翻译版AEC_Q100_Rev_F2

STRESSTESTQUALIFICATIONFORINTEGRATEDCIRCUITS集成电路的应力测试鉴定AutomotiveElectronicsCouncilComponentTechnicalCommittee汽车电子理事会元件技术委员会AEC-Q100-Rev-FJuly18,20032003年7月18日特别感谢下列为翻译此文件付出辛苦劳动的人：P1-28：郭家驹附件AEC-Q100-001～002：曹丽华附件AEC-Q100-003～004：张羽附件AEC-Q100-005～006：刘连玉附件AEC-Q100-007～009：邱鸿雁附件AEC-Q100-010～011:张蓓蓓AutomotiveElectronicsCouncilComponentTechnicalCommitteeTABLEOFCONTENTS内容表AEC-Q100StressTestQualificationforIntegratedCircuitsAEC-Q100集成电路的应力测试鉴定Appendix1:DefinitionofaQualificationFamily附录1:考核族的定义Appendix2:__Q100CertificationofDesign,ConstructionandQualification附录2:设计、结构和考核的Q100证明。Appendix3:PlasticPackageOpeningforWireBondTesting附录3:为键合(焊接)试验而打开的塑封体Appendix4:__MinimumRequirementsforQualificationPlansandResults附录4:考核计划和结果的昀低要求Appendix5:__PartDesignCriteriatoDetermineNeedforEMCTesting附录5:用来确定EMC测试需要的部分设计标准Attachment附件AEC-Q100-001:WIREBONDSHEARTEST键合剪切测试AEC-Q100-002:HUMANBODYMODEL(HBM)ELECTROSTATICDISCHARGE(ESD)TEST人体模型（HBM）静电放电（ESD）测试AEC-Q100-003:MACHINEMODEL(MM)ELECTROSTATICDISCHARGE(ESD)TEST机器模型(MM)静电放电（ESD）测试AEC-Q100-004:LATCH-UPTEST闩锁效应测试AEC-Q100-005:NONVOLATILEMEMORYWRITE/ERASEENDURANCE,DATARETENTION,ANDOPERATIONALLIFETEST固定存储器的写/擦耐久能力,数据保留能力及操作寿命的测试AEC-Q100-006:ELECTRO-THERMALLYINDUCEDPARASITICGATELEAKAGE(GL)TEST电热感应寄生门漏电测试AEC-Q100-007:FAULTSIMULATIONANDTESTGRADING故障模拟和测试分级AEC-Q100-008:EARLYLIFEFAILURERATE(ELFR)早期寿命失效率(ELFR)AEC-Q100-009:ELECTRICALDISTRIBUTIONASSESSMENT电分配评估AEC-Q100-010:SOLDERBALLSHEARTEST压焊球剪切测试AEC-Q100-011:CHARGEDDEVICEMODEL(CDM)ELECTROSTATICDISCHARGE(ESD)TEST带电器件模式(CDM)的静电放电（ESD）测试AEC-Q100-REV-FJuly18,2003AutomotiveElectronicsCouncilComponentTechnicalCommitteeAcknowledgment致谢Anydocumentinvolvingacomplextechnologybringstogetherexperienceandskillsfrommanysources.TheAutomotiveElectronicsCounselwouldespeciallyliketorecognizethefollowingsignificantcontributorstotherevisionofthisdocument:任何包含复杂技术的技术性文件的制定都离不开来自各方面的经验和能力。我们汽车电子委员特别对下面这些对此文件所做的努力的人士表示感谢：MajdiMortazaviBrianJendroRobertV.KnoellDetlefGriessmanMarkA.KellyGeraldE.ServaisNickLycoudesJeffParkerMarkGabrielleWilhemMayerJohnTimmsCraigNelsonXinMiaoZhaoKenBerryWernerKanertDonPeckoDaimlerChryslerDaimlerChryslerVisteonCorporationDelphiDelcoElectronicsSystemsDelphiDelcoElectronicsSystemsDelphiDelcoElectronicsSystems-RetiredMotorolaInternationalRectifierONSemiconductorContiTemicMotorolaACESCirrusLogicCirrusLogicHitachiInfineonXilinxAEC-Q100-REV-FJuly18,2003AutomotiveElectronicsCouncilComponentTechnicalCommitteeSTRESSTESTQUALIFICATIONFORPACKAGEDINTEGRATEDCIRCUITSTextenhancementsanddifferencesmadesincethelastrevisionofthisdocumentareshownasunderlinedareas.Severalfiguresandtableshavealsobeenrevised,butchangestotheseareashavenotbeenunderlined.升版时,除图表外,对所作修改作下划线提示.1.SCOPE范围Thisdocumentcontainsasetofstresstestsanddefinestheminimumstresstestdrivenqualificationrequirementsandreferencestestconditionsforqualificationofintegratedcircuits(ICs).UseofthisdocumentdoesnotrelievetheICsupplieroftheirresponsibilitytomeettheirowncompany'sinternalqualificationprogram.Inthisdocument,userisdefinedasallcustomersusingadevicequalifiedperthisspecification.Theuserisresponsibletoconfirmandvalidateallqualificationdatathatsubstantiatesconformancetothisdocument.Supplierusageofthedevicetemperaturegradesasstatedinthisspecificationintheirpartinformationisstronglyencouraged.该文件规定了ICs的应力试验内容,但供应商不能据此取代其内部生产控制标准.供应商根据此试验结果公布其器件的温度等级后,用户还有权利与责任进行温度等级核实,并承担器件选用的后果.1.1Purpose目的Thepurposeofthisspecificationistodeterminethatadeviceiscapableofpassingthespecifiedstresstestsandthuscanbeexpectedtogiveacertainlevelofquality/reliabilityintheapplication.通过应力试验,验证IC器件的质量与可靠性.1.2ReferenceDocumentsCurrentrevisionofthereferenceddocumentswillbeineffectatthedateofagreementtothequalificationplan.__Subsequentqualificationplanswillautomaticallyuseupdatedrevisionsofthesereferenceddocuments.目前使用该文件,今后若有升版,以更新的为准.1.2.1Military军用器件MIL-STD-883TestMethodsandProceduresforMicroelectronics1.2.2Industrial行业标准封装器件的可靠性:JEDECJESD-22ReliabilityTestMethodsforPackagedDevices塑封树脂的阻燃性:EIA/JESD78ICLatch-UpTestUL-STD-94TestsforFlammabilityofPlasticmaterialsforpartsinDevicesandAppliancesMSL评价:J-STD-020Moisture/ReflowSensitivityClassificationforPlasticIntegratedCircuitSurfaceMountDevicesajdiMortazavi_____________________DetlefGriessman_____________________RobertV.KnoellCopyright©2003byDaimlerChrysler,DelphiDelcoElectronicsSystems,andVisteonCorporation.Thisdocumentmaybefreelyreprintedwiththiscopyrightnotice.ThisdocumentcannotbechangedwithoutapprovalbytheAECComponentTechnicalCommittee.AEC-Q100-REV-FJuly18,2003Page1of28AutomotiveElectronicsCouncilComponentTechnicalCommittee1.2.3Automotive车用器件AEC-Q001GuidelinesforPartAverageTestingAEC-Q002GuidelinesforStatisticalYieldAnalysisAEC-Q003GuidelinesforCharacterizingtheElectricalPerformanceSAEJ1752/3IntegratedCircuitsRadiatedEmissionsMeasurementProcedure1.3Definitions术语1.3.1AECQ100QualificationAECQ100质量认证Successfulcompletionanddocumentationofthetestresultsfromrequirementsoutlinedinthisdocumentallowsthesuppliertoclaimthatthepartis“AECQ100qualified”.Thesupplier,inagreementwiththeuser,canperf