PCB废水分类及特性

WritebysunchengPCB废水分类与特性日东电工集团美国海德能公司Writebysuncheng目录•PCB制程简介；•PCB工艺环节分类(干制程、湿制程)；•PCB工艺环节废水描述；•PCB废水分类及特性；•水质分析与膜堵塞。WritebysunchengPCB制程简介WritebysunchengPCB制程简介1WritebysunchengPCB制程简介2WritebysunchengPCB制程简介3WritebysunchengPCB制程简介4WritebysunchengPCB制程简介5WritebysunchengPCB制程简介6WritebysunchengPCB制程简介7Writebysuncheng单面板生产工艺流程图刷磨油墨烘干蚀刻裁板钻孔刷磨防焊烘干去墨喷锡文字成型镀镍金Writebysuncheng双面板(正片)生产工艺流程图钻孔刷磨化学铜全板镀铜裁板膜墨曝光烘干显像线路镀铜刷磨去膜墨蚀刻退锡铅镀锡铅刷磨刷磨镀镍金重熔防焊防焊刷磨镀镍金喷锡文字成型锡铅镀金板喷铅镀金板Writebysuncheng多层板(含负片)生产工艺流程图钻孔裁板双面铜箔膜墨线路镀铜刷磨去膜墨蚀刻镀锡铅膜墨蚀刻去膜墨黑棕化刷磨叠板层压胶片/铜箔除胶渣化学铜全板镀铜刷磨退锡铅刷磨镀镍金重熔防焊刷磨防焊刷磨镀镍金喷锡文字成型锡铅镀金板喷铅镀金板WritebysunchengPCB工艺环节分类(干制程/湿制程)WritebysunchengPCB工艺环节分类——干式制程•按是否使用水PCB的制程分为：干式制程和湿式制程；序号制程名称废弃物1裁板废边料废铜箔护膜废垫/盖板钻屑报废板2干膜压合3叠板层压4钻孔5成型裁边WritebysunchengPCB工艺环节分类——湿式制程制程名称废弃物制程名称废弃物化学铜倒缸液/清洗液除胶渣倒缸液/清洗液全板镀铜倒缸液/清洗液蚀刻酸碱蚀刻清洗液线路镀铜倒缸液/清洗液退锡铅倒缸液/清洗液镀锡铅倒缸液/清洗液干膜油墨干膜油墨液镀镍金倒缸液/清洗液去干膜油墨干膜油墨液喷锡倒缸液/清洗液防焊绿油/清洗液刷磨铜粉清洗液文字油墨/清洗液黑棕化倒缸液/清洗液成型清洗脱脂废液清洗液WritebysunchengPCB工艺环节废水描述Writebysuncheng化学沉铜、全板镀铜制程水洗酸洗水洗水洗预活化活化水洗水洗加速洗水洗水洗化学铜水洗水洗水洗微蚀水洗水洗镀铜热水洗整孔水洗水洗还原氧化水洗水洗热水洗膨胀剂硫酸硫酸铜氯化亚锡盐酸氯化亚锡氯化钯盐酸硫酸氟酸类硫酸铜甲醛螯合剂硫酸过硫酸氨双氧水过硫酸钠硫酸硫酸铜氯化纳整孔剂有机溶剂或表面活性剂高锰酸钾硫酸氢氧化钠铬酸过氧化氢碱性醇醚类溶剂倒缸废液PHCu倒缸废液倒缸废液PHSnPd倒缸废液PHSn倒缸废液PHCODCuPHCOD倒缸废液PHCODCu倒缸废液PHCOD倒缸废液CrMn倒缸废液倒缸废液PHCODPHCOD倒缸废液无排水回用不回用Writebysuncheng线路镀铜制程脱脂水洗水洗微蚀水洗水洗酸洗水洗水洗镀铜水洗水洗酸性清洁剂硫酸过硫酸氨双氧水过硫酸钠硫酸硫酸硫酸铜氯化纳氧化剂倒缸废液PHCODCu倒缸废液PHCu倒缸废液PHCuCOD倒缸废液PHCuCOD无排水回用不回用Writebysuncheng镀锡铅制程剥挂架水洗水洗水洗预浸酸镀锡铅硝酸氟硼酸铅锡氨基磺酸铅锡氟硼酸氨基磺酸PHSnPb倒缸废液PHSnPbBFPHCODBF不倒缸无排水回用不回用Writebysuncheng内/外层影像转移前处理刷磨制程酸洗水洗刷磨中压水洗中压水洗中压水洗水洗挤干吹干烘干硫酸倒缸废液PHCu含铜粉屑PHCu无排水回用不回用Writebysuncheng外层剥膜、蚀刻及剥锡铅制程剥膜水洗中压水洗水洗蚀刻氨水洗水洗水洗剥锡铅水洗水洗挤压烘干NaOH氯化铵氨水氨水硝酸双氧水氟化氨倒缸废液PHCODPHCODPHCOD倒缸废液PHCu氨水PHCuSnPbPHCuSnPbPHCuSnPb无排水回用不回用Writebysuncheng镀镍金制程刷磨水洗微蚀水洗水洗酸洗水洗镀镍水洗水洗酸洗水洗镀金回收水洗水洗吹干硫酸硫酸钠双氧水过硫酸钠硫酸氨基磺酸镍硫酸氰化金钾SSCuSSCu倒缸废液PHCuPHCuPHCu不倒缸PHNiCODPHCuPHCu不倒缸含氰废液CN无排水回用不回用Writebysuncheng喷锡制程刷磨水洗微蚀水洗酸洗水洗水洗吹干助焊剂喷锡硫酸硫酸钠双氧水过硫酸钠硫酸有机卤化物锡条SSCuSSCu倒缸废液PHCuPHCuPHCu废助焊剂锡渣无排水回用不回用Writebysuncheng喷锡后处理制程冷却水洗刷磨水洗水洗热水洗SSCuSSCuSSCu无排水回用不回用Writebysuncheng防焊绿油前处理刷磨制程酸洗水洗刷磨中压水洗中压水洗水洗挤干吹干烘干硫酸倒缸废液PHSSCuSSCu无排水回用不回用Writebysuncheng防焊绿漆显像制程显像显像中压水洗中压水洗中压水洗中压水洗水洗吹干烘干硫酸PHCODPHCODPHCODWritebysuncheng内/外层影像制程显像显像水洗水洗水洗水洗吹干吹干硫酸倒缸废液倒缸废液PHCODWritebysuncheng内层蚀刻去墨(或剥膜)制程蚀铜蚀铜水洗水洗水洗水洗去墨剥膜去墨剥膜水洗刷磨水洗水洗挤干吹干烘干氯化铜氯化铁氢氧化钠倒缸废液PHCu倒缸废液PHCODPH铜粉PHCuWritebysuncheng绿漆退洗制程退洗清洁剂水洗有机溶剂NaOH碱性清洁剂PHCODPHCODPHCODWritebysuncheng去毛边制程刷磨高压水洗水洗水洗挤压吹干吹干含铜粉屑含铜粉屑PHCuWritebysuncheng成型清洗制程水洗脱脂热水洗中压水洗中压水洗水洗挤压吹干烘干清洁剂CODPHCODCODWritebysunchengPCB废水分类及特性Writebysuncheng倒缸槽液1Writebysuncheng倒缸槽液2Writebysuncheng倒缸槽液3Writebysuncheng倒缸槽液4Writebysuncheng难溶盐的容度积1序号分子式Ksp序号分子式Ksp(No.)(No.)1BaCO35.1×10-929MgCO33.5×10-82BaCrO41.2×10-1030MgCO3·3H2O2.14×10-53Ba3(PO4)23.4×10-2331Mg(OH)21.8×10-114BaSO41.1×10-1032Mg3(PO4)2·8H2O6.31×10-265NiCO36.6×10-933Au(OH)35.5×10-466Ni(OH)2(新)2.0×10-1534AuCl33.2×10-257Ni3(PO4)25.0×10-3135AuI31.0×10-468CuBr5.3×10-936PbCl21.6×10-59CuCl1.2×10-637PbCO37.4×10-1410CuCN3.2×10-2038PbCrO42.8×10-1311CuCO32.34×10-1039PbF22.7×10-812CuI1.1×10-1240Pb(OH)21.2×10-1513Cu(OH)24.8×10-2041Pb(OH)43.2×10-6614Cu3(PO4)21.3×10-3742Pb3(PO4)38.0×10-4315Cu2S2.5×10-4843PbS1.0×10-2816CuS6.3×10-3644PbSO41.6×10-8Writebysuncheng难溶盐的容度积2序号分子式Ksp序号分子式Ksp(No.)(No.)17MnCO31.8×10-1145SrCO31.1×10-1018Mn(OH)41.9×10-1346SrF22.5×10-919MnS(粉红)2.5×10-1047Sr3(PO4)24.0×10-2820MnS(绿)2.5×10-1348SrSO43.2×10-721CaCO32.8×10-949FeCO33.2×10-1122CaF22.7×10-1150Fe(OH)28.0×10-1623Ca(OH)25.5×10-651Fe(OH)34.0×10-3824Ca3(PO4)22.0×10-2952FePO41.3×10-2225CaSO43.16×10-753FeS6.3×10-1826Sn(OH)21.4×10-2854Cr(OH)36.3×10-3127Sn(OH)41.0×10-5628SnS1.0×10-25Writebysuncheng阳离子类(含重金属)离子名称问题离子名称问题Ca钙结垢Cu铜结垢Mg镁结垢Ni镍结垢Mn锰结垢、催化氧化Au金结垢Fe铁结垢、催化氧化Cr铬结垢、氧化Ba钡结垢Sn锡结垢Sr锶结垢Pb铅结垢Writebysuncheng阴离子类离子问题离子问题CO3天然水含有，低PHS——SO4无法控制，大量存在CN禁混入OH控制PH在酸性条件Cl天然水含有，低PHF禁退锡铅清洗液混入PO4——Writebysuncheng常见化合物的化学需氧量化合物示性式CODCr氧化率%CODMn氧化率%乙酸CH2COOH96.37甲醛CH2O46.68丙酮CH3COCH3860甲醇CH3OH9626.9乙酸乙酯CH3COOC2H578.64苯C6H617.30甲苯C6H5CH322.71GB/T11914-1989WritebysunchengPCB中的COD污染物名称问题名称问题干膜堵塞膜,禁回用非1*不堵塞膜,回用油墨堵塞膜,禁回用阴1*不堵塞膜,回用油脂堵塞膜,禁回用EDTA不堵塞膜,回用两1*堵塞膜,禁回用溶剂类不堵塞膜,回用阳1*堵塞膜,禁回用有机酸不堵塞膜,回用1*表面活性剂Writebysuncheng蚀刻后的铜氨络合废水•因络合铜的存在，碱性条件下的不结垢(溶解度增大)；•浓缩过程中NH3(气体分子)会渗透扩散过RO膜；•溶解性的盐类Cu2+(水合离子)会被RO拦截浓缩；•在RO的浓水侧NH3(气体分子)和Cu2+(水合离子)比例缩小；•最终导致Cu(OH)2沉淀出现；•气体的透过会导致产水电导率上升；•碱性氨水蚀刻后清洗水禁直接回用；WritebysunchengPCB废水汇总Writebysuncheng归纳后PCB不回用工艺环节机械处理沉铜板面电镀外层线路蚀刻退锡防焊喷锡镍金银成型退膜图形电镀无水无水倒缸水禁直回倒缸水禁直回油墨水禁直回倒缸水禁直回高有机禁直回碱性氨类禁直回磨板油墨水禁直回倒缸水禁回Writebysuncheng水质分析与膜堵塞WritebysunchengPCB中的COD污染物物质问题金属离子难溶盐结垢(阳/两)有机物吸附、堵塞(干膜/油墨)有机物粘附、堵塞油脂类有机物粘附、堵塞无机SS堵塞(Fe/Mn/Cr)催化氧化/氧化