EMC Product Roadmap - 20101126R1

InnovationGlobalizationDiversificationEMCProductIntroduction©2006CiscoSystems,Inc.Allrightsreserved.CiscoConfidentialPresentation_ID22EMCProductRoadmap2009201020112012EM-828HTgLowLossMaterialDk:3.9/Df:0.008MPQual.EM-370(D)HTgMidLossMaterialDk:4.1/Df:0.011Qual.MPFlipChipMaterialQual.ResearchResearchQual.MPEM-34XUltraLowLossEM-M1HTgHTCLMetalCore@3.0W/m-K(CTI:600)MPQual.EM-285B(L)MidTgHalogen-freeDust-freeLow-flowPrepregMPQual.:QualificationMP:MassProduction©2006CiscoSystems,Inc.Allrightsreserved.CiscoConfidentialPresentation_ID33ProductLine-upEM-827EM-320unfilledMid.TgPhenolicCuredHighTgPhenolicCuredEM-825EM-320(5)unfilledEM-285EM-370(5)EM-285B(L)Dust-freeLow-flowPrepregHighTgMid.TgEM-370Lead-freeHalogen-freeMidLoss+GreenLowLoss+GreenHighThermalConductivityEM-M1(3W/m-K)EM-MP(2W/m-K)HighTgEM-370Dk:4.4@1GHzDf:0.015@1GHzEM-370(D)Dk:4.1@1GHzDf:0.011@1GHzEM-828Dk:3.9@1GHzDf:0.008@1GHzHighTgEM-34XDk:3.5@1GHzDf:0.005@1GHzEM-285Dk:4.3@1GHzDf:[e-mail]BCZBC©2006CiscoSystems,Inc.Allrightsreserved.CiscoConfidentialPresentation_ID44ProductBenchmarkingDfValue&ScopebyCisco(@10GHz)DfValueScopebyIBMSPP(@1GHz)TgBenchmarkEMCProposedMaterialULstatusLocalproduction/=0.020Highloss0.020~0.023StandardLoss150IT-158/IT-180EM-825OKTWN+KS+ZS170370HREM-827OKTWN+KS+ZS0.015~0.020Standardloss0.015~0.020MiddleLoss150R1566EM-285OKTWN+KS+ZS170NPG-170TU-862HFEM-370OKTWN+KS+ZSFR-406N4000-6IS-415HE679GEL-190EM-370(D)Jan,2011TWN+KS+ZS0.010~0.015LowLoss0.008~0.015LowLoss170Megtron4N4000-13EPFR-408HREM-828OKTWN/=0.010Ultralowloss0.008VeryLowLoss170RO4350Megtron6EM-34XTBDTWN©2006CiscoSystems,Inc.Allrightsreserved.CiscoConfidentialPresentation_ID55CCLProperty(Regularlead-free)EMCProduct/ULCodeEM-320(5)EM-320EM-825EM-827Resin/HardenersystemDicy-freeDicy-freew/fillerTg(ºC)DSC150178150175T-260(min)unclad60606060T-288(min)unclad25302530Td(ºC),2%Wt.loss335345330345Td(ºC),5%Wt.loss340350340350CTE(%)(50~260ºC)3.73.03.22.61,beforeTg2,after(ppm/°C)60300552905026045260Dielectricconstant@1GHzunderRC:50%4.14.14.34.2Dissipationfactor@1GHzunderRC:50%0.0170.0230.0160.019Waterabsorption%0.140.140.100.12ConformancetoIPC-4101Cslashsheet/101/129/99/126EquivalentMaterialsNATurbo370IT-180NP175IT-158S1000370HR©2006CiscoSystems,Inc.Allrightsreserved.CiscoConfidentialPresentation_ID66CCLProperty(Halogen-free)EMCProduct/ULCodeEM-285EM-370(5)EM-370EM-370(D)EM-828Resin/HardenersystemHalogen-freew/fillerMidLossMidLossMidLossMidLossLowLossTg(ºC)DSC(orTMA*)150*150175175170T-260(min)unclad6060606060T-288(min)unclad6060606030Td(ºC),2%Wt.loss355355365370350Td(ºC),5%Wt.loss360385385385380CTE(%)(50~260ºC)3.02.62.12.22.61,beforeTg2,after(ppm/°C)5025040190401904020050250Dielectricconstant@1GHzunderRC:50%4.34.34.44.13.9Dissipationfactor@1GHzunderRC:50%0.0110.0130.0150.0110.008Waterabsorption%0.080.110.160.100.07ConformancetoIPC-4101Cslashsheet/128/128/130/130/130EquivalentMaterialsR1566E-67GNPG150NPG170HE679GIS-415M-4N-13EPFR-408HR©2006CiscoSystems,Inc.Allrightsreserved.CiscoConfidentialPresentation_ID77ComparisonofWaterAbsorption0.10.150.20.250.30.350.40.450.50.550.612345MoistureAbsorption(%)PCTTreatedTime(hrs)Hi-TgDicyCured,NCompanyMid-TgPNCuredwithFiller,EM-825Hi-TgPNCuredwithFiller,EM-827Hi-TgHF,EM-370Hi-TgHF(FR-4Dk),EM-370(D)Hi-TgLowLoss,EM-8281.6mmunclad©2006CiscoSystems,Inc.Allrightsreserved.CiscoConfidentialPresentation_ID88LowCTE/HighTgFR-4withHighHeatResistanceandLeadFreeCompatibleEM-827/EM-827B©2006CiscoSystems,Inc.Allrightsreserved.CiscoConfidentialPresentation_ID990.05.010.01GHzDfZaxisCTET288(Clad)TdWaterabsorptionEM-827PITTypicalLaminateProperties–EM-8279Corethickness:59mil(7628×8)TestitemScore0~10EM-827PITDf,1GHz(IPCTM-650,2.5.5.9)0.023~0.0160.0190.0180.0190.018ZaxisCTE(%)(IPCTM-650,2.4.24)3.5~2.02.62.92.82.8T288clad(min)(IPCTM-650,2.4.24.1)0~302752027Td5%loss(℃)(IPCTM-650,2.4.24.6)310~360350320340342Waterabsorption(%)E-1/105+D-24/23(IPCTM-650,2.6.2.1)0.5~0.00.120.170.170.17Scoretotal36.321.429.633.8©2006CiscoSystems,Inc.Allrightsreserved.CiscoConfidentialPresentation_ID1010PCBEvaluationofEM-827(HighLayerCount)ApplicationLayerCountThickness(mm)BGAholepitch(mm)TestConditionIST500Cycles(Holepitch:0.8mm)288℃*10sec*3cycle+IRreflow(peak260℃)5cyclePCBTestVehicle243.40.8PASSPASSSunMicrosystems205.8--PASSNokiaSiemensNetworks285.01.0-PASSHCompany345.01.0-PASS©2006CiscoSystems,Inc.Allrightsreserved.CiscoConfidentialPresentation_ID1111PCBEvaluationofEM-827(HighLayerCount)1120Layer24Layer34Layer28Layer©2006CiscoSystems,Inc.Allrightsreserved.CiscoConfidentialPresentation_ID1212EM-827(HDPUG20L)1220layers(120mils)•Nodelaminationfoundafter6x260℃reflow•Cansurvive300cyclesof-40℃~+135℃air-to-airthermalcyclingwithpre-conditionof6x260℃reflow•Canpass1000ISTcycles(Holepitch:1.0mm)HozCufoilHozCufoil1x10802x10805mil(1x2116)1oz/1ozcore5mil(1x2116)1oz/1ozcore5mil(1x2116)1oz/1ozcore2x10802x10805mil(1x2116)1oz/1ozcore2x10805mil(1x2116)1oz/1ozcore2x10805mil(1x2116)1oz/1ozcore2x10805mil(1x2116)1oz/1ozcore2x10805mil(1x2116)1oz/1ozcore2x10805mil(1x21