecomponentsteam,GDC,,B.G.LightingElectronicsCAPACITORINTRODUCTIONDate:Jul.28,20062MayHan,Passivecomponentsteam,GDC,,B.G.LightingElectronicsAGENDA•CAPACITORBASICSandBASICFORMULA’s•THEDIFFERENTTECHNOLOGIES--CERAMICCAP--FILMCAP--ELCAP•CAPACITORFUNCTIONS&APPLICATIONS3MayHan,Passivecomponentsteam,GDC,,B.G.LightingElectronicsAGENDA•CAPACITORBASICSandBASICFORMULA’s•THEDIFFERENTTECHNOLOGIES--CERAMICCAP--FILMCAP--ELCAP•CAPACITORFUNCTIONS&APPLICATIONS4MayHan,Passivecomponentsteam,GDC,,B.G.LightingElectronicsTwoconductinglayersseparatedbyanisolatorC=0rWhatisaCapacitor?AreadistanceAreadistance5MayHan,Passivecomponentsteam,GDC,,B.G.LightingElectronicsCapacitanceCofacapacitor:C=εo•εr•A/dThecapacitanceofacapacitorisproportionaltotheplatesurfaceareaandreciprocallyproportionaltothedistanceoftheplates.C=capacitance(1F=1As/V)εo=dielectricconstantofthevacuum(8.85x10E-12F/m)εr=rel.dielectricconstantofthedielectricmaterialA=platesurfacearead=distancebetweenplatesCapacitorbasics6MayHan,Passivecomponentsteam,GDC,,B.G.LightingElectronicsWhatcanaCapacitordo?UCQStoreChargeCharginginportionsdischargingcontinuouslytVCapacitorbasicsI=dQ/dt7MayHan,Passivecomponentsteam,GDC,,B.G.LightingElectronicsCapacitorbasicsCapacitorsbasicallyconsistof•two(ormore)electricallyconductinglayers(electrodes)•separatedbyaninsulatinggap/material(dielectric/isolator)ElectricalChargeQ(As)isinproportiontoCapacitanceC(As/V)andtothedifferenceofelectricalPotentialV(V)betweenelectrodesQ=C*VVC=Q/V8MayHan,Passivecomponentsteam,GDC,,B.G.LightingElectronicsQ=C*Vasfunctionofkeydrivers-Productdesignanddimensions,materialsandproductiontechnologies…AreaDistance(isolator)Q=0*Area*r*VDistanceProductdimensionMaterialsTechnologyCapacitorbasics9MayHan,Passivecomponentsteam,GDC,,B.G.LightingElectronicsAreaDistance(isolator)Q=0*Area*r*VDistanceDielectricstrengthofisolatorMaterialsconstantofisolatorDefinedbycapacitordesign/technology/sizeForagivencapacitorsizetheAreahastobeaslargeaspossible.Toachievethis,anumberofdifferentsolutionsareapplicable:e.g.SinterelementsoretchedfoilsCapacitorbasics10MayHan,Passivecomponentsteam,GDC,,B.G.LightingElectronicsGeometryexamplesandrespectivetechnologies:‘Plainelectrodes’:FilmcapacitorPlatecapacitor(Ceramicdiskcap.)Sinterbody:Tantalum-capsNiobium-capswithsolidcounterelectrodesMulti-layerCapacitor:MLCCStackedfilmcapsEtchstructure:AluminiumElcapswithnon-solidandsolidelectrolytesCapacitorbasics11MayHan,Passivecomponentsteam,GDC,,B.G.LightingElectronicsAreaDistance(isolator)Q=0*Area*r*VDistanceDielectricstrengthofisolatorMaterialsconstantofisolatorDefinedbycapacitordesign/technology/sizeForminiaturizationranddielectricstrengthshouldbeaslargeaspossible.Anumberofdifferentsolutionsareapplicable:e.g.metaloxydes,plasticfilmsandceramiclayers....Capacitorbasics12MayHan,Passivecomponentsteam,GDC,,B.G.LightingElectronicsDielectricmaterialsMaterialDielectricconstant(r)Dielectricstrength(EB)Intrinsic(r)*(EB)Air1,00063…5kV/mm3…5Paper1,8...2,6...3,020kV/mm40…60PE(Polyesterfilm;PET)3,3400kV/mm1.320PP(Polypropylenefilm)2,2600kV/mm1.320PEN(Polyethylenenaphtalatefilm)3,0400kV/mm1.200Glas5...1016…45kV/mm80…450Porcellain4,5...6,530…45kV/mm135…290Aluminiumoxide(Al2O3)8,5…10714kV/mm6.100Tantalumpentoxide(Ta2O5)27625kV/mm17.000Niobiumoxide(Nb2O5)41455kV/mm19.000Water81Dielectricceramics:150...4.000...15.00020…25kV/mm80.000Class1(1A,1B)6...80...15025kV/mmClass2(2A–2R)1.500...4.000...15.00020kV/mmCapacitorbasics13MayHan,Passivecomponentsteam,GDC,,B.G.LightingElectronicsAGENDA•CAPACITORBASICSandBASICFORMULA’s•THEDIFFERENTTECHNOLOGIES--CERAMICCAP--FILMCAP--ELCAP•CAPACITORFUNCTIONS&APPLICATIONS14MayHan,Passivecomponentsteam,GDC,,B.G.LightingElectronicsFixedCapacitorsCeramicFilmElectrolytic...NP0X7RY5VPP(Polypropylene)PET(Polyester)PENPPSPaperAluminumTantalumNiobiumCapacitortechnologies15MayHan,Passivecomponentsteam,GDC,,B.G.LightingElectronicsCV-areas/Technology1000010001001011pF1nF1µF1mF1FUR(V)CFilmCeramicsElectrolyticsTA-ElkosSupercapsTHEDIFFERENTTECHNOLOGIES16MayHan,Passivecomponentsteam,GDC,,B.G.LightingElectronicsFilmCapacitors17MayHan,Passivecomponentsteam,GDC,,B.G.LightingElectronicsBoxedstyleDippedstyleThefinishingstylesNonDipped18MayHan,Passivecomponentsteam,GDC,,B.G.LightingElectronicsFilmCapProductPortfolio•Dielectrics:-polyester-polypropylene-polycarbonate-PPS-PEN•Configurations:-dippedencapsulation-boxedencapaulation-tapewrapencapsulation-radial,axialandSMD•Electrodedesign:-singlemetallized-doublemetallized-film/foil19MayHan,Passivecomponentsteam,GDC,,B.G.LightingElectronicsPARAMETERPKTKNKIKPUNITDielectricconstant:at1kHz3.03.33.053.02.2Dissipationfactor(x10-4)at1kHzat10kHzat100kHzat1MHz50120200300501101702004254120-3612181224Volumeresistivity10+1610+1710+1610+1710+18cmDielectricstrength100400250250600V/µmMaximumapplicationtemperature100125140150105°CPowerdensity:at10kHz6750232.50.6W/cm³Note:P=paperKT=polyethyleneterephthalate(PETP)KI=polyphenylenesulfide(PPS)KN=polyethylenenaphtalate(PEN)KP=polypropylene(PP)FILMDIELECTRICS20MayHan,Pass
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