HP 安腾刀片竞争分析

©2009Hewlett-PackardDevelopmentCompany,L.P.TheinformationcontainedhereinissubjecttochangewithoutnoticeHP安腾刀片竞争分析HPBCS产品发展方向•刀片结构HPConfidential–NDARequired安腾服务器对数据中心中心洗牌…AFutureMissionCriticalInfrastructureNextGenerationIntegrityToday•ModularDesign–模块化设计•CommonComponents–公共组件•FlexibleArchitecture–伸缩性架构Deliveringimproveddatacentereconomics4January2009–HPRestricted.ForHPandchannelpartnerinternaluse.HPIntegrity:Themosttrusted;Always•Alwaysavailable•Alwaysscalable•AlwaysvirtualizedBL860cBL870cCurrentFutureToday&tomorrow:DeliveringtheefficienciesofBladeSystemc-ClassinfrastructureNextGenerationIntegrityServerBlades:•Greateravailability•Greaterscalability•GreatervirtualizationMulti-OSflexibility:2S4S2S4S8SMissionCritical2HCY09HPIntegrityServerBlades安腾刀片HPBL860cvsIBMJS12JS22JS23QuickComparisonAIX,Linux,IBMiUpto600GB2nonhot-swapSASHDD;SSD69GB1PCIeCIOv1PCIeCFFh64GBDDR2SDRAM8DIMMslots2p/4cDCPower6(4.2GHz)Single-wideBladeCenterH/HT/SIBMJS23AIX,Linux,IBMi2internalSASHDDs;embeddedRAID0/11internalPCIe1internallegacycard64GBDDR2SDRAM8DIMMslots1p/2cDCPower6(3.8GHz)Single-wideBladeCenterE/H/T/HT/SIBMJS12AIX,Linux,IBMiUpto300GB1nonhot-swapSASHDD;SSD69GB1PCIeCIOv1PCIeCFFh32GBDDR2SDRAM4DIMMslots2p/4cDCPower6(4.0GHz)Single-wideBladeCenterH/HT/SIBMJS22HP-UX11i,Linux,WindowsandOpenVMS2internalSASHDDs;embeddedRAID13c-ClassPCIeMezzanine48GBDDR2SDRAM12DIMMslots1p/1c----2p/2c----2p/4cItaniumDC1.66GHz/18MBDC1.42GHz/12MBSC1.6GHz/12MBFull-height/Single-widec-ClassBladeSystemBL860cInternalStorageOperatingEnvironmentsI/OSlotsMemoryScalabilityProcessorsFormFactorBL860c•BL860coffersmorememorycapacityvs.IBMforcingIBMtomoreexpensiveDIMMs•BL860chasmorethenumberofPCIeI/Oslotsvs.IBM•BL860cgivescustomersmoreOSchoices•BL860coffersVirtualConnectandotherbenefitsofc-ClassinfrastructureHPRESTRICTED:FORINTERNALUSEONLYHPBL870cvsIBMJS43QuickComparisonAIX,Linux,IBMi2nonhot-swapSASHDDsembeddedRAID0/1Upto600GB2PCIeCIOv2PCIeCFFh128GBDDR216DIMMslots4p/8cDCPower6+(4.2GHz)Double-wideBladeCenterH/HT/SIBMJS43HP-UX11i,Linux,WindowsandOpenVMS4internalSASHDDs;embeddedRAID13c-ClassPCIeMezzanine192GBDDR2SDRAM24DIMMslots4p/8cItaniumDC1.6GHz/24MBDC1.6GHz/18MBDC1.42GHz/12MBFull-height/Double-widec-ClassBladeSystemBL870cInternalStorageOperatingEnvironmentsI/OSlotsMemoryScalabilityProcessorsFormFactorBL870cdifferentiation•BL860coffersmorememorycapacityvs.IBMJS43forcingIBMtomoreexpensiveDIMMs•BL870chasmorethenumberofPCIeI/Oslotsvs.IBM•BL870cgivescustomersmoreOSchoices•BL870coffersVirtualConnectandotherbenefitsofc-ClassinfrastructureHPRESTRICTED:FORINTERNALUSEONLYBL870c成本优势•Costof2xBL870cBladesinoneC7000chassisisapproximatelyequalto2xrx6600servers.TheC7000willalloweasierrepeatsalestofilluptheremaining2slots.•ThecostadvantageimprovesforBladesaswefilluptheC7000chassis.Thereisa15%costadvantagefor4xBL870cBladeServersinaC7000chassisascomparedto4xrx6600rackmountservers.BL870c提供更高密度计算能力以及能耗低4xBL870cinaC7000comparedto4xrx6600•Bladesprovide2.8xbettercomputedensity.•Power&Coolingsavingsofupto25%9January2009–HPRestricted.ForHPandchannelpartnerinternaluse.信息和支持•如欲了解关于HPBlade功能的详细信息，请参阅：•HPPC刀片：•HP安腾刀片：