各种IC封装形式图片

各种IC封装形式图片BGABallGridArrayEBGA680L详细规格LBGA160L详细规格PBGA217LPlasticBallGridArray详细规格QFPQuadFlatPackageTQFP100L详细规格SBGASC-705L详细规格SDIPSBGA192L详细规格TSBGA680L详细规格CLCC详细规格CNRCommunicationandNetworkingRiserSpecificationRevision1.2详细规格CPGACeramicPinGridArraySIPSingleInlinePackageSOSmallOutlinePackageSOJ32L详细规格SOJSOPEIAJTYPEII14L详细规格SOT220DIPDualInlinePackage详细规格DIP-tabDualInlinePackagewithMetalHeatsinkFBGAFDIPFTO220FlatPackSSOP16L详细规格SSOPTO18TO220TO247HSOP28ITO220ITO3pJLCCLCCTO264TO3TO5TO52TO71LDCCLGALQFPPCDIPPGAPlasticPinGridArray详细规格TO72TO78TO8TO92TO93PLCC详细规格PQFPPSDIPLQFP100L详细规格METALQUAD100L详细规格PQFP100L详细规格TO99TSOPThinSmallOutlinePackageTSSOPorTSOPIIThinShrinkOutlinePackageuBGAMicroBallGridArrayuBGAMicroBallGridArrayQFPQuadFlatPackageSOT143SOT220SOT223SOT223ZIPZig-ZagInlinePackageBQFP132TEPBGA288LTEPBGA288L详细规格C-BendLeadCERQUADCeramicQuadFlatPack详细规格CeramicCaseSOT23SOT23/SOT323SOT25/SOT353SOT26/SOT363SOT343SOT523LAMINATECSP112LChipScalePackagespanstyle='font-size:9.0pt;font-family:宋体;mso-ascii-font-family:Tahoma;mso-hansi-font-family:Tahoma;mso-bidi-font-famiSOT89SOT89Socket603FosterLAMINATETCSP20LChipScalePackage详细规格TO252TO263/TO268SODIMMSmallOutlineDualIn-lineMemoryModuleSOCKET370Forintel370pinPGAPentiumIII&CeleronCPUSOCKET423Forintel423pinPGAPentium4CPUSOCKET462/SOCKETAForPGAAMDAthlon&DuronCPUSOCKET7ForintelPentium&MMXPentiumCPU