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上海交通大学硕士学位论文光电板尺寸稳定性流程控制姓名:岳增全申请学位级别:硕士专业:工业工程指导教师:吴祖育;陈一鸣20071201ILCD(LiquidCrystalDisplay)PCB(PrintedCircuitBoard)PCBITPCB()CpK1.0DOE(DesignofExperiment)PCBPCB0.8SPC(StatisticalProcessControl)CpK1.33PCBSPCDOECpKAbstractIIAbstractLCDPCBisthePCBmainlyusedforLCD,whichhasprecisesizerequirement.DuetothattheNBgoescheaperandcheaperandthatthetraditionaldisplaywillbeabandonedforthesakeofradiationtohealth,LCDisusedinmoreandmoreapplications,consequentlytherequirementforPCBbecomeslargerandlarger.PCBindustryisonewithmanydecadesofhistory,butwiththedevelopmentofITindustry,therequirementtoPCBbecomesmuchstricter.NowalotoffactoriesareengagedinmassproductionofLCDPCB,butfewofthemcouldproducesatisfactorysizeconditions.SomePCBshopsspecializedinLCDPCBintheindustry(includingourcompetitors)couldnotyetyieldexcellentconditions,thesizecapabilityindex---CpKgoesbelow1.0andisnotstableenough.TheessayandsynthesizesthewholemanufacturingflowofPCB(usingDOEmethod),findsoutthekeyfactorofsizevariation,accommodatestheequipment,amendsrelatedparametersandfinallyachievesthestablesize(CpKabove1),thuslaunchesthemassproductionofLCDPCBsuccessfully.Firstlytry-runasmallvolumeandfindsoutandresolvesthevariationfactorofexposureprocess,whichgetsCpKabove0.8andmakesthelargevolumeproductionachievable.ThenadopttheTQMconceptinmassproduction,withthetotalmonitoringofSPCtoolstomanufacturingflow,continuouslyimprovethesizeconditions,andintheendkeeptheCpKabove1.33,thatis,themassproductiongetsintothestableperiod.KeyWords:PCB,SPC,SizeControl,DOE,capabilityindex,CpK11.1PCBPCB(PrintedCircuitBoard)PCBPCBPCB11PCBFig1ThesimplemodelofPCBPCBPCBPCBPCBITPCBPCBPCBPCBLCD()PCBPCBPCBPCB()PCB21.2PCB21200660%PCB3~4PCBPCBCRTCRTPCB()PCBPCBJZ(Z)CpK1.01.3PCBPCBFR-4PCBDOE(DesignofExperiment)PCB0.8SPC(StatisticalProcessControl)CpK1.333()()PCB1PCB2.12.1.1(PTFETEFLONB(a).1910Bakelite(b).183023FR-4(c).FR-4NovolacNovolacEpoxyNovolacsFR-4(d).PolyimidePIFR-4504FR-4Tg(GlassTransitionTemprature)130180-190260FR-4PCBFR-42~3(e).3MPCB4(f).BT/EPOXYBT1980BGA1960Bayer51970PCB20806Tg2502.1.2PCBOwen-IllinoisCorningGlassWorksOwens-CorningFiberglasCorporation1939()7ACESPCBEPCB2.21.0Ounce(OZ)1OZ(28.35g)34(micron)1.35mil(mil1mil25.4um)PCB1/4OZ1/2OZ1/2OZ1OZ2OZ1OZ1/2OZPCBFPC(FlexiblePrintedCircuit)PCB52.32.3.1111FR-42.3.2PCBPCB2.4MM-1FR-4UL(UnderwritersLaboratories)FR-4PCB---7628/2116/10804M558.8mmX558.8mm508mm262Fig2Sizechangingtestmodel2FR-420262422(:mm)2(ppm/)3733FR-410802116762814~17ppm/16~17ppm/FR-483.1PCB1OZ(L2/L3)0.5OZ(L1/L4)L1L2L3L40.11mm33Fig3PCBstructuremodelPCBWorkingPanel(PCB)PCBWorkingPanel3.2CAM(ComputerAidedManufacturing)ACF(AnisotropicConductiveFilm)0.3mm300mmACF0.07mm494Fig4Sizeoftwoopticalmark4ACFPCBWorkingPanel10X1WorkingPanel5Panel1055WorkingPanelFig5ShippingpanellocationonworkingpanelCAM6106Fig6Manufactureflowchart3.325WorkingPanelWorkingPanel44PCB(mm)1328.020327.998327.929327.924327.942327.9252328.018327.965327.924327.923327.924327.9703327.999327.962327.926327.910327.961327.9854327.981327.972327.918327.919327.918327.9555328.016327.998327.967327.921327.922327.9806327.983327.987327.920327.954327.928327.9587327.986328.008327.938327.916327.915327.9438328.024327.983327.952327.961327.972327.9309328.020328.014327.965327.926327.897327.94210328.027327.991327.944327.965327.978327.99311328.029327.987327.967327.963327.961327.92812328.029328.060327.908327.961327.991327.98213328.016327.979327.965327.965327.953327.90814328.035327.969327.923327.964327.968327.97815327.971327.975328.012327.961327.963327.99016327.995328.015327.976327.969327.988327.95117328.055328.005328.006327.957327.957327.97118328.022328.008327.971327.956327.966328.0021119327.948327.955327.960327.997327.941327.95420327.993328.048327.983327.957327.979327.96421328.058328.005327.976327.923327.976327.92322328.017328.028327.966327.898327.918327.96623327.956328.051327.983327.989328.008327.91724327.971328.006327.975327.918327.920327.98425328.036328.025327.928328.008327.963327.990avg.328.008328.000327.955327.948327.952327.960PCB77PCBFig7SizechangeinPCBmanufactureprocess7PCB0.07mmACFPCBPCBPCBPCBACFPCBPCBSMTPCBPCB8123020~30PCB9PCB20PCB481224489655SMT(mm)4H8H12H24H48H72H96H1327.951327.904327.920327.931327.929327.944327.951327.9332327.987327.911327.869327.868327.904327.922327.914327.9513327.927327.909327.928327.933327.944327.916327.947327.9434327.984327.915327.923327.928327.945327.949327.946327.9565327.905327.906327.919327.881327.936327.886327.962327.9506327.951327.903327.908327.928327.933327.938327.900327.9397327.972327.875327.939327.928327.941327.946327.909327.9408328.007327.909327.913327.888327.959327.941327.931327.9489327.956327.905327.944327.936327.900327.972327.944327.90210327.961327.912327.935327.947327.887327.898327.934327.97411327.923327.926327.896327.884327.977327.910327.924327.91212327.978327.886327.892327.900327.891327.890327.897327.91013327.981327.916327.929327.944327.958327.961327.952327.96214327.989327.935327.866327.929327.937327.966327.969327.92415327.958327.891327.904327.953327.969327.899327.925327.96916327.976327.886327.956327.948327.8
本文标题:光电板尺寸稳定性流程控制
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