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当前位置:首页 > 商业/管理/HR > 质量控制/管理 > 碳化硅技术陶瓷无压烧结工艺研究
I论文题目:碳化硅技术陶瓷无压烧结工艺研究论文类型:应用型专业:本科生:(签名)指导老师:(签名)摘要碳化硅陶瓷具有诸多优异的性能,被广泛应用于许多领域,碳化硅陶瓷制备常用无压烧结工艺。无压烧结具有操作简单、成本低、可制备形状复杂和大尺寸的碳化硅部件,而且相对容易实现工业化等特点,因此无压烧结是碳化硅陶瓷制备中最有前途的烧结方法。本实验采用无压烧结,在α-SiC粉体中添加不同含量粒度为1µm的β-SiC,烧结助剂为碳化硼,粘结剂为酚醛树脂,保护气氛为氩气,烧结温度为2010℃,烧结时间为40min。分析烧结体的性能,确定烧结体性能最佳时的β-SiC添加量。实验结果表明:β-SiC添加量为10%wt时,烧结体体积密度最高,可达3.128g/cm3。初步确定最佳的β-SiC添加量为10%wt。关键词:无压烧结,α-SiC,β-SiC,固相烧结IISubject:StudyonTechnologyofPressurelesssinteringSiliconCarbideCeramicThesis:ApplicationSpecialty:InorganicnonmetalmaterialengineeringName:RuiDu(Signature)Instructor:XiaogangWang(Signature)ABSTRACTSiliconcarbideceramicwithexcellentpropertieshasbeenwidelyusedinmanyfields,pressurelesssinteringisthemostcommonlymethodofsiliconcarbideceramicpreparation.Withtheadvantageofsimpleoperation,lowcost,preparedforcomplicatedshapeandlargesizesiliconcarbidecomponents,andrelativelyeasytoimplementindustrializedfeatures,pressurelesssinteringisthemostpromisingmethodforpreparationofthesiliconcarbideceramic.Pressurelesssinteringisusedintheexperiment.Addingdifferentcontentofβ-SiCintoα-SiC,boroncarbideactsacsinteringaids,phenolicresinservesasbinder,argongasactsasprotectiveatmosphere,sinteringtemperatureis2010℃,sinteringtimeis40min.Analysisthepropertiesofsinteredbodyanddeterminethebestpropertiesofsinteredbodywithβ-SiCaddition.Theexperimentshowthatthevolumedensityofsinteredbodyisthehighestwith10%wtβ-SiCaddition,and3.128g/cm3isachieved.Sowecangettheoptimumβ-SiCadditionis10%wt.KEYWORDS:pressurelesssintering,α-SiC,β-SiC,Solid-phasesinteringI目录1前言........................................................................................................................................11.1碳化硅的简介................................................................................................................11.1.1碳化硅的起源及发展..........................................................................................11.1.2碳化硅的结构......................................................................................................11.1.3碳化硅的性能及应用..........................................................................................31.2碳化硅的粉体制备........................................................................................................31.3碳化硅陶瓷成型工艺....................................................................................................51.3.1注浆成型...............................................................................................................61.3.2可塑成型..............................................................................................................61.3.3等静压成型..........................................................................................................71.3.4模压成型..............................................................................................................71.4碳化硅的烧结工艺........................................................................................................71.4.1反应烧结..............................................................................................................81.4.2重结晶烧结..........................................................................................................81.4.3热压烧结..............................................................................................................8II1.4.4无压烧结..............................................................................................................81.5国内外研究现状及生产需要........................................................................................91.6研究内容......................................................................................................................102实验......................................................................................................................................112.1实验原料......................................................................................................................112.1.1碳化硅................................................................................................................112.1.2碳化硼................................................................................................................132.1.3酚醛树脂............................................................................................................142.1.4聚乙二醇............................................................................................................152.1.5四甲基氢氧化氨水溶液....................................................................................152.1.6油酸....................................................................................................................152.2实验设备......................................................................................................................162.3实验流程图..................................................................................................................172.4实验过程......................................................................................................................182.4.1浆料制备.............
本文标题:碳化硅技术陶瓷无压烧结工艺研究
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